Semiconductor Insights | Semiconductor Chip Industry News July 4

01 Market Dynamics and Industry Trends

1. U.S. Department of Commerce / Synopsys / Cadence: Lifted export restrictions on chip design software to China, allowing Synopsys, Cadence, and Siemens to resume sales to China, resulting in a surge in related stock prices and a net inflow of 21.585 billion yuan into the electronics sector. This move alleviates the global supply tightness of EDA tools and accelerates the technological iteration of Chinese semiconductor design companies.
2. NVIDIA: Stock price hits an all-time high, with a market value approaching $3.9 trillion, and institutions predict it will surpass $4 trillion; the surge in AI computing demand continues to elevate market expectations for GPU giants.
3. CoreWeave: First global deployment of NVIDIA’s GB300 NVL72 system, achieving a tenfold increase in AI inference performance, marking a new era for commercial use of exascale computing devices.
4. PCB Industry: The explosion in AI demand has led to shortages of high-layer boards and high-end materials, with copper-clad board manufacturers like Kingboard issuing price increase notices reflecting rising costs of upstream fiberglass cloth/resin/copper foil.
5. Chinese Operators: 5G-A users exceed 10 million, covering over 300 cities, with the three major operators investing 9.8 billion yuan to promote commercialization; by the end of 2025, over 100 terminal devices will support penetration into industrial manufacturing scenarios.
6. Counterpoint Research: TSMC’s global foundry market share is expected to reach 35.3% in Q1 2025, with the Foundry 2.0 strategy expanding into packaging and testing to strengthen ecosystem control.
7. IDC & Ningchang: Liquid cooling solutions will reduce data center PUE to below 1.15, and mixed-precision computing will enhance computing power utilization by 30%, creating an average annual market space of $30 billion for the semiconductor industry.
8. Huatai Securities: The global demand for AI inference is surging, with Google and Microsoft’s token call volumes increasing by 50 times and 5 times year-on-year, respectively, and it is expected that inference computing demand will accelerate beyond training demand.

02 Chip Product Dynamics

1. NVIDIA: Blackwell Ultra chip achieves commercial deployment, with generative AI content capabilities reaching 50 times that of the previous generation; the next-generation GB300 chip is expected to ship in September, integrating 72 GPUs with a 1.5 times increase in computing power.
2. Mainstream Smartphone Manufacturers: iQOO 15 series equipped with Snapdragon 8 Elite 2 scores over 4 million on AnTuTu, Huawei Mate 80 features Kirin 9030, and Samsung Z Flip7 debuts with a 75% yield on the 3nm Exynos 2500.
3. Foldable Phones: Honor Magic V5 features Snapdragon 8 Supreme Edition with a 6100mAh battery and a thickness of only 8.8mm, while Apple’s foldable iPhone enters P1 prototype testing using a titanium alloy hinge.
4. NVIDIA Partners: Galaxy RTX 5060 Ti features 16GB GDDR7 memory with a bandwidth of 448GB/s, while Gigabyte and Colorful launch the RTX 5050 series, marking the acceleration of GDDR7 commercialization.
5. AMD: Threadripper 9980X tops the PassMark performance chart with a score of 147,481, equipped with 256MB L3 cache; Ryzen AI 5 330 APU adopts Zen5 hybrid architecture targeting the entry-level device market.
6. Moore Threads: MTT S5000 chip achieves 32TFLOPS FP32 computing power, supporting FP8 precision, with GPU cluster efficiency surpassing foreign counterparts of the same generation.
7. Hygon: Lenovo’s Kaitian workstation features a 16-core Hygon 3490 processor, supporting local deployment of 32B large models and certified by domestic ISV software.
8. Xiaomi: Self-developed 3nm automotive-grade chip “Xuanjie O1” enters mass production, utilizing Chiplet design to integrate mature process I/O chiplets, scoring over 3 million on AnTuTu.
9. Huawei: Ascend 800I A2 chip achieves 1148 tokens/s inference throughput for the Pangu Pro MoE large model, with W8A8 quantization showing near-zero precision loss.
10. Apple: Plans to launch an OLED screen MacBook Pro in 2026, using M6 series chips, with a 30% increase in brightness and a 20% reduction in power consumption.
11. Rockchip: Bluetooth chip exposed security vulnerabilities allowing remote eavesdropping on devices, making chip-level security design a new focus for IoT devices.

