A Method for Preparing Rolled Copper Foil for Flexible Printed Circuit Boards

A Method for Preparing Rolled Copper Foil for Flexible Printed Circuit BoardsClick the above“Public Account” to subscribe!

Overview of Achievements

Rolled copper foil is commonly used in the preparation of flexible printed circuit boards (FPC), applied in various fields such as consumer electronics and aerospace. With the development of electronic and electrical products, controllable and adjustable high-flexibility rolled copper foil products have gradually become favorites in the industry; however, this type of copper foil is still monopolized by foreign countries. In the FPC preparation process, to ensure its flexibility, the copper foil needs to undergo complete recrystallization at around 180°C, and the orientation consistency of the recrystallized grains must be high. However, the rolled copper foil produced by conventional rolling processes has a high recrystallization temperature and random orientation of recrystallized grains.

This technological innovation successfully combines trace alloy element doping with a special rolling process to produce rolled copper foil with a recrystallization temperature below 180°C and a recrystallized cubic texture orientation greater than 95%. Its conductivity and flexibility are superior to imported products from Japan. This technology is compatible with existing domestic rolled copper foil production lines, requiring no additional equipment modifications or upgrades, facilitating the transformation of scientific research achievements and technological upgrades for enterprises.

Application Status

In the FPC preparation process, it is necessary to connect the copper foil with the insulating film using adhesives. After that, the adhesive is dried at around 180°C to remove the solvent, ensuring good adhesion and mechanical properties after curing. To enhance the flexibility of the FPC, it is required that the hard copper foil undergo complete recrystallization during the drying process, with high orientation consistency of the recrystallized grains. Currently, this type of copper foil is monopolized by Japan, and the domestic market mainly relies on imports. This technology has already been discussed with two copper foil manufacturers, Lingbao Jinyuan Chaohui Copper Industry and Shanxi Beicopper New Materials, and has received high recognition from the technical personnel and management of both companies, with discussions ongoing regarding the transformation of achievements. Meanwhile, the Central Plains Key Metals Laboratory strongly supports this technology by establishing a “high-quality copper-based material pilot test platform” to promote the pilot testing of this achievement, which is currently progressing steadily.

Benefit Analysis

High-flexibility rolled copper foil is mainly used in flexible and high-frequency circuit boards, lithium battery anodes, and other fields. With the advancement of technology and the upgrading of electronic devices, the demand for high-flexibility rolled copper foil continues to increase. Currently, the market price for ordinary rolled copper foil is about 150,000 yuan/ton, while imported high-flexibility rolled copper foil from Japan can reach 300,000 yuan/ton. With a production cost of 100,000 yuan/ton, the profit margin differs by three times. After successful enterprise transformation, based on an annual production of 5,000 tons of rolled copper foil, it could increase profits by 750 million yuan, significantly enhancing the company’s influence in the industry. This technology can be adapted to existing production lines, requiring no additional investment or upgrades in equipment.

Integrating Technological Resources to Promote Technology Transactions

A Method for Preparing Rolled Copper Foil for Flexible Printed Circuit BoardsA Method for Preparing Rolled Copper Foil for Flexible Printed Circuit Boards

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