The demand for AI computing power remains high, with technology giants increasing their investments. The 2025 Yunqi Conference is being held today in Hangzhou, where Alibaba is actively promoting the construction of AI infrastructure worth 380 billion yuan and plans to make even larger investments.
The supply of PCBs is tightening, driven by the upgrade of AI server chips, which has led to a surge in demand for high-end PCBs. The value of HDI (High-Density Interconnect) high power density interconnect boards in AI servers continues to rise.
PCB Raw Materials
• Electronic Copper Foil: Nord Technology, Defu Technology, Copper Crown Copper Foil
• Epoxy Resin: Dongcai Technology, Hongchang Electronics, Shengquan Group
• Glass Fiber Cloth: Honghe Technology, China Jushi, China National Building Material Group
• Copper Clad Laminate: Jinan Guoji, Shengyi Technology, Ultrasonic Electronics
• Equipment and Consumables: Dazhu CNC, Chipone Microelectronics, Dingtai High-tech
PCB Manufacturers:
• Shenghong Technology: Has achieved industrialization of 5-stage 20-layer HDI products with full orders.
• Jingwang Electronics: The company is on Nvidia’s list of qualified suppliers.
• Kexiang Co., Ltd.: Capable of mass production of any-layer interconnect boards up to 14 layers, with full orders for high-end server PCBs.
• Zhongjing Electronics: Capable of mass production of any-layer interconnect boards from 14 to 18 layers.
• Shengyi Electronics: Successfully produced multiple PCBs for AI servers.
• Founder Technology: Specializes in the R&D of PCBs, including high-density interconnect boards.
• Shennan Circuit: Has HDI production capabilities including any-layer interconnect.
• Bomin Electronics: Products include high-density interconnect HDI boards.
