This article is brought to you by the Semiconductor Industry Review (ID: ICViews).This is the largest investment in semiconductor manufacturing in U.S. history.
Texas Instruments has announced plans to invest over $60 billion in its seven semiconductor factories in the U.S. to expand its manufacturing capacity to meet the growing demand for semiconductors, driving innovation in key areas from automotive to smartphones to data centers. This will also be the largest investment in foundational semiconductor manufacturing in U.S. history.
It is reported that this investment of over $60 billion will benefit seven semiconductor factories across three manufacturing giants in Texas and Utah, producing hundreds of millions of U.S.-made chips daily and supporting over 60,000 new jobs in the U.S.
Unlike NVIDIA, which produces cutting-edge AI chips, Texas Instruments is the largest manufacturer of foundational chips in the U.S., producing analog and embedded processing chips. These chips are critical for smartphones, vehicles, data centers, satellites, and nearly all other electronic devices, with a large customer base including consumer electronics and automotive manufacturers like Apple and Ford.
Notably, Texas Instruments has not yet disclosed a specific timeline for this massive investment.
The Seven Factories of Texas Instruments’ Investment
The seven factories involved in this investment are located in Sherman and Richardson, Texas, and Lehi, Utah.
In Sherman, Texas, Texas Instruments’ first new wafer fab, SM1, will begin production this year, just three years after breaking ground; the second new wafer fab, SM2, has also completed its exterior walls. Additionally, Texas Instruments plans to build two more fabs, SM3 and SM4, to meet future demand.
In Richardson, Texas, Texas Instruments’ second wafer fab, RFAB2, continues to ramp up production, following the launch of the world’s first 300mm analog wafer fab, RFAB1, in 2011.
In Lehi, Utah, Texas Instruments is accelerating the construction of its first 300mm wafer fab, LFAB1. Furthermore, the construction of the second wafer fab, LFAB2, adjacent to LFAB1 is also progressing smoothly.
Texas Instruments President and CEO Haviv Ilan stated, “The company is building reliable and low-cost 300mm wafer production capacity on a large scale. This investment plan aims to support the core components needed for nearly all electronic systems—analog chips and embedded processing chips. With the rapid development of smartphones, automotive electronics, and the Internet of Things, the demand for these chips is continuously increasing, and Texas Instruments’ expansion plan will help meet the growing market demand.”
U.S. Secretary of Commerce Gina Raimondo stated, “For nearly a century, Texas Instruments has been a cornerstone company driving innovation in technology and manufacturing. President Trump has prioritized the development of the U.S. semiconductor manufacturing industry, including foundational semiconductors used in everyday electronic products. Our collaboration with Texas Instruments will support the U.S. chip manufacturing industry for decades to come.”
New Investment Plans from Major Chip Manufacturers in the U.S.
In addition to Texas Instruments, companies like GlobalFoundries, TSMC, and Micron have also announced new investment plans in the U.S.
In March 2025, TSMC announced an additional investment of $100 billion, bringing its total investment in the U.S. to $165 billion. This plan includes the expansion of the Fab 21 facility in Arizona, the construction of three new wafer fabs (covering 2nm and more advanced processes), two advanced packaging plants, and one R&D center, ultimately forming a cluster of six wafer fabs. Among them, the packaging plants will introduce TSMC’s core CoWoS technology to achieve high-density integration of AI chips. The R&D center will focus on optimizing existing processes (such as preparing for 2nm mass production) rather than exploring next-generation technologies.
In June 2025, GlobalFoundries announced plans to invest $16 billion in the U.S. to expand its semiconductor manufacturing and advanced packaging capabilities in New York and Vermont, promoting the return of foundational chip manufacturing. This round of investment is divided into two parts, with over $13 billion allocated for expanding its facilities in New York and Vermont, and funding for the newly established advanced packaging and photonics center in New York, while another $3 billion focuses on advanced R&D programs in packaging, silicon photonics, and next-generation gallium nitride.
In June 2025, Micron announced an increase in its total investment in the U.S. from $125 billion to $200 billion. Of this, $150 billion is allocated for manufacturing, including the construction of two new DRAM wafer fabs in Boise, Idaho, four super fabs in Clay, New York (with a total cleanroom area of 55,700 square meters), and modernization upgrades to the Manassas, Virginia plant; $50 billion is allocated for R&D, focusing on breakthroughs in HBM (high bandwidth memory), 3D NAND, and next-generation DRAM technologies to solidify Micron’s leading position in the storage field.
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