Analysis of Trends in Smart Cockpit SoC Chip Applications

Author | Chen Kangcheng

Produced by | Yanzhi Auto

With the continuous development of automobile intelligence, the level of intelligence in the cockpit is also increasing. The cockpit has evolved from the initial mechanical cockpit to the electronic cockpit, and now to the smart cockpit. For users, the display and interaction inside the cockpit have undergone more intuitive “explicit” changes, while the integration of cockpit and driving can be regarded as a key “implicit” change.

• In-Cockpit Display: In the era of electronic cockpits, the cockpit featured small central control displays and physical pointer dashboards. Now, the central control screen and dashboard in the cockpit are basically large full-LCD digital screens. Some high-end cockpits even add AR-HUDs, streaming media displays, rear entertainment screens, etc. In short, the in-car display screens present multi-screen, large screen, and high-definition characteristics.

• In-Cockpit Interaction: The interaction methods in the cockpit have become diversified. Traditional electronic cockpits mainly interacted through physical buttons, but now there are fewer physical buttons in the cockpit, and touch buttons, voice interaction, gesture control, and other multimodal interaction methods have become mainstream.

• Integration of Cockpit and Driving: The cockpit and intelligent driving were originally two independent parts, but now the integration between the cockpit and intelligent driving is increasing, gradually evolving from “cockpit-parking integration” to “cockpit-driving integration”.

1. Current Application Status of Smart Cockpit SoC Chips

Currently, the configuration level of smart cockpits has become one of the important reference indicators for consumers when purchasing cars. Similarly, smart cockpits are also a key area for OEMs to create differentiation and brand influence. As the functions integrated into the cockpit increase, the hardware resources and computing power required will also be higher, and high-performance SoC chips will become a necessity for smart cockpits.

At present, the market share of smart cockpit SoC chips is mainly concentrated in a few overseas chip companies, including Qualcomm, Renesas, Intel, NXP, and TI. Globally, in 2022, Qualcomm’s cockpit SoC chip had the highest market share at 43.4%; Renesas ranked second with 19.7%; Intel ranked third with 18.16%. The top three accounted for over 80% of the market share, indicating a highly concentrated market for smart cockpit SoC chips.

2022 Global Cockpit SoC Chip Market Share Distribution

According to relevant statistical data, in 2022, the number of smart cockpit SoC chips installed in new cars in China was 7.005 million, with a market size of $1.486 billion, accounting for approximately 48% of the global total market share (the global smart cockpit SoC chip market size is $3.092 billion). It is expected that by 2025, the penetration rate of smart configurations in global and Chinese automotive cockpits will reach 59% and 78%, respectively, and the global smart cockpit SoC chip market size will exceed $5 billion.

From the relevant data, it can be seen that although China’s market share of smart cockpit SoC chips is relatively high, the market share of domestic cockpit SoC chips is not high, less than 10%. Domestic cockpit SoC chip manufacturers started relatively late, but they currently have advantages in timing (the rapid development of the domestic new energy vehicle industry) and location (the trend of domestic chip replacement), indicating significant market growth potential in the future.

2. Analysis of Market Demand for Cockpit SoC Chips

What kind of cockpit SoC chips are currently needed in the market, and what determines the demand? Generally speaking, the demand for cockpit SoC chips is mainly determined by two factors: technological application trends and product positioning. Technological application trends determine the “macro demand” for cockpit SoC chips, while product positioning determines the “exclusive demand” for cockpit SoC chips in specific market segments.

2.1 Trends in Smart Cockpit Technology Applications

1) In-Cockpit Display: One Chip for Multiple Screens

In traditional cockpit solutions, central navigation, dashboard, HUD, and other systems operate independently, each controlled by separate ECUs, meaning a single ECU drives a single function/system. As the integration of the cockpit has increased, the originally distributed ECUs related to the cockpit have been integrated into one cockpit domain controller. The most intuitive manifestation is “one chip for multiple screens,” where a single high-performance SoC chip in the cockpit domain controller drives multiple screens such as the central navigation screen, LCD dashboard, HUD, air conditioning display panel, passenger entertainment screen, and rear entertainment screens.

