Breakthrough in Domestic Chips: Successful Tape-out of Loongson 2K3000, Achieving Dual Improvements in Computing Power and Performance

🚀 Breakthrough in Domestic Chips: Successful Tape-out of Loongson 2K3000, Achieving Dual Improvements in Computing Power and Performance RetryLoongson Processor Recently, there has been big news! Loongson Technology announced the successful tape-out of their new generation processor 2K3000 (3B6000M) ! This is no small matter; our domestic chips have made a significant leap forward. This … Read more

Top Ten Leading Stocks in Wafer Fabrication

(Friends who are not interested in the technical background can skip directly to the practical content below) 1. Definition and Significance of Wafer Fabrication Wafer fabrication is the core process of semiconductor manufacturing, referring to the submission of chip design layout data to a wafer foundry for trial production. Through processes such as photolithography, etching, … Read more

Comprehensive Analysis of Chip Fabrication Costs (90nm to 5nm)

Today, let’s dive into some hardcore content! 🔥 With the help of this chip fabrication cost evolution chart, we will understand how chip manufacturing has been “spending money like water” from 90nm to 5nm. Whether you are a newly minted electronic engineer or a chip investment analysis enthusiast, after reading this, you will confidently say: … Read more

Siemens EDA: First Tape-Out Success Rate Drops to 14% in 2024!

On May 14, according to EEnews Europe, Abhi Kolpekwar, Vice President and General Manager of Siemens EDA’s Design Verification Technology, stated that the first tape-out success rate (referring to chips based on advanced process technology) is currently declining, having dropped from 32% in 2020 and 24% in 2022 to 14% in 2024. “This is a … Read more

Key Steps in Chip Manufacturing – Detailed Explanation of Chip Fabrication (Part 3)

#04Equipment and Materials4.1 Key Equipment Photolithography Machine: As the core equipment in the fabrication process, its precision and stability have a decisive impact on the quality of chip pattern transfer. Modern photolithography machines utilize advanced optical systems and precise mechanical structures to project layout patterns onto silicon wafers with extremely high resolution, enabling the accurate … Read more

Why is Chip Tape-Out So Expensive?

Multiple failed tape-outs may lead to the collapse of a company. The chip industry is no stranger to tape-out. The so-called tape-out refers to the process of manufacturing chips through a series of steps, akin to an assembly line. This stage is crucial as it lies between chip design and mass production. In simple terms, … Read more

A C/C++ Embedded Communication Protocol for Multi-Device Communication

SACP (Snapmaker Advanced Communication Protocol) is the data communication protocol for Snapmaker devices, used for data transmission between the controller, PC (Host), and HMI (Human-Machine Interface). From the design philosophy of this protocol, it can meet the following basic goals: Reliability: Packet header CRC8 check + Checksum data integrity verification Flexibility: Supports request/response mechanism (SACP_ATTR_REQ … Read more

Open Source Tool PLC-CommunTools: The Ultimate Solution for Industrial Automation Communication Debugging

In the field of industrial automation, stable communication between the host computer and PLC (Programmable Logic Controller) is crucial for the normal operation of the system. However, different manufacturers have varying PLC protocols, making the debugging process complex and extending the development cycle, which poses many challenges for engineers. Today, we introduce a powerful open-source … Read more

A Comprehensive Guide to PCB Classification

PCB Network News Printed Circuit Boards (PCBs), also known as printed wiring boards, printed circuit boards, or printed wiring boards, are defined as conductive patterns made on an insulating substrate according to a predetermined design, which includes printed circuits, printed components, or a combination of both. The conductive patterns that provide electrical connections between components … Read more

Cambricon-P Architecture Wins Runner-up for Best Paper at MICRO 2022

On October 5, 2022, the Intelligent Processor Team of the Institute of Computing Technology, Chinese Academy of Sciences, received the Runner-up award for Best Paper for their paper titled Cambricon-P: A Bitflow Architecture for Arbitrary Precision Computing at the MICRO 2022 conference (CCF Class A), a flagship event in computer architecture. Cambricon-P is a novel … Read more