Daily Semiconductor News | Semiconductor Industry Insights May 7

01 Chip Products and Design

1. NVIDIA announced that the GeForce RTX 5060 graphics card and laptop GPU will be available for sale on May 20, featuring a new generation architecture that significantly enhances gaming and AI computing performance, with a starting price of 2499 yuan for desktops and 1099 USD for laptops globally.
2. Guoxin Technology and Zhengzhou Xinda Yimi have collaborated to develop the quantum-resistant encryption chip AHC001, which has successfully passed internal testing. Based on domestic 28nm technology and self-developed CPU core design, it supports both quantum-resistant and traditional encryption algorithms, providing new solutions for the information security field.
3. AMD reported a 57% increase in sales for its data center division in the first quarter, expecting sales of approximately 7.4 billion USD this quarter. However, it will incur 800 million USD in costs due to AI chip export restrictions, with stock prices rising over 4% in after-hours trading.
4. Huawei’s Pura 80 Ultra will use the domestically produced Stmicroelectronics SC5A0CS 1-inch main camera sensor and SC590XS periscope telephoto sensor, breaking international monopolies and enhancing low-light photography and dynamic range performance.
5. Xiaomi is accelerating the development of its self-developed SoC chip “Xring,” with a team size reaching 1000 people, based on TSMC’s N4P process, aiming to match the performance of Snapdragon 8 Gen2 and reduce external dependencies.
6. MediaTek’s Dimensity 9400+ processor utilizes TSMC’s 3nm process, featuring 1 Cortex-X925 super core, 3 X4 super cores, and 4 A720 large cores, integrated with a 12-core Immortalis-G925 GPU, significantly enhancing AI performance.
7. Feiteng has launched its first self-developed laptop CPU, the Tengrui D3000M, which integrates 8 FTC862 cores and supports the PSPA2.0 security architecture, achieving a typical office usage battery life of 10 hours, already adopted by 18 manufacturers including Lenovo.
8. ZTE has introduced the world’s fastest Wi-Fi 7 5G portable Wi-Fi U60 Pro, powered by the Snapdragon X75 chip platform, supporting ultra-high-speed 5G-A networks and simultaneous access for 64 users, with initial sales reaching 964% of the previous generation.
9. ASUS’s ProArt Creator 16 2025 laptop is equipped with an RTX 5070 graphics card and AMD Ryzen AI 9 HX 370 processor, providing 798 TOPS of GPU AI computing power, targeting the professional creation market.
10. Unisoc’s THA6 Gen2 series MCU has become the first automotive-grade real-time controller in China to pass ASIL D certification, with built-in HSM supporting the EVITA-Full encryption standard, and has achieved mass production applications.

02 Cutting-edge Technologies and Processes

1. Compound semiconductors gained attention at the Wuhan Optoelectronics Forum, with silicon carbide (SiC) and gallium nitride (GaN) expected to reach a market size of 25 billion USD by 2030, driving innovations in 5G and new energy sectors.
2. TSMC’s 2nm process technology has sparked strong market demand, with Apple, NVIDIA, and AMD planning to adopt it, expecting monthly production capacity to reach 50,000 wafers by the end of 2025, tripling by 2027.
3. The Institute of Microelectronics of the Chinese Academy of Sciences proposed a carbon nanotube/silicon heterogeneous integration 3D CMOS technology, achieving low-temperature integration of 180nm SOI devices, significantly improving noise tolerance and energy efficiency.
4. Apple plans to adopt under-display camera technology in the iPhone 18 and foldable phones by 2026, developing dynamic pixel compensation algorithms to optimize display effects, while also featuring a 2nm process processor.
5. The Hefei compact fusion energy experimental device (BEST) project has started assembly two months ahead of schedule, with Lianchuang Superconducting completing the development of the world’s first 100-meter-level high-current high-temperature superconducting cable, promoting energy technology development.
6. TSMC has launched 3DVC cooling technology, which can reduce the junction temperature of 3nm chips by over 15°C through three-dimensional design and phase change heat transfer principles, addressing the issue of increased heat density in advanced processes.

03 Application Markets and Ecosystems

1. NVIDIA CEO Jensen Huang predicts that the Chinese AI chip market will reach 50 billion USD, emphasizing the importance of U.S. companies participating in the Chinese market, following a meeting with Vice Premier He Lifeng.
2. Momenta has reached a strategic cooperation with Uber to integrate its autonomous driving system into the Uber platform, with the first commercial services planned to launch in Europe in 2026, promoting smart mobility development.
3. The Dongfeng Nissan N7 received over 10,000 orders within an hour of its launch, equipped with the Qualcomm 8155 chip and Momenta’s driving assistance system, indicating strong demand in the smart car market.
4. Microsoft’s Windows 11 start menu will incorporate AI features, including personalized suggestions and visual search, initially available to users of Snapdragon X chips, enhancing productivity experience.
5. AI companies are facing profitability challenges, with CloudWalk Technology’s revenue expected to decline by 36.69% in 2024, and SenseTime accumulating losses of 54.6 billion yuan, as the industry accelerates exploration of vertical AI and B-end solutions.
6. In the automotive CIS market, OmniVision surpassed ON Semiconductor with a 43% market share, with BYD’s Seagull smart driving version equipped with 12 cameras, pushing high-end smart driving sensors into the A00 market.
7. Bluetooth chip companies like Hengxuan Technology are expected to double their net profits in Q1 2025, benefiting from the growing demand for wearable devices such as smartwatches and AI glasses, as well as edge AI technology deployment.
8. Honor has returned to the top three in the Chinese smartphone market with a 13.7% market share, announcing a five-year investment of 10 billion USD to transform into an AI terminal ecosystem, with its Shenzhen factory achieving a production capacity of 28 seconds per unit through AI inspection.