From “one chip one screen” to “one chip multiple screens”

The requirements for SoC chips in the “one chip multiple screens” solution include: Having enough DP or DSI interfaces to drive several different display devices simultaneously; strong CPU capability to ensure smooth operation of multiple apps on different devices; high GPU graphics processing ability and video encoding/decoding capability, which determine the clarity of screen display and the smoothness of animations; additionally, the hardware needs to adequately support Hypervisor or hardware isolation to better support multi-system operation.

It is reported that a representative domestic cockpit SoC chip manufacturer, Chipone Technology, has launched its latest generation cockpit chip, X9SP, which can support multiple operating systems while driving output to multiple screens such as the dashboard, central entertainment screen, electronic rearview mirror, HUD, etc., and supports multi-screen sharing and interaction. How does Chipone’s X9SP chip support stable operation of multiple operating systems while ensuring the integrity and independence of each operating system?

Chipone’s CTO, Sun Mingle, told Yanzhi Auto: “This involves the design of the chip architecture and the deployment of software. It is necessary to consider how to manage the entire system’s resources under multi-system conditions. Chipone uses a hardware isolation method on the X9SP, where Linux or QNX operating systems run on the dashboard, and the Android operating system runs on the central control. The two systems have no interdependence and independently enjoy their hardware resources, allowing for independent startup. At the same time, some resources on the chip can be shared, such as network and storage (DRAM, EMMC), and the two systems can also interact. When designing the system, it is important to manage shared resources well, ensuring good resource sharing without affecting other resources or users. From a design perspective, we need to do a good job in chip architecture and underlying software aspects.”

Currently, running multiple operating methods on a hardware platform usually has two solutions: Hypervisor and hardware isolation. The Hypervisor technology solution theoretically allows upper applications to flexibly call lower hardware resources, enabling full utilization of hardware resources. In contrast, hardware isolation allocates inherent hardware resources to each module, ensuring that there are no “disputes” in resource usage and enhancing the security of each system’s operation.

Running multiple operating systems on the same computing platform based on Hypervisor technology

However, does using hardware isolation lead to waste of hardware resources? Sun Mingle believes that, “The biggest benefit of virtualization is that CPU and GPU hardware resources can be flexibly allocated among multiple systems. However, virtualization has a significant challenge: since its resources are shared, ensuring stable system operation is quite challenging. For instance, if the central control runs a heavy application, it may occupy a lot of CPU and GPU resources for an extended period, and the virtualization system needs to ensure that enough CPU and GPU resources are preserved for the dashboard system to maintain stable refresh rates.”

“Additionally, although virtualization theoretically allows dynamic allocation, in practice, designers still tend to allocate resources fixedly. The granularity of fixed allocation is more flexible than using hardware isolation. Although using hardware isolation sacrifices some system flexibility, system design becomes easier, mass production is quicker, and costs are lower.”

To better support the implementation of the “one chip multiple screens” solution, the X9SP chip has a built-in independent safety island, integrating a dual-core lock-step Cortex-R5F CPU with a frequency of up to 800MHz, eliminating the need for an external MCU, thereby achieving the entire cockpit function with a single chip. What is the main purpose of the independent safety island built into the X9SP? Is it to replace the external MCU? Sun Mingle explains: “In the X9 series chips, the function of the safety island is not entirely to replace the external MCU. In a cockpit system, the external MCU is responsible for power management, low-power wake-up, and other tasks. The main purpose of the built-in safety island is to ensure the safety of the entire system. For example, it monitors the display of dashboard domain — when some alarm information is not safely displayed, it triggers an alarm; it enables quick system response — when the system is powered on, the safety island pre-starts, initializes the system, and monitors the operational status of all safety modules in the system.”

