Microchannel Liquid Cooling Plates for AI Chips (1) Microchannel Liquid Cooling Plates for AI Chips (2) A clear trend is that as the thermal flux density of chips increases, thermal management is evolving into a platform-wide, systemic challenge. I believe that in all advanced chip companies and server enterprises, the thermal management department will rapidly expand and become one of the core R&D departments of the company. My personal view is that in the future, there will likely emerge a “thermal-electric…