Board Overview

TES817 is a high-performance real-time signal processing platform based on the ZU19EG FPGA. This platform utilizes a single high-performance FPGA: XCZU19EG-2FFVC1760I as the main processor. The PL side of the FPGA is equipped with a set of 72-bit DDR4 SDRAM for implementing large-capacity data caching, while the PS side of the FPGA is equipped with a set of 72-bit DDR4 SDRAM for high-speed data caching to support the operation of the operating system.

This platform supports 2 FMC+ interfaces, each supporting 16 channels of high-speed GTH serial buses. The FMC1 interface supports 84 LVDS data interfaces, while FMC2 supports 34 LVDS data interfaces.

The FPGA is equipped with 4 QSFP28 optical fibers, supporting 4 channels of 100Gbps optical real-time transmission rates. The board also supports 2 Gigabit Ethernet interfaces for command and control transmission. The board has a J30J debugging interface for controlling peripherals. This board is suitable for applications requiring large-scale logic processing resources.

1. Supports a single high-performance FPGA: XCZU19EG-2FFVC1760I:

• CPU resources: 4x ARM Cortex-A53, dual-core Cortex-R5 533MHz;
• GPU resources: Mali-400 MP2;

• Logic resources: 1143K;

2. PS side interfaces and resources:

• PS side supports 1 set of 72-bit DDR4 SDRAM;
• PS side supports 2 pieces of 512Mbit QSPI FLASH memory;
• PS side supports 1 piece of 32GByt EMMC storage unit;
• PS side supports 1 DP interface output;
• PS side supports 2 CAN interfaces;
• PS side supports 1 UART debugging interface;
• PS side supports 1 PCIE X1 M.2 NVME interface;
• PS side supports 4 USB interfaces;

3. End interfaces and resources:

• PL side supports 1 set of 72-bit DDR4 SDRAM dynamic cache, speed 2400M;
• PL side supports 4 QSFP28 optical interfaces, supporting 100G Ethernet;
• PL side supports 2 FMC+ interfaces, each FMC interface supports 16 channels of GTH;
• PL side supports 1 RJ45 Gigabit Ethernet interface;
• Supports 1 RS422 interface;
• Supports 16 GPIO interfaces;

4. Physical and Electrical Characteristics

• Board size: 160 x 200mm
• Board power supply: 5A max@+12V (±5%);
• Cooling method: Natural air cooling

5. Environmental Characteristics

• Operating temperature: -40°~﹢85°C;
• Storage temperature: -55°~﹢125°C;

Software Support

1. Integrated board-level software development package (BSP):

• Provides drivers for various underlying interfaces;
• Provides software integration based on various interfaces;

2. Customized algorithms and system integration can be provided based on customer needs:

Application Scope

1. Radar signal processing;

2. Video image processing;