The integrated circuit design field is facing a severe reality. Only about 20% of ASIC chips succeed on their first tape-out. A significant reason for the high failure rate is that the challenges brought by new process nodes have not been fully understood. While some long-standing issues have been integrated into design tools and processes, … Read more
In the complex landscape of chip manufacturing, tape-out occupies a core position. As the final step in integrated circuit design, it is a crucial process that transforms abstract circuit blueprints into actual chips. 1. The Connotation and Essence of Tape-Out Tape-out, expressed in English as “tape-out”, is a process that relies on a series of … Read more
(This article is translated from Semiconductor Engineering) As the complexity of chips continues to increase, chip manufacturers are shifting from single-chip designs to multi-chip components, requiring more iterations, and the increasing level of customization makes design and verification work more time-consuming. Consequently, the first silicon tape-out success rate is sharply declining. Details from a new … Read more