Fudan University Wins the Grand Championship at the International Chip Design Competition!

Fudan University Wins the Grand Championship at the International Chip Design Competition!Fudan University Wins the Grand Championship at the International Chip Design Competition!

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Fudan University Wins the Grand Championship at the International Chip Design Competition!

Recently

the 2025 MLCAD Contest

jointly initiated by VDA Lab of Arizona State University and others

(a machine learning competition focused on electronic design automation)

came to a close

The team of PhD studentsPan Hongyang and Lan Cunqing

from the School of Integrated Circuits and Micro-Nano Electronics Innovation at Fudan University,

and the National Key Laboratory of Integrated Chips and Systems at Fudan University

achieved five first places among twelve industrial scenario design cases

and ultimatelywon the overall championship with the highest total score

EDA

(Note: Electronic Design Automation,

is a technology that uses computer-aided design software

to complete the entire process of very large scale integrated circuit design

covering functional design, simulation, verification, physical design, etc.

It automates the transformation of abstract specifications and algorithms

into manufacturable layouts while ensuring correctness and efficiency

and is known as the “mother of chips”.

MLCAD focuses on

machine learning × electronic design automation (EDA)

and is an ACM (Note: Association for Computing Machinery)/ IEEE

(Note: Institute of Electrical and Electronics Engineers) international academic conference

aimed at promoting innovative applications and industrialization of machine learning throughout the chip design process

and has garnered significant attention in the industry.

Fudan University Wins the Grand Championship at the International Chip Design Competition!

Pan Hongyang (left), Lan Cunqing (right)

The conference sets competition topics each year around core industry challenges

This year’s topic was

“ReSynthAI: Physical-Aware Logic Resynthesis

for Timing Optimization Using AI”

which focuses onusing artificial intelligence for physical-aware

logic resynthesis to optimize timing

addressing a long-standing bottleneck in the EDA field:

the lack of physical information in the logic synthesis stage

which significantly reduces optimization effectiveness.

The task focuses on

the critical position of “after logic synthesis, before layout”

directly addressing the unresolved key issue of “disconnection between front-end and back-end tools” in the EDA field

This is also an important challenge faced by the global EDA community.

“The EDA process is divided into front-end logic synthesis

and back-end physical implementation,

the front-end is like an ‘architect’, concerned with functional correctness;

the back-end is like a ‘construction team’,

which must consider physical constraints such as materials, wiring, and space limitations.”

Pan Hongyang explained

The task of the logic synthesis stage is

to convert circuit functionality into a standard logic gate netlist

but this process usually does not include physical information.

When the netlist undergoes physical design,

it is found that the optimal metrics estimated based on the front-end model

are suboptimal under real physical constraints,

leading to a need for extensive iterative modifications

which significantly increases R&D cycles and costs.

Andthe core task of this competition

is to explore effective paths to bridge the front-end and back-end processes

With the rise of advanced designs such as chiplets and 3D chips,

the front-end design stage urgently needs to incorporate back-end physical information.

“Ourcore idea is to introduce physical information at the beginning of the design stage

for front-end and back-end collaborative optimization.”

Pan Hongyang believes

this approach can also accommodate advanced processes for the next 15 years.

Fudan University Wins the Grand Championship at the International Chip Design Competition!

The challenge of the topic lies in

the need to make trade-offs in an extremely complex decision space

and to select the optimal combination and execution order from a series of operations.

Previous research often only isolatedly addressed one or a few aspects

while the competition requires considering multiple transformations simultaneously

which greatly increases the complexity of the problem.

“AI is not a universal formula; the key is to use the right method.”

Lan Cunqing stated that the competition requires completing all optimizations within 3 hours

using only one A100 GPU

This means that general large model solutions are not feasible due to the enormous computational costs.

Therefore, the team chose a more tailored

lightweight AI solution that fits the competition’s needs.

The team ultimatelyadopted reinforcement learning techniques

to build an AI agent

trained through a “scoring learning” mechanism

allowing the AI to autonomously explore among a vast array of operational combinations——

“We set a ‘score’ for the result of each operation

and the AI’s goal is

to find a sequence of operations that achieves the highest total score.”

In Pan Hongyang’s view,

this method not only solves the problem of excessive time consumption in manual exploration

but also uncovers optimization solutions that surpass traditional heuristic algorithms

achieving a balance between efficiency and effectiveness.

Fudan University Wins the Grand Championship at the International Chip Design Competition!

Competition Framework

Looking back at the entire competition journey,

the team admits that challenges and opportunities coexisted.

From receiving the competition topic to final submission,

the two months of preparation time saw

one month spent just on building processes and environments,

leaving only one month for algorithm optimization.

“At that time, our strategy was not to pursue a ‘perfect solution’,

but to first iterate out a basic version and then gradually optimize.”

Pan Hongyang recalled

that everyone worked overtime almost every day

and were particularly tense during the final submission phase.

During the preparation process,

the two also had to deal with directional dilemmas.

“At that time, we were wavering between fine-grained optimization and coarse-grained optimization,

wanting to do top-level algorithms

while also optimizing every small detail.”

At a critical moment,

the advice from mentors Zhu Keren and Wang Zhianghelped them clarify their thoughts.

Fudan University Wins the Grand Championship at the International Chip Design Competition!

Zhu Keren (left), Wang Zhiang (right), Pan Hongyang (second from left), Lan Cunqing (third from left)

“The teachers advised us to first conduct a simple evaluation,

using data to determine which method is superior,

to avoid wasting time.”

To ensure the smooth progress of the competition,

the mentors held regular weekly meetings

to synchronize progress and resolve confusions

and provided efficient evaluations and suggestions for key milestones.

This year’s competition participants

covered universities and companies from North America, Europe, and Asia,

and to stand out among many teams,

Pan Hongyang and Lan Cunqing believe

accurate judgment and proactive trade-offs are key.

The MLCAD competition not only requires

completing optimization tasks in a short time

but also involves numerous optimization variables,

making it difficult to cover all aspects.

Faced with this challenge,

the team did not pursue perfection in all goals

but actively clarified optimization objectives through sorting and judgment,

which played a decisive role in the final results.

“We focused more on key objectives,

investing in the more critical parts,

which ensured the optimization effect of key links,

and this was really important.”

Lan Cunqing stated

this approach also inspired everyone:

“In a relatively short time,

to find the more critical parts,

and do more exploration.”

Congratulations to the students of Fudan University for shining on the world stage with their outstanding innovative capabilities.

We look forward to more Fudan youth

achieving excellent results in international competitions.

Fudan University Wins the Grand Championship at the International Chip Design Competition!Fudan University Wins the Grand Championship at the International Chip Design Competition!Fudan University Wins the Grand Championship at the International Chip Design Competition!

Source

School of Integrated Circuits and Micro-Nano Electronics Innovation

Compiled by

Campus Media Center

Text

Ding Chaoyi

Photography

Provided by interviewees

Editor

Zhang Peilin

Fudan University Wins the Grand Championship at the International Chip Design Competition!

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