03 Manufacturing Processes and Wafer Foundry

1. TSMC: Secured orders for Apple’s A19 Pro chip, utilizing 2nm process integrating Qualcomm’s X80 modem, with a 15% increase in transistor density and a 20% improvement in energy efficiency, set for mass production in 2026.
2. Intel: Concentrating resources on the 14A process, utilizing RibbonFET transistors and High NA EUV technology, aiming for a 30% increase in density and a 25-35% reduction in power consumption.
3. Samsung: 3nm GAA process Exynos 2500 chip yield surpasses 75% and enters mass production, set to debut in the Galaxy Z Flip7 foldable phone.
4. Institute of Materials, Chinese Academy of Sciences: Breakthrough in diamond film substrate warping technology, achieving <10μm warping for 4-inch self-supporting films, solving chip heat dissipation packaging adaptation challenges.
5. Infineon: 300mm GaN production is on track, with chip production efficiency improved by 2.3 times, planning to provide samples in Q4 to accelerate cost reduction in new energy applications.
6. Silicon Motion: First equipment for the 8-inch silicon carbide chip line in Xiamen has been moved in, with a total investment of 7 billion yuan planned for production in Q1 2026, achieving an annual capacity of 420,000 wafers.
7. Nexperia / Powerchip: Transitioning 100V-650V GaN products to the 8-inch production line, with the first batch of devices expected to complete certification by Q4 2025, achieving a 30% increase in power density.

04 Packaging and Testing

1. LG Innotek: First global launch of Cu-Post packaging technology, reducing RF-SiP substrate size by 20%, with copper pillar connection solutions enhancing heat dissipation efficiency by 7 times, aiding the miniaturization of 5G RF chips.
2. TSMC / Intel / Samsung: TSMC introduces CoPoS square packaging reducing costs by 20%, Intel upgrades EMIB-T technology integrating TSV, and Samsung’s SAINT system achieves 3D stacking of HBM chips.
3. NVIDIA / Zhongji Xuchuang: GB300 adopts co-packaged optical technology, with a 1.6T solution improving transmission speed by 60%, and manufacturers like Zhongji Xuchuang exceeding a monthly production capacity of 1 million units.
4. Huanxu Electronics: Delivered Level 10 full system JDM project, developing a lightweight AI edge server platform, helping customers reduce product time-to-market by 40%.
5. Institute of Materials, Chinese Academy of Sciences: Innovative diamond film technology achieves chip-level heat dissipation applications, with film thickness <100μm exhibiting self-adhesive properties, supporting 3D stacking packaging processes.
6. Testing Technology: Junlong Technology’s TMCL-IDE tool reduces motor debugging time to 2-4 hours, Schneider’s relays upgrade SOTIF standards, and ESD devices support ±30kV protection to ensure interface stability.

05 Semiconductor Equipment and Materials

1. Shanghai Jiao Tong University: Developed carbon nanotube ultrafast electron sources, with electron beam energy dropping to 0.3 electron volts, laying the foundation for atomic-level ultrafast microscopy.
2. Rare Earth Materials: China controls 92% of global rare earth refining capacity, with 6N ultra-pure refining technology leading the way; the U.S. will take 10 years to rebuild a complete supply chain.
3. Kingboard: Issued a price increase notice for copper-clad laminates, reflecting rising prices of upstream fiberglass cloth/resin/copper foil, highlighting the bargaining power of leading manufacturers in a highly concentrated industry.
4. Moore Precision: Launched a micro-nano 3D printing solution with 2-25μm precision, supporting ceramic slurry multi-material systems, achieving 10μm microstructure processing to promote miniaturization in semiconductor manufacturing.
5. Wolfspeed: Launched a 1700V silicon carbide MOSFET series, reducing gate charge to 10nC and output capacitance by 30%, with TO-3PF packaging enhancing creepage distance to 4.85mm.
6. Wentiang Quantum / Huazhong University of Science and Technology: Released chip-level post-quantum cryptography cards, integrating PQC SoC and quantum random number chips, supporting quantum-resistant algorithms and passing ASIL-D certification.