“The external MCU cannot monitor too many details within the main SoC chip. It can only simply determine whether the SoC chip is ‘alive’ or ‘dead’. Once a problem arises, it cannot determine where the specific issue lies — a common practice is for the main SoC chip to continuously send heartbeat packets to the external MCU to indicate that it is functioning normally. If the external MCU does not receive a heartbeat signal, it indicates that the main SoC chip may have a problem and needs to be restarted.”

“The function safety island within the main SoC chip can monitor whether each module inside the SoC chip is operating normally in more detail, allowing it to detect potential risks during system operation earlier and respond in a timely manner.”

2) In-Cockpit Interaction: Multimodal Interaction

In the intelligent cockpit stage, the perception and interaction methods in the cockpit have become more intelligent and diversified. They are no longer limited to the tactile interactions of traditional physical buttons in the cockpit; voice interaction, gesture control, and visual interaction (DMS/OMS) have been added. By integrating multimodal information, the perception ability is enhanced, ensuring the accuracy of interaction feedback and providing a more humanized interaction experience.

For the driver side, various perception and interaction methods such as DMS, voice interaction, and gesture control are used to detect the driver’s state and reduce the driver’s hand-eye burden, helping to prevent fatigue driving and maintain the driver’s attention.

For the passenger and rear seat occupants, the main perception and interaction methods are through OMS, voice interaction, and gesture control to meet the leisure and entertainment needs of passengers in the cockpit.

• Voice Interaction

From a technical perspective, voice interaction is divided into front-end processing technology and back-end processing technology. Front-end processing technologies include VAD (Voice Activity Detection), echo cancellation, noise suppression, sound source localization, gain control, etc.; back-end processing technologies include voice recognition, semantic understanding, dialogue management, voice synthesis, etc. Moreover, in smart cockpits, voice interaction is mainly applied to control vehicle-related modules (air conditioning, seats, windows) and central entertainment-related modules (audio-visual entertainment, navigation, communication, etc.).

A Tier 1 expert in the smart cockpit field believes: “Currently, the demand for NPU computing power in voice interaction is not high. When voice is input, it first goes to the DSP for frequency domain and time domain data conversion. After conversion, more important frequency band data can be extracted because human voices have their characteristics; it only needs to extract data from several frequency bands to distinguish them, so it requires DSP’s computing power.”

“Pattern recognition will use NPU, but earlier, NPU was not very popular. Some voice vendors’ algorithms first ran on CPUs without using NPU for acceleration. Now voice/semantic recognition is accelerated through NPU, but the computing power occupied by voice interaction is still not high, as the input paths and data volume are limited at this stage.”

Factors affecting chip computing power in voice interaction (Source: Compiled from public data)

• Visual Interaction

Currently, the visual interaction functions in the cockpit based on cameras include: DMS, OMS, and gesture control, etc. Initially, DMS/OMS usually used independent ECU control units, but with the evolution of the overall vehicle EE architecture and the integrated development of AI chips, the main SoC chip in the cockpit domain controller generally has rich heterogeneous resources — CPU, GPU, DSP, NPU, etc., and supports multi-channel video input and processing capabilities. Therefore, DMS/OMS functions are now integrated into the smart cockpit domain controller for implementation. This not only saves certain hardware BOM costs but also facilitates better information exchange between the DMS/OMS system and other related modules in the cockpit, leading to better functional integration and innovation.

Additionally, based on the 3D TOF camera in the cockpit, 3D gesture recognition and driver identity recognition can also be achieved.

• 3D Gesture Recognition: ToF technology can obtain depth information of target objects, and combined with pattern recognition algorithms, it can accurately recognize a person’s three-dimensional gestures. Therefore, the driver can intelligently interact with multimedia, air conditioning, seats, windows, and other systems in the cockpit through different gestures.

• Face-ID Identity Recognition: ToF technology can classify people based on the obtained depth information, track facial and bodily features, and can distinguish between real people and photos, ensuring the accuracy and reliability of driver identity recognition and authentication.

