Thermal Structural Analysis of Printed Circuit Boards!

Thermal Structural Analysis of Printed Circuit Boards!

Printed Circuit Boards (PCBs) are ubiquitous in electronic devices and other related applications. Generally, PCBs are made of multiple layers of laminated materials and resin bonded together. These layers embed conductive metal components and metal vias that pass vertically through these layers. In Finite Element Analysis (FEA), the body and traces in a PCB are … Read more

Summary of Low Power Design Methods for FPGAs

Summary of Low Power Design Methods for FPGAs

Accurate thermal analysis plays a crucial role in the design of many electronic products, particularly in high-end PCB design. The results of thermal analysis often influence the mechanical layer design of the PCB and the product’s enclosure: whether to install heat sinks, cooling fans, etc. If a cooling fan is installed, it often needs to … Read more

Optimization Design of Mold Cooling Channels with Lattice Structures

Optimization Design of Mold Cooling Channels with Lattice Structures

Optimization Design of Mold Cooling Channels with Lattice Structures Chuzhong, Zhao Caoxi, Kang Hui, Ni Zihan, Li Zhitong, Zhang Jicong (School of Mechanical Engineering, Shanghai University of Applied Technology, Shanghai 201418) First Author: Chuzhong (1967—), Male, Associate Professor, Engaged in mold CAD/CAM research, [email protected] Corresponding Author: Zhao Caoxi (1999—), Male, Master’s Student, Engaged in industrial … Read more