China and the U.S. Trade: The Darling of the Era On September 14, 2020, late at night, Hsinchu, Taiwan. TSMC’s factory was brightly lit, and the machines on the production line were still running at high speed, but there was an unusual tension in the air. Just a few hours earlier, the U.S. Department of … Read more
Gathering semiconductor industry news, technical frontiers, and development trends! According to a report from Kuai Technology on June 2, the semiconductor industry is currently facing a severe technical “winter,” with the chip tape-out success rate dropping to a historic low, posing significant challenges to industry development. Data released by Siemens, a giant in the Electronic … Read more
[Image][Image][Image] On June 2nd, Chip Ranking reported that the success rate of chip tape-outs has dropped to a historical low! According to Siemens EDA data, the success rate of first-time design finalization (Tape-out) has fallen to 14%, a significant decrease from 24% two years ago. Eight out of ten companies experienced failures in their first … Read more
PCEC Technical Article As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if … Read more
Technical Article Technical Articles PCECDuring the review of technical materials, it was found that there are some misconceptions regarding the evaluation of temperature classes for printed lines on Class I and Class II circuit boards. Additionally, some requirements in GB/T 3836.4—2021 “Explosive Atmospheres Part 4: Equipment Protected by Intrinsic Safety ‘i’” were not clearly stated, … Read more
Guide to the Manufacturing Methods of Printed Circuit Boards 1. Overview This article discusses the methods for surface treating copper foil, carrier-attached copper foil, and their use in manufacturing copper-clad laminates and printed circuit boards. The patent primarily focuses on how to optimize the adhesion of plated circuits, etchability of electroless copper, and dry film … Read more
As the electronic manufacturing industry continues to raise its standards for cleanliness in production environments, many older circuit board clean rooms are struggling to meet modern process requirements. Common issues in these outdated workshops include aging equipment, insufficient cleanliness, high energy consumption, and unreasonable layouts, all of which directly affect product quality and production efficiency. … Read more
Fire Hazard Pre-Detection: Detection of Odorous Gases Emitted from Circuit Boards In recent years, the proliferation of IoT has led to the high performance and miniaturization of electrical products, resulting in circuit boards developing towards higher density. This high-density circuit board is at risk of quality degradation due to long-term use and thermal accumulation, which … Read more
Recently, in the laboratory of the School of Materials Science and Engineering at Wuhan University of Technology, the hot press machine roared as it mixed, pressed, disassembled, and tested the performance of a high-frequency, high-speed, low-loss copper-clad laminate that was “ejected” by the machine. “The quality of 5G network signal transmission is crucially dependent on … Read more