Factors affecting chip computing power in visual interaction (Source: Compiled from public data)

3) Integration of Cockpit and Driving: From Cockpit-Parking Integration to Cockpit-Driving Integration

In the process of continuously integrating functions related to the cockpit, we also see a trend: the integration of cockpit with ADAS functions. Initially, surround view cameras were connected to the vehicle’s system to achieve 360-degree surround view functionality; later, surround view cameras and ultrasonic radar sensors were connected to the cockpit domain controller to control 360-degree surround view and APA parking functions, known as “cockpit-parking integration.”

Integrating basic parking functions into the smart cockpit has several benefits: First, it can reduce costs by eliminating the need for the original parking controller, thereby saving certain material costs; second, integrating parking functions into the cockpit allows for better human-computer interaction design in parking scenarios; third, the computing power on the main SoC chip of the cockpit can be maximally utilized. As development progresses, smart cockpits will further integrate L2-level driving ADAS functions and even higher-level intelligent driving functions, referred to as “cockpit-driving integration.”

In terms of the implementation forms of “cockpit-driving integration,” there are currently three: One Box, One Board, and One Chip. Currently, Tesla uses the One Box solution and achieved mass production application in 2019. The One Board and One Chip solutions are also being planned by related companies, with reports suggesting that the One Chip solution may enter mass production around 2025.

Progress in planning the cockpit-driving integration solution (Source: Compiled from public data)

Most industry insiders agree that the One Chip solution is the true “cockpit-driving integration,” which can help companies reduce costs and increase efficiency. Overall, the main advantages of cockpit-driving integration are reflected in:

• Cost Optimization: In terms of hardware, compared to multiple SoC solutions, a single SoC chip solution has higher integration and uses fewer materials, thus saving BOM costs to some extent; in terms of software, all software operates under a unified software architecture, which can save development validation and functional expansion costs.

• Improved System Response: Compared to inter-board switch communication or inter-chip PCIe interconnection, using in-chip communication with shared memory directly within the chip results in shorter communication delays and faster system responses.

• Facilitates New Function Iteration: After the integration of cockpit and driving, the platform’s integration level is higher, and the software is reasonably layered and partitioned, which is more conducive to the deployment and update of new functions.

When discussing what issues still exist in cockpit-driving integration, Sun Mingle cited an example: “The development of cockpit-driving integration is similar to the process of integrating dashboards and IVI in the industry a few years ago. Integration is a major trend, and many difficulties have been overcome in this process. For example, some Tier 1 suppliers only made dashboards, while others only made IVI; now they need to do both, which places high demands on Tier 1’s R&D capabilities. Of course, after the integration of the two, many conveniences will arise. User experience will improve, software development will become easier, and platform scalability will be better.”

“Integrating intelligent driving-related functions into the cockpit may follow a possible route: the cockpit first integrates 360-degree surround view, APA, and other parking functions, then further integrates ADAS driving functions, and finally integrates higher-level autonomous driving functions. The integration of L2.x ADAS and the cockpit is relatively feasible. However, for the integration of L3-level autonomous driving, the challenge lies in the fact that the boundaries of autonomous driving have not yet been clearly defined. For instance, there has been a heated discussion recently about the “with image” and “without image” solutions, and there are differing opinions on whether LiDAR will become standard equipment. These are directional issues faced by advanced intelligent driving, and in the absence of unified technological routes, it is challenging to integrate advanced intelligent driving functions with cockpit systems.”

“In the long run, the ultimate solution — a single SoC chip cockpit-driving integration solution — is the general direction. However, at this stage, due to the still unstable functional demands of advanced intelligent driving, there is currently no single SoC chip on the market that can effectively support all the functions of the cockpit and advanced autonomous driving while being cost-effective. Therefore, driven by market demand, current cockpit-driving integration will remain at the integration of L2.x ADAS and cockpit, while advanced autonomous driving and the cockpit will still adopt multiple SoC chip solutions for implementation.”

2.2 Product Positioning Determines Exclusive Demand for Cockpit SoC Chips in Specific Market Segments

For a large automotive company, to enrich the product matrix, it usually establishes different vehicle brands, and even different categories within the same brand. Moreover, models within the same brand and category are further divided into high, medium, and low versions based on different configurations. To differentiate products, automotive companies inevitably need to make configuration distinctions among models.

