Comprehensive Design of Printed Circuit Boards

Printed Circuit Board Comprehensive Design The comprehensive design of a Printed Circuit Board (PCB) is a complex process that involves multiple fields such as electronic engineering, materials science, thermodynamics, and signal integrity. 1. Preliminary Design Preparation 1. Requirement Analysis Functional Requirements: Division of circuit functional modules (power supply, control, communication, etc.) Performance Indicators: Operating frequency, … Read more

Analysis of the Basic Situation of the Printed Circuit Board (PCB) Industry

1.Printed Circuit Board (PCB） Industry Basic Situation 1.1 Definition of Printed Circuit Board Printed Circuit Board (PCB), also known as printed wiring board or printed circuit board, is a board made of insulating and heat-resistant materials that serves to fix various components in a circuit and provide the connecting circuits between these components. Broadly speaking, … Read more

Common Thermal Interface Materials for Circuit Boards and Their Applications

In the design and application of circuit boards (PCBs ), thermal interface materials (TIMs) are key components for solving heat dissipation issues. They are used to fill the gaps between heat-generating components and heat dissipation parts, reducing thermal resistance and improving heat dissipation efficiency. Below is a detailed introduction to commonly used thermal interface materials … Read more

Xiangteng NPU Chip [6] – Chip Usage Guide and Software Development Reference Materials Summary

The Xiangteng NPU chip HKN201 neural network processor is a domestically produced, high-performance, multi-core NPU processor launched by Xi’an Xiangteng Microelectronics Technology Co., Ltd., aimed at strong real-time, high-performance, and high-concurrency application scenarios.Applications of the HKN201 neural network processor chip can refer to the NPU chip inference case guidance and Linux platform application guidance documents. … Read more

New Ascend NPU and MindIE Support Capabilities in SmartX AI Infrastructure: Solutions and Evaluations

Recently, SmartX launched the DeepSeek solution based on AI infrastructure, providing a unified infrastructure resource stack for both AI large models and other enterprise business systems, helping enterprises quickly advance the implementation and validation processes of large models. At the same time, considering the needs of users in industries such as finance and healthcare for … Read more

Understanding the Differences and Application Scenarios of Common AI Chips: GPU, NPU, TPU, FPGA, and ASIC

UnderstandingCommon AI Chips Introduction In today’s rapidly advancing technology, chips serve as the core “brain” of technological products, and their importance is self-evident. Among them,<span><span>GPU, NPU, TPU, FPGA, and ASIC</span></span> play key roles in various fields. Let’s delve into their technical characteristics, advantages and disadvantages, and application scenarios. 01GPU Technical Characteristics GPUs were originally designed … Read more

Unveiling the True Performance of μNPU Chips: What to Look for Beyond GOPs?

Hello everyone! Today, we are going to discuss an increasingly popular topic—edge AI and the microchips designed for it. With the proliferation of applications such as smart homes, wearable devices, and smart security, there is a growing need to run AI models locally on devices (rather than in the cloud). The benefits are numerous: faster … Read more

The Open Communication Protocols You Didn’t Know About: A Must-Read for PLC Engineers!

Essential Books for Mastering PLCs (Download link for e-books) OPC UA The OPC Unified Architecture (OPC UA) is a new technology created by the OPC Foundation, which is more secure, reliable, and vendor-neutral, allowing for the transmission of raw data and pre-processed information from the manufacturing site to production planning or Enterprise Resource Planning (ERP) … Read more

From Chip to Module: The Complete R&D and Production Process

This article is adapted from RFsister Maker RF Space. The development of the Internet of Things (IoT) and smart homes has deepened the interaction between people and objects, making our lives richer, communication more convenient, and connections tighter. The connection between people and objects (devices) relies on wireless networking via the Internet, yet there are … Read more

When Chip Pins Break, No Worries: Exposing Wires Inside the Package

Author: Xiaoyu, Typesetting: Xiaoyu WeChat Official Account: Chip Home (ID: chiphome-dy) 01 Exposing Wires Inside the Chip Package We received a chip, and the core part of the chip is actually not as large as the chip itself. To facilitate the connection of numerous pins, an additional layer of packaging is added outside. Common types … Read more