Introduction to Semiconductor Packaging (8): Underfill Process
In the previous article of this packaging series, I introduced the chip-on-board process. Here, I will provide a brief overview of another “unassuming” process in semiconductor packaging—Underfill.In the semiconductor packaging system, Underfill is a very inconspicuous yet crucial process (in fact, every process is important…). Whether it is Flip-Chip, 2.5D CoWoS, or the latest 3D … Read more
