Year: 2025

Reshaping the Semiconductor New Cold War: Texas Instruments’ $43 Billion Strategy to Reshape the Global Supply Chain; NVIDIA Collaborates with Foxconn; Masayoshi Son of SoftBank Seeks Partnership with TSMC

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Reshaping the Semiconductor New Cold War: Texas Instruments' $43 Billion Strategy to Reshape the Global Supply Chain; NVIDIA Collaborates with Foxconn; Masayoshi Son of SoftBank Seeks Partnership with TSMC

1. Reshaping the Semiconductor New Cold War: Texas Instruments’ $43 Billion Strategy to Reshape the Global Supply Chain 2. Aqara Smart Camera G100: Deep Integration of Product Innovation and Chip Technology 3. Masayoshi Son of SoftBank Seeks Partnership with TSMC to Establish an AI Industrial Park in Arizona 4. NVIDIA Collaborates with Foxconn: Houston Factory … Read more

Texas Instruments Invests $60 Billion to Expand Semiconductor Manufacturing in the U.S.

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Texas Instruments Invests $60 Billion to Expand Semiconductor Manufacturing in the U.S.

Chip News Transmission Texas Instruments Invests $60 Billion to Expand Semiconductor Manufacturing in the U.S. Texas Instruments Inc. recently announced an investment of over $60 billion in the United States to expand and upgrade its semiconductor manufacturing facilities. This plan is a significant response to the U.S. government’s push for domestic chip manufacturing policies, aimed … Read more

Marvell Accelerates Custom AI Chips, Targeting the Trillion-Dollar Data Center Market

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Marvell Accelerates Custom AI Chips, Targeting the Trillion-Dollar Data Center Market

On June 17, 2025, chip company Marvell held an online investor summit focused on AI infrastructure. Although Marvell has generally maintained a low profile in the public eye, this summit sent a strong signal—it’s fully betting on “custom AI chips,” attempting to seize a core position in the data center chip market amid the upcoming … Read more

Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

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Democratizing 3D Integration: A Low-Cost Prototyping Solution Based on Chip-Level Thinning, Through-Silicon Vias (TSV), and Meta Bonding

Original link: https://xplorestaging.ieee.org/document/11007580【Abstract】 Three-dimensional integrated circuit (3D-IC) technology, with its vertical interconnections through silicon vias (TSV), has become central to advanced semiconductor devices. However, the initial development costs are prohibitively high, primarily due to the substantial investment required for wafer-level TSV processes. This study proposes…

Testing Automotive-Grade Chips: Technical Challenges and Future Opportunities in the Domestic Market

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Testing Automotive-Grade Chips: Technical Challenges and Future Opportunities in the Domestic Market

Introduction: Why are Automotive-Grade Chips So Important?Driven by the wave of intelligence and electrification, automobiles have evolved from traditional mechanical products into “smart terminals” that heavily rely on electronic control systems. The core of this transformation is the automotive-grade chips.Automotive-grade chips differ from consumer-grade or industrial-grade chips; they must meet the stringent requirements for reliability, … Read more

Voice of Ruichuang: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 2 – Thin Film Etching)

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Voice of Ruichuang: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 2 - Thin Film Etching)

Have you discovered the options for “Share” and “Like”? Click here to check it out. Last Issue Review From 0 to 1: A Comprehensive Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography) Reshaping the Body – Thin Film Deposition While beautiful appearances are commonplace, interesting souls are rare. In the life spectrum … Read more

Services | AMF Silicon-Based Photonic Chip Wafer Fabrication (2025)

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Services | AMF Silicon-Based Photonic Chip Wafer Fabrication (2025)

2025/06/20, Advanced Photonics Advanced Micro Foundry (AMF) is a silicon-based photonics specialized fabrication line located in Singapore. AMF provides highly innovative and reliable silicon photonic manufacturing solutions for cutting-edge application areas such as optical communication, optoelectronic sensing, optical ranging, and optoelectronic computing. The silicon photonic product manufacturing services offered by AMF are user-demand driven, with … Read more

Key Elements of PCBA Pre-Production Review and Hengtianyi’s Standardized Practices

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Key Elements of PCBA Pre-Production Review and Hengtianyi's Standardized Practices

Core Competitiveness of Flexible Response and Fast Delivery“Click the blue text to follow us”2023 PCBA (Printed Circuit Board Assembly) is a core aspect of modern electronic manufacturing, and its quality directly affects the performance and reliability of the final product. In the PCBA production process, the pre-production review is a crucial preparatory work that not … Read more

Essential Guide to PCBA Appearance Inspection Training Materials

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Essential Guide to PCBA Appearance Inspection Training Materials

[Image][Image]Introduction: PCB is a fundamental electronic material in PCBA processing, and any PCBA processing cannot be separated from PCB. How should PCBA circuit boards be accepted, and what acceptance standards need to be noted? How are these acceptance standards assessed? This article covers the basics of IPC-A-610, the operation of electronic components, component installation, basic … Read more

Key Considerations for Material Substitution in PCBA Manufacturing

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Key Considerations for Material Substitution in PCBA Manufacturing

Core Competitiveness of Flexible Response and Fast Delivery“Click the blue text to follow us”2023 In the manufacturing process of PCBA (Printed Circuit Board Assembly), material substitution is a critical step that directly affects the performance, quality, and reliability of the final product. Taking Hengtian Yi Electronics Co., Ltd. as an example, it has accumulated rich … Read more