TP-LINK 4MP 4G Monocular AOV Camera TL-IPC44BV-F4GE Teardown

TP-LINK 4MP 4G Monocular AOV Camera TL-IPC44BV-F4GE Teardown

“In a journey of three people, there must be my teacher among them. Choose the good ones to follow, and correct the bad ones.” The teardown of the actual device reveals that the micro design will provide designers who continuously pursue industry-leading design solutions with a “different” good design scheme, enabling quick application and bringing … Read more

A Deep Dive into ARM Architecture: Understanding Cortex-M Exception Handling Mechanism

A Deep Dive into ARM Architecture: Understanding Cortex-M Exception Handling Mechanism

In embedded development, handling asynchronous events is an unavoidable challenge. For instance, reading sensor data from an accelerometer to calculate steps, or triggering RTOS context switches via timers, all rely on the support of exception handling mechanisms. Today, we will discuss the exception handling model of ARM Cortex-M. The Core of Exception Handling In the … Read more

Installation Package and Detailed Installation Guide for Keil uVision 4.12 MDK

Installation Package and Detailed Installation Guide for Keil uVision 4.12 MDK

SoftwareIntroduction Keil uVision 4.12 MDK is an Integrated Development Environment (IDE) developed by KEIL. Keil MDK, also known as MDK-ARM, Realview MDK, I-MDK, KEIL MDK-ARM, KEIL ARM, uVision5 (older versions include uVision4 and uVision3), is a microcontroller software development platform developed by the well-known German software company Keil (now acquired by ARM). It is currently … Read more

340 km/h: Chinese University Student Builds Drone to Break Guinness World Record

340 km/h: Chinese University Student Builds Drone to Break Guinness World Record

Click👇 to follow, set as a star in the upper right menu··· “Due to the 250-gram weight limit, every gram of the drone’s body must be meticulously calculated, but I ultimately completed this challenge.” On June 13, Xu Yang, a junior student from the Chinese University of Hong Kong (Shenzhen), shared with a reporter from … Read more

NXP and Rimac Technology Collaborate on Centralized Vehicle Architecture for Software-Defined Vehicles

NXP and Rimac Technology Collaborate on Centralized Vehicle Architecture for Software-Defined Vehicles

NXP Semiconductors announced on the 13th that it will collaborate with Rimac Technology, a supplier specializing in high-performance control systems, to develop a centralized vehicle architecture for Software-Defined Vehicles (SDV).The solution developed by the two companies is based on NXP’s S32E2 processor, which is part of NXP’s S32 automotive processing platform. The S32E2 is a … Read more

Implementation of Dual WiFi Functionality on RK3399 with Android 10

Implementation of Dual WiFi Functionality on RK3399 with Android 10

Starting from Android 9, the WiFi concurrency feature has been supported, with the following official description: Android 9 introduces a feature that allows devices to operate in both STA and AP modes simultaneously. For devices that support Dual Band Simultaneous (DBS), this feature enables new functionalities, such as not interrupting the STA WLAN when the … Read more

From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 1 – Photolithography)

From 0 to 1: A Detailed Breakdown of the SAW Wafer Fabrication Process (Part 1 - Photolithography)

China and the U.S. Trade: The Darling of the Era On September 14, 2020, late at night, Hsinchu, Taiwan. TSMC’s factory was brightly lit, and the machines on the production line were still running at high speed, but there was an unusual tension in the air. Just a few hours earlier, the U.S. Department of … Read more

Chip Tape-out Success Rate Hits Historic Low: 8 Out of 10 Failures, It’s Tough!

Chip Tape-out Success Rate Hits Historic Low: 8 Out of 10 Failures, It's Tough!

Gathering semiconductor industry news, technical frontiers, and development trends! According to a report from Kuai Technology on June 2, the semiconductor industry is currently facing a severe technical “winter,” with the chip tape-out success rate dropping to a historic low, posing significant challenges to industry development. Data released by Siemens, a giant in the Electronic … Read more

First Tape-out: Success Rate at 14%! (A Historical Low)

First Tape-out: Success Rate at 14%! (A Historical Low)

[Image][Image][Image] On June 2nd, Chip Ranking reported that the success rate of chip tape-outs has dropped to a historical low! According to Siemens EDA data, the success rate of first-time design finalization (Tape-out) has fallen to 14%, a significant decrease from 24% two years ago. Eight out of ten companies experienced failures in their first … Read more

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with ‘ic’ Protection Level Assembly

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

PCEC Technical Article As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if … Read more