In fields such as smart homes and industrial automation, IoT edge sensor nodes are quietly undergoing a technological revolution. As the demand for connected devices surges, what challenges will traditional embedded systems face?
Mr. Greg Robinson, Vice President of the MCU Business Unit at Microchip, provides an in-depth analysis of industry trends and presents innovative solutions.

1. The Evolutionary Dilemma of IoT Edge Nodes
Connectivity Drives Transformation
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W-Fi®/Bluetooth proliferation transforms small devices into “IoT edge nodes”
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Cost: A surge in processing demands and increased complexity of memory subsystems
The Tug-of-War Between Analog and Digital
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Devices like thermostats and smart kitchen appliances need to accurately sense slowly changing analog signals (such as temperature) while also meeting the high-speed demands of cloud communication. How to balance?
2. Key to Breaking the Deadlock: System Segmentation Design and I3C® Technology
✅ “Speed Domain” Segmentation Scheme
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Slow analog subsystems (sensor acquisition) and high-speed main processors each perform their roles
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Efficient collaboration through bridges, balancing accuracy and performance
🚀 The I3C Interface Revolution
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Several times faster than I2C, compatible with existing devices
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Case Study: Dual I3C Interface of PIC18-Q20 MCU achieves “one-to-many” high-speed bus
3. Microchip Technology: How Does the PIC18-Q20 Simplify Design?
✨ Four Major Innovative Highlights
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Multi-Protocol Bridging: Seamless integration of I3C/I2C/SPI/UART
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Voltage Domain Adaptation: Eliminates level shifters, significantly reducing costs
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Peripheral Independence from the Core: Can still process data while the CPU is in sleep mode
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Graphical Configuration Tool: MPLAB® MCC generates code with one click
🔋 Better Understanding of Low Power Consumption
Sensor nodes spend 99% of their time in deep sleep, extending battery life to several years
The Future is Here, Are You Ready?
🔗 Please read the original article for the full text “IoT Edge Sensor Nodes: The Evolution Beyond Single-Processor Embedded Systems”