NXP FS26xx Series SBC

NXP FS26xx Series SBC

The SBC from NXP has a very wide range of applications in the open market.The FS26xx series is one of the more commonly used models.Main features:1. Operating voltage range:Maximum input voltage of 40V (suitable for 12V systems)Supports a minimum battery voltage of 3.2V under BVST conditionsSupports a minimum battery voltage of 6V without VBST2. Power … Read more

Major Chip Design Companies in Guangdong and Their Industry Impact

Major Chip Design Companies in Guangdong and Their Industry Impact

Welcome to follow our public account for continuous meaningful information: Guangdong Province, as an important base for China’s semiconductor industry, especially in the field of chip design, is home to many influential companies. The chip design companies in Guangdong are mainly concentrated in Shenzhen and Guangzhou, forming a relatively complete industrial chain. Shenzhen HiSilicon Technologies … Read more

Arm Mali GPU Vulnerability Allows Bypassing MTE and Arbitrary Kernel Code Execution

Arm Mali GPU Vulnerability Allows Bypassing MTE and Arbitrary Kernel Code Execution

A serious vulnerability identified as CVE-2025-0072 has been discovered in the Arm Mali GPU driver, posing a significant threat to devices with newer Mali GPUs that utilize the Command Stream Frontend (CSF) architecture, including Google’s Pixel 7, Pixel 8, and 9 series. This vulnerability was reported to Arm by security researchers on December 12, 2024, … Read more

China Unicom Dismantles 2G Base Stations; ZTE’s Sarcastic Take on Apple’s New Device; Ericsson Chairman Seeks Resignation; Lenovo’s Self-Developed Chip Successfully Taped Out; Qualcomm Wins $1 Billion Antitrust Lawsuit

China Unicom Dismantles 2G Base Stations; ZTE's Sarcastic Take on Apple's New Device; Ericsson Chairman Seeks Resignation; Lenovo's Self-Developed Chip Successfully Taped Out; Qualcomm Wins $1 Billion Antitrust Lawsuit

↑ Click on “5G Communication” above to grasp 5G dynamics in just two minutes every day. Daily 5G news to keep you updated on 5G, welcome to subscribe. — 5G Brother Today’s 5G Hotspot Guide China Unicom Dismantles 2G Base Stations ZTE’s Sarcastic Take on Apple’s New Device Ericsson Chairman Seeks Resignation Lenovo’s Self-Developed Chip … Read more

Alphawave’s First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

Alphawave's First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

On June 5, semiconductor IP company Alphawave Semi announced that its UCIe IP subsystem has successfully taped out, utilizing TSMC’s 2nm (N2) process, supporting a 36G Die-to-Die data rate. This IP is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on … Read more

Aojie Press Conference Involves 14 Q&As: 6nm 4G Mobile Chip Tape-Out in June

Aojie Press Conference Involves 14 Q&As: 6nm 4G Mobile Chip Tape-Out in June

1. Mr. Dai, how many design-ins and design-wins does the company’s octa-core mobile chip have in OEM factories, and when will the mobile phones equipped with the company’s octa-core chip be launched? The company’s first 4G octa-core chip has been designed into multiple projects in mobile and other non-mobile fields, and the progress is going … Read more

Inphi Completes 7nm Full-Chip Flattened Design Tape-Out with Tempus Timing Signoff, Reducing Time to Market

Inphi Completes 7nm Full-Chip Flattened Design Tape-Out with Tempus Timing Signoff, Reducing Time to Market

Inphi is a leader in high-speed data movement interconnects, dedicated to rapidly transferring large data sets globally, between data centers and within data centers. We have adopted Tempus ECO and Tempus Signoff across all advanced process node projects. Due to the large scale of the designs, we chose to run flattened static timing analysis (STA) … Read more

Successful Tape-Out of Loongson 3B6000 Processor

Successful Tape-Out of Loongson 3B6000 Processor

Recently, the Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control applications and mobile terminal fields, respectively.The chip integrates 8 LA364E processor cores, achieving a measured SPEC CPU 2006 Base … Read more

First Tape-out: Success Rate Drops to 14%

First Tape-out: Success Rate Drops to 14%

On June 2, according to data from Siemens Electronic Design Automation (EDA) tools, the success rate of first tape-out for chip designs has dropped to a historic low of 14%, a significant decrease from 24% two years ago. This means that eight out of ten chip design companies will encounter failure during their first tape-out. … Read more

In-Depth Study | Understanding Cybersecurity AI Agents and Multi-Agent Systems

This article contains 8284 words, estimated reading time is 21 minutes. · Abstract ·With the acceleration of digital transformation and the exponential increase in the complexity of cyber threats, security operation models are gradually shifting from single-product defenses and rule-driven approaches to a data-driven and AI-empowered intelligent defense era. Major cybersecurity vendors have launched their … Read more