The smart cockpit is a key area for automotive companies to create configuration differentiation. However, a single smart cockpit domain controller solution is challenging to replicate directly on another vehicle platform. So, what are the differentiated demands for cockpit and cockpit SoC chips among models with different product positioning, and how should suppliers respond?

Sun Mingle stated: “Models with different market positioning have differentiated demands for the performance and functionality of the cockpit. For low-end models: in terms of performance, there is a greater emphasis on stability and reliability; in terms of functional demand, it mainly focuses on basic functionalities, such as mobile connectivity, navigation, voice control, etc. Additionally, based on the first two aspects, efforts should be made to control costs, meaning the system should be sufficiently streamlined. Therefore, for models positioned at this level, entry-level cockpits generally do not require OTA to add new functions in the future, as the functions are basically fixed during mass production. For high-end models: the chip’s computing power requirements are relatively high, and heterogeneous resources need to be sufficiently rich to meet the demands for subsequent product iterations and upgrades. High-end smart cockpits are characterized by being tailored to individual users, requiring continuous updates via OTA and the addition of new applications.”

“For chip companies, we need to provide reasonable differentiated hardware solutions based on customers’ differentiated demands for cockpits.”

To better meet automotive companies’ differentiated demands for smart cockpits, smart cockpit domain controller manufacturers generally adopt platform-based solutions. “We typically first design an ‘ultimate’ domain controller solution that includes all conceivable and feasible functions; then, we integrate the functions in a modular form on the development board, with standardized interfaces for communication between modules, allowing customization of modules based on differentiated demands. Platform-based development helps shorten R&D cycles and reduce development costs,” an expert from a Tier 1 smart cockpit supplier stated.

Additionally, due to the inconsistent pace of evolution in the EE architecture of different automakers, there will also be differentiated demands for chips. How can chip manufacturers meet the differentiated demands of different customers? An industry insider provided the answer: “Chip design also needs to consider platformization, requiring good scalability, such as enabling flexible combinations of IPs in chip design to enhance reusability. This not only meets the differentiated demands of different customers but also saves the manufacturer’s development costs.”

3. Domestic Replacement of Cockpit SoC Chips

Currently, the mid-to-high-end smart cockpit SoC chip market is monopolized by consumer electronics chip manufacturers such as Qualcomm, Intel, and Samsung, which have advanced chip manufacturing processes and scale and cost advantages. The mid-to-low-end market is covered by traditional foreign automotive chip manufacturers such as NXP, TI, and Renesas, whose advantages lie in strong cost control and good chip stability and reliability.

In previous years, domestic cockpit SoC chip manufacturers mostly remained in the R&D stage, leading to limited mass production on vehicles. However, in the past two years, domestic cockpit SoC chips have begun to rapidly enter mass production and have achieved large-scale application, such as Chipone’s X9 series cockpit chips, which have been mass-produced in models from SAIC, Chery, Chang’an, GAC, BAIC, Dongfeng Nissan, etc. The domestic replacement of cockpit SoC chips is accelerating.

3.1 What Do OEMs or Tier 1 Suppliers Look for When Choosing Chip Manufacturers?

In addition to the performance of the chip itself, what other dimensions do OEMs consider when selecting chip manufacturers? Based on consultations with relevant industry insiders, OEMs generally focus on the following aspects:

• How Mature is the Chip?

The maturity evaluation of automotive-grade SoC chips generally considers multiple aspects, including technical indicators, functional indicators, reliability indicators, supply chain indicators, and certification and standards indicators. The maturity of the chip is the primary consideration for customers when selecting a chip.

Because a chip product takes at least three years from definition to R&D and then to mass production. Once it enters the OEM’s supply chain, the OEM will generally stabilize its order demand for 3-4 years. For OEMs, once a chip manufacturer is selected, the cost of switching chip manufacturers in between is relatively high; unless major issues arise, they will not easily switch. Therefore, automotive companies will assess and analyze the maturity of the chip from the beginning, ensuring that the risks are controllable before choosing to collaborate.

