Contents of Integrated Circuits and Embedded Systems, Issue 9, 2025

Contents of Integrated Circuits and Embedded Systems, Issue 9, 2025

Integrated Circuits and Embedded Systems, 2025Issue 9 is out now! Featured Article Application and Key Challenges of Glass Core Substrates for Chip Integration Chen Changhao, Xu Shimen, Lin Pengrong Research Papers Development Research on Asynchronous Circuit Chips for High-Performance Computing Wen Li, Zhang Yueyang, Zhang Shenghai Real-Time Optimization Research of FreeModbus Protocol Stack DMA Driver … Read more

Weekly Insights June 16 | The First AI Chip Design System’s CPU “Enlightenment 1” Completes Tape-Out; Meituan’s Drone Delivery Service Normalizes Operations in Hong Kong

Weekly Insights June 16 | The First AI Chip Design System's CPU "Enlightenment 1" Completes Tape-Out; Meituan's Drone Delivery Service Normalizes Operations in Hong Kong

Insights | Tracking Trends, Identifying Logic, Discovering Opportunities 2025.06.16 Hot Topics This week’s keywords: 【Accelerating the Commercialization of Technology】 The CPU “Enlightenment 1”, based on the world’s first AI chip design system, has completed tape-out. The first pilot line for photonic chips in China (Wuxi) has produced 6-inch thin-film lithium niobate wafers. Longi’s perovskite tandem … Read more