The T710 uses the Zhanrui 4G UDS710 chip, which is a powerful module with rich interfaces in the WiFi version. It is a highly integrated embedded application processor that includes a quad-core ARM Cortex-A75 00P core and a quad-core ARM Cortex-A55MP as the application processor.
It runs on the Android 10.0 system, supports 2.4G and 5G WiFi, Bluetooth 5.0, GPS, and FM. It supports FHD MIPI screens, dual-camera light and distance sensing, gyroscope, and other functions.
The Tiger Ben T710 integrates the industry’s latest architecture NPU, providing strong computational support for AI calculations, and supports running AI algorithms with various data bit widths such as FP16, INT8, INT4, providing a robust platform for AI application development.
Features of the T710 Platform:
1. AP Subsystem • Quad-core ARM CortexTM A75MP processor, up to 1.8GHz • Quad-core ARM CortexTM A55MP processor, up to 1.8GHz • 64KB L1 I-cache and 64KB L1 D-cache, 256KB L2 cache for ARM CortexTM A75MP processor • 32KB L1 I-cache and 32KB L1 D-cache, 128KB L2 cache for ARM CortexTM A55MP processor • Shared 2048KB L3 I-cache • NEON multimedia processing engine with SIMDv2/VFPv4 ISA support • Supports 800MHz GM9446 • Supports booting from SD, USB, UART, eMMC, UFS • Supports UID and secure boot • Both CPU and GPU support DVFS technology • Supports SensorHub • Supports VDSP • Supports NPU
2. Peripheral and Connection Interfaces • Supports three SIM cards, 1.8V and 3.0V devices • Supports 3 SDIO 3.0 • Supports USB 2.0 HS interface, type C, USB 1.1 USB OTG, and one USB 3.0 interface • Supports 8 UARTs • Supports 4 dedicated SPI • Supports 1 4-datalane DSI • Supports 2 JTAG ports • Supports 2 4-datalane CSI and 1 2p2lane CSI • Supports 4 IIS ports • Supports 1 PCIe GEN2 for WCN and 1 PCIe GEN3 for 5G modem– Supports IPA • Supports default 3×3 keyboard (maximum 7×7) • Supports 8 IIC ports, host mode only • Over 150 GPIO pins • Three PWM outputs • Supports SIM/USIM • Supports 2 digital microphones
3. External Memory Interfaces • Supports eMMC 5.1 HS400 • Supports LPDDR4, LPDDR4x, LPDDR4y • Supports UFS2.1 • Supports the following memory combinations: eMCP(eMMC/LPDDR4/LPDDR4x/LPDDR4y) eMMC + LPDDR4 eMMC + LPDDR4x eMMC + LPDDR4y uMCP(UFS2.1/LPDDR4/LPDDR4x/LPDDR4y) UFS2.1 + LPDDR4 UFS2.1 + LPDDR4x UFS2.1 + LPDDR4y • eMMC flash is supported by the eMMC controller with the following features: Supports 1.8V input/output Supports 1.8 or 3.0V VCC Supports 1/4/8 bit devices Complies with eMMC5.1
T710 Platform Parameters:
Basic Parameters | |
Process | 12nm |
CPU Architecture | 4*A75 2.0GHz+4*A55 1.8GHz |
CPU Cores | 8 cores |
GPU Model | Imagination 9446,800MHz |
Functional Parameters | |
Cellular Network | Cellular: NA |
LTE Category: NA | |
Voice Function | Bluetooth 5.0 |
WiFi Support | b/g/n/ac |
Positioning Support | GPS, Glonass, Beidou, Galileo |
Camera Support | Camera: 24M |
Frame Rate: 30fps | |
Video Support | Video Decoding: 4K 30fps H.265, VP9; 1080P 30fps; H.264, H.263, MPEG4, VP8 |
Video Encoding: 4K 30fps H.265, VP9; 1080P 30fps; H.264, VP8 | |
Display Support | 3200*1440 |
Memory Performance | LPDDR4/4x/4y |
Storage Performance | eMMC5.1, UFS2.1 |
Other Performance | NPU > 3.2 TOPS |
Recommended Reading
-
MediaTek Dimensity 9000 flagship 5G chip specifications and performance introduction
-
MediaTek Dimensity 8000 5G mobile platform detailed parameters
-
New Move Technology XY6877ZA (MTK6877 platform) – New 6nm popular Wi-Fi 6 5G AI core board
-
New Move Technology MTK6833 (Dimensity 700 platform) 5G full network communication – Introduction to Android smart core board
-
New Move Technology XY6853ZA (MTK6853 platform) Android core board – 5G full network communication AI smart module
-
New Move Technology launches AI smart module XY8788(I500P)
-
New Move Technology XY6765CA (MTK6765 platform) octa-core Android core board – Introduction to Android development board solutions
-
New Move Technology XY6762CA (MTK6762 platform) Android 4G Android core board/development board – 4G smart module applications
-
New Move Technology 4G full network communication MTK6761 Android motherboard | Custom development of Android smart modules
-
New Move Technology XY6739CW (MTK6739 platform) function introduction – MTK 4G Android core board
-
New Move Technology XY6785CD (MTK6785 platform) function specifications introduction – MTK MediaTek 4G Android core board
-
New Move Technology XY450 (Qualcomm SDM450 platform) Android smart module – 4G full network communication – Supports dual-screen display and dual-touch control
-
XY310/XY610/XY618 (Ziguang Zhanrui T310/T610/T618 platform) Android core board – 4G full network communication – BOM fully localized
-
Android motherboard smart hardware custom development and production
-
Android development board – Android smart module development evaluation kit
-
Android 4G industrial control motherboard – Industrial touch all-in-one advertising machine motherboard development board – Smart hardware customization
-
Shenzhen New Move Technology Co., Ltd. product manual update (including MTK, Ziguang Zhanrui, Qualcomm mobile SOC platform models)
-
Summary of MTK MediaTek, Qualcomm, Ziguang Zhanrui mobile SOC platform models (including detailed parameters)
New Move TechnologyLeading IoT Solutions Provider
About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering customers a full range of services from R&D to manufacturing.
The company is headquartered in Bao’an, Shenzhen, with a research and development center in Changsha, focusing on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Ziguang Zhanrui, and Qualcomm (Qualcomm), receiving strong technical support from chip manufacturers. Our company keeps pace with major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We provide comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, thus providing strong support for customers to quickly launch products. The successfully developed Android motherboards based on MediaTek, Ziguang Zhanrui, Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
Contact Us
Company Headquarters: 4th Floor, Block A, Jinyuan Business Building, No. 300 Xixiang Avenue, Bao’an District, Shenzhen
Customer Hotline: Mr. Liu, phone and WeChat same number 18688981861