• Is the Chip Roadmap Continuous?

When choosing a chip from a chip company, OEMs look not only at the present but also at the future. If a chip company only produces one or two generations of chips without a continuous roadmap, it means that if a domain controller is built around that chip, subsequent product iterations and upgrades will pose significant challenges. Therefore, OEMs or Tier 1 suppliers are unlikely to choose such a partner without long-term collaboration potential.

Thus, when selecting a chip enterprise, OEMs or Tier 1 suppliers need to examine the entire product iteration cycle and design philosophy of the chip company — whether it aligns with current industry development trends and whether it matches their product roadmap requirements.

• Does It Offer High Cost-Effectiveness?

Currently, the automotive market is highly competitive, and the “price war” among automotive companies continues. The basic logic of exchanging price for volume is that reducing costs and increasing efficiency is the main theme for every OEM.

Chip suppliers aiming to enter the OEM’s supply chain need to offer high cost-effectiveness as their biggest bargaining chip. What constitutes high cost-effectiveness? Either the product can help the OEM achieve more functions at the same cost and performance, or it can achieve the same functions at a lower cost. However, here, cost does not only refer to the hardware cost of the chip; it more accurately refers to the total cost at the system level.

• How is Localized Service?

In the context of software-defined vehicles, combined with the highly competitive environment, the R&D cycle of automobiles has been repeatedly compressed. The previous 3-4 year development cycle has even been compressed to 2 years. During this shorter development cycle, more issues may arise.

OEMs and Tier 1 suppliers will inevitably encounter many issues related to the underlying chip during product development based on chips, whether in hardware design, software development, image optimization, or algorithm porting. At this time, whether the chip company has a sufficiently large team and strong engineering capabilities to help customers quickly solve problems locally becomes particularly important.

Chip manufacturers need to strengthen cooperation with Tier 1 suppliers and OEMs, enhancing support for downstream customer services, and helping Tier 1 suppliers deliver high-quality products within relatively short development cycles.

3.2 How Can Chip Manufacturers Quickly Enter OEM Supply Chains?

• Identify Product Positioning and Target Market Demand

Entering the smart cockpit SoC chip market, the mid-to-low-end market is a relatively easy entry point. As long as a high cost-effective chip that meets current market needs is designed, it can relatively easily achieve mass production. So, how to design a “good chip” that meets current needs?

Chen Yi, co-founder and director of Chipone Technology, once stated: “The automotive industry chain is very long; to produce good chips, we must deeply integrate with applications. It must be a top-down architecture, first considering the entire application scenario, then breaking it down into the software architecture, and finally deriving the chip architecture to create a good chip.”

In other words, Chipone’s chip design generally adopts a top-down reasoning approach; first considering the upper-level application scenarios, then breaking down the required software architecture, and finally deducing the best-matching chip.

Regarding this topic, Chipone’s CTO, Sun Mingle, further explained: “The concept of application scenarios is considered within the context of the overall EE architecture to determine where the designed chip will be used — whether in the cockpit, intelligent driving, central gateway, or regional controller. Once the application is clarified, the overall software deployment needs to be considered, and the software that will be deployed on the chip must be thoroughly understood — understanding what they need to do, performance requirements, safety requirements, and OTA needs. Once everything is clear, we can determine what kind of hardware is needed to support these software requirements.”

Chipone has laid out a full-scene layout around the core domains of future electronic and electrical architectures, including the smart cockpit X9 series, intelligent driving V9 series, central gateway G9 series, and high-performance E3 series MCU, all aimed at meeting the needs of future automotive electronic and electrical architectures.

Chipone’s full-scene layout (Image Source: Chipone Technology)

Will the full-scene layout require significant effort and investment from Chipone, preventing it from maximizing advantages in one or two areas? Sun Mingle explained the rationale behind Chipone’s full-scene layout: “For SoCs and MCUs, there is a certain level of universality. In the automotive application field, chips prioritize stability and reliability; on this basis, performance needs to gradually improve while controlling power consumption and cost. The difference lies in the varying demands for chip processing capabilities across different applications.”