06 Storage Technology

1. Galaxy: RTX 5060 Ti features 16GB GDDR7 memory, with a bandwidth of 448GB/s supporting 2K high frame rate rendering, marking the commercialization of GDDR7 memory entering the popularization stage.
2. G.Skill International / ASUS: Collaborated to overclock CAMM2 memory to DDR5-10000 CL52, passing Memtest stability tests, promoting high-frequency memory in high-performance computing applications.
3. Shanghai Super Silicon: 300mm silicon wafers are mass-produced for use in HBM and other storage chips, covering DRAM and Nor Flash, with capacity expansion aiding the localization of the domestic storage industry chain.
4. AMD: Threadripper 9980X integrates 256MB L3 cache, improving data throughput efficiency by 20%, while Ryzen AI 5 330 APU is equipped with 8MB L3 cache to balance performance and power consumption.

07 Company Dynamics

1. Apple: Considering adopting third-party AI models to replace self-developed solutions to bridge the technology gap, with an open software ecosystem strategy potentially reshaping the competitive landscape for mobile AI chips.
2. Moore Threads: IPO application accepted on the Sci-Tech Innovation Board, raising 8 billion yuan for AI chip R&D, with AI intelligent computing product revenue expected to exceed 70% in 2024, and gross margin reaching 90.7%.
3. Microsoft: Initiated a second round of layoffs this year affecting 9,000 employees, restructuring its business to focus on cloud and AI core operations, with semiconductor procurement budgets unaffected.
4. Junwei Electronics: Confirmed as a core supplier of current sensing resistors for NVIDIA, participating in solution design to promote continuous iteration of high-precision sensing technology.
5. Hua Hong Semiconductor: Plans to invest 3.6 billion yuan to expand high-end PCB capacity, with a projected 47.33% revenue increase for its subsidiary in 2024, accelerating its layout in the AI server field.
6. NXP: CEO met with the mayor of Shanghai, emphasizing that China has become the largest single market globally, and will enhance the capabilities of its Shanghai headquarters to support industrial upgrades.
7. Alibaba: Plans to issue HKD 12 billion convertible bonds to strengthen AI hardware, investing 380 billion yuan over the next three years to enhance cloud computing infrastructure.
8. Honor: Received listing guidance filing from the Shenzhen Securities Regulatory Commission, establishing a new vision as an AI terminal ecosystem company, with sales of its 400 lightweight flagship exceeding one million.
9. Huawei: Appointed He Tingbo as the head of the senior talent compensation department, strengthening the attraction and incentive mechanisms for high-end talent in the semiconductor field.
10. Xiaomi: Self-developed 3nm automotive-grade chip “Xuanjie O1” enters mass production, collaborating with Huawei to build an automotive-grade EDA ecosystem to promote supply chain autonomy.
11. Luxshare Precision: Plans to list in Hong Kong to raise over $1 billion, targeting a top ten global Tier 1 automotive business, accelerating its globalization layout.
12. Apple: Adjusting AI strategy and collaborating with OpenAI/Anthropic to enhance Siri, with the planned LLM upgrade postponed to 2026 due to internal R&D delays.
13. Genesis AI: Completed a $105 million seed round financing led by Khosla Ventures, focusing on the development of general-purpose robotic models.
14. Omnivision Technologies: Submitted an IPO prospectus for Hong Kong, with projected revenue of 25.7 billion yuan in 2024, focusing on image sensors to accelerate penetration into the automotive market.
15. Quectel: Received approval for a 2.3 billion yuan private placement to expand AI computing module production, with a projected global market share of 31% for automotive 5G modules in 2024.

08 Policies, Regulations, and Standardization

1. U.S. Department of Commerce: Lifted export restrictions on chip design software to China, allowing Synopsys, Cadence, and Siemens to resume sales to China, alleviating global EDA tool supply tightness.
2. Ministry of Industry and Information Technology: Released new regulations for green and low-carbon data centers, for the first time listing WUE alongside PUE as core indicators, promoting the establishment of standards for liquid cooling and efficient power distribution.
3. IETF: Released SRv6 core standard RFC9800, with China Mobile’s G-SRv6 compression frame header technology improving efficiency by 25%, supported by major global equipment manufacturers.
4. Ministry of Industry and Information Technology: Accelerating the standardization of all-solid-state batteries and other automotive standards, with technological standardization promoting collaborative development of the new energy vehicle industry chain.
5. State Administration for Market Regulation / Civil Aviation Administration of China: Starting August 1, unapproved CCC-certified power banks will be banned from sale, and from June 28, carrying unapproved products on flights will be prohibited, strengthening safety testing standards.

Did you know? The inventors of integrated circuits are often considered to be Jack Kilby and Robert Noyce, who proposed similar ideas independently but almost simultaneously.

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