Lifecycle Model of High C-Rate Medium Lithium-Ion Battery Packs

Lifecycle Model of High C-Rate Medium Lithium-Ion Battery Packs

Main Findings The average battery temperature of the MFM/PCM-ATM (Microfiber Network/Phase Change Material Active Thermal Management) module is 2.27°C lower (at 11.25C discharge rate) and 3.83°C lower (at 20C discharge rate) than that of the aluminum-based ATM module, thereby extending the cycle life. At a 10% depth of discharge, the MFM/PCM-ATM module is expected to … Read more

9.