“Chip manufacturers do not need to achieve complete vertical integration for every application, as this process requires a lot of effort and resources. Our focus is on the chip itself and the foundational software that is closely related to it, which is also part of our delivery.”

Based on this, we choose to focus on application directions that align well with existing products, work with our partners to complete solutions in that direction, and then deliver them to automotive manufacturers.”

• Collaborate to Build a Chip Ecosystem

“The software ecosystem determines the value of the chip” has become a consensus in the chip industry. This is because the software ecosystem built on the chip significantly impacts the chip’s “usability.”

The entire software platform for the cockpit generally encompasses: virtual machines, operating system kernels, middleware, and application layers. For the lowest-level software, some use virtualization methods, while others directly adopt hardware isolation; the operating systems above can be roughly divided into two categories: real-time operating systems like RTOS or AUTOSAR, and non-real-time operating systems like QNX, Linux, and Android; the middleware layer includes vehicle interconnect, voice interface frameworks, navigation and positioning service frameworks, audio interfaces, CAN bus communication mechanisms, etc.; the application layer includes many algorithms, such as voice algorithms, visual algorithms, etc.

Smart cockpit system architecture diagram (Image Source: Compiled from public data)

For the entire cockpit system architecture platform, the chip serves as its foundational base. Chip manufacturers and their partners need to collaboratively build a complete cockpit system architecture solution based on this foundational base. Only by organically combining bottom-layer hardware with the entire software platform can a product with a good user experience be formed.

“We have a rich and complete ecosystem, including foundational software, operating systems, various toolchains, middleware, and upper-layer applications, algorithms, and solutions. Chipone has established ecosystem collaborations with over 200 enterprise partners both domestically and internationally. By working closely with automotive manufacturers and ecosystem partners, we can accelerate the entire chip development to mass production process. In the past, chips were developed first, followed by software, and then delivered to users. Now, as a chip enterprise, we can understand user needs in real-time and develop alongside them. When our chips are ready, the software is already prepared, significantly improving the speed of chip mass production and delivery to vehicles,” Chen Yi mentioned in a speech.

Reference Articles:

1. Chipone Technology: Intelligent Chips for Smart Vehicles, Building Core Technological Foundations

https://mp.weixin.qq.com/s/G_dsmCiFSfhcVxtDh42Nqw

2. Overview of China’s Smart Cockpit SoC Market

https://mp.weixin.qq.com/s/WxrOTAZtFvvl88OnMhigZg

3. A Brief Discussion on Smart Cockpit SoC Chips

https://mp.weixin.qq.com/s/95reTd6OOuM7wNxxbb4rgA

4. Smart Cockpit and Intelligent Driving SoC

https://zhuanlan.zhihu.com/p/604216936

5. Smart Cockpit Architecture and Chips – (11) Software Part

https://zhuanlan.zhihu.com/p/653813480

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https://www.dongchedi.com/article/7048259965034791427

7. Understanding Multimodal Interaction in Smart Cockpits

https://www.bilibili.com/read/cv22775555/

8. Smart Cockpit – Voice Interaction System

https://mp.weixin.qq.com/s/ifasITZeQ2mD3G5iFcjMIA

9. Multimodal Voice Interaction in Smart Cockpits

https://zhuanlan.zhihu.com/p/473755090?utm_id=0

10. Challenges and Difficulties in Cockpit-Driving Integration

https://zhuanlan.zhihu.com/p/658862370

11. Meng Liming from Changxing Intelligent Driving: Breakthrough Upwards or Dig Deeper Down? Exploring Single SoC Cockpit-Driving Integration Solutions

https://baijiahao.baidu.com/s?id=1769111931866318198&wfr=spider&for=pc

12. Analysis of the Development Trends of “Cockpit-Driving Integration” Technology

https://mp.weixin.qq.com/s/-K568fn3h5ToHJs2enyT3A

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