04 Market Dynamics and Data

1. The A-share semiconductor industry is expected to achieve a record revenue of approximately 602.2 billion yuan in 2024, with Northern Huachuang replacing SMIC as the profit leader, driven by AI boosting the performance of digital chip design companies.
2. Global semiconductor sales are projected to reach 627.6 billion USD in 2024, a year-on-year increase of 19.1%, with WSTS forecasting an 11.2% growth in 2025, driven by demand for AI computing power.
3. NVIDIA’s RTX 5090 D graphics card will stop supplying to China in Q2 due to suspected memory bandwidth violations, leading to order cancellations and potentially limiting the supply of high-performance graphics cards domestically.
4. From January to April 2025, 37 new IPO companies were added to the A-share market, raising 24.745 billion yuan, with the electronics industry raising 4.234 billion yuan, ranking second, indicating active financing in the semiconductor industry.
5. Global automotive CIS shipments are expected to reach 354 million units in 2024, generating 1.925 billion USD in revenue, and are projected to increase to 755 million units and 3.096 billion USD by 2029, with a compound annual growth rate of 10.2%.

05 Supply Chain and Manufacturing

1. Jabil plans to build a second factory in Tamil Nadu, India, to produce AirPods components, accelerating the shift of Apple’s supply chain to India to reduce tariff costs and improve efficiency.
2. Changchuan Technology plans to invest 50 million yuan to establish Hangzhou Changyue Technology, focusing on the localization of high-end packaging and testing equipment to enhance the self-controllable capabilities of the domestic semiconductor manufacturing industry chain.
3. Xiaomi’s self-developed SoC chip is being developed by Shanghai Xuankai Technology, with a registered capital of 3 billion yuan, demonstrating domestic companies’ determination to strengthen their chip design capabilities.
4. Samsung is collaborating with NVIDIA and Broadcom to develop customized HBM4 solutions, with plans for mass production in the second half of 2025 and shipments in the first half of 2026.
5. TSMC plans to build a 2nm production line at its factory in Arizona, USA, expected to start production in 2028, further expanding its global capacity layout.
6. Nexperia’s GaN products are expected to switch from 6-inch to 8-inch wafers by the end of the year, with a 12kW server power supply solution utilizing the GigaDevice GD32G5 series MCU for efficient control.

06 Corporate Strategies and Investments

1. AMD’s data center sales grew by 57% in the first quarter, with Q2 revenue expected to be 7.4 billion USD, but will incur 800 million USD in costs due to AI chip export restrictions, with stock prices rising in after-hours trading.
2. Xiaomi is accelerating the development of its self-developed SoC chip, with a team size reaching 1000 people, developed by Shanghai Xuankai Technology, with a registered capital of 3 billion yuan, planning to launch the “Xring” mobile chip.
3. Huayi Group plans to acquire 60% of San Ai Fu’s shares for 4.09 billion yuan in cash, integrating fluorochemical technology advantages to serve emerging fields such as lithium batteries and aerospace.
4. Tongyu Heavy Industry’s actual controller plans to change to the Shandong Provincial State-owned Assets Supervision and Administration Commission, with the company’s stock resuming trading on the 7th, indicating local state-owned assets strengthening their layout in the high-end equipment sector.
5. Haon Automotive has received a project confirmation from a leading new energy vehicle company, estimating a lifecycle revenue of 619 million yuan, with mass production of the AK2 radar and other intelligent driving systems starting in August.
6. CATL has repurchased 6.641 million shares, costing 1.551 billion yuan, demonstrating the company’s confidence in long-term development and stabilizing investor expectations.
7. OpenAI plans to acquire AI programming company Windsurf for 3 billion USD to enhance its competitiveness in the AI programming assistant market and expand its enterprise service capabilities.
8. Apple plans to procure over 19 billion chips in the U.S. this year, accelerating its iPhone manufacturing plan in India, aiming for all iPhones sold in the U.S. to be produced in India by the end of 2026.
9. Cambricon plans to raise 4.98 billion yuan through a private placement, with 2.9 billion yuan allocated for the development of a large model chip platform, aiming to build an advanced packaging technology platform through intelligent processor technology innovation.
10. SAIC Group is integrating Zero束 Technology with its R&D headquarters’ intelligent driving team, while retaining the independent operation of the electronic architecture department, reflecting the strategic direction of “quality improvement, upgrading, and streamlining operations.”

07 Policies, Regulations, and Standards

1. Trump signed an executive order encouraging the return of drug and semiconductor production to the U.S., considering strengthening regulations and tariffs on foreign manufacturers, impacting global supply chain layouts.
2. The Ministry of Industry and Information Technology and the National Standardization Administration released the “National Intelligent Manufacturing Standard System Construction Guide (2024 Edition),” focusing on the integration of AI and manufacturing, promoting the intelligent transformation of the industry.
3. The EU stated that if tariff negotiations with the U.S. fail, it will take retaliatory measures, which may affect trade worth 170 billion euros, involving key products such as semiconductors.
4. U.S. lawmakers plan to legislate to monitor the sale locations of AI chips from companies like NVIDIA to prevent smuggling and violations of export controls, with bipartisan support already secured.
5. MUNIK has obtained the world’s first vehicle AI safety ISO/PAS8800 certification, integrating functional safety, cybersecurity, and other standards to establish process specifications for the development of intelligent driving systems.

Did you know? The larger the wafer size, the more chips can be manufactured, resulting in lower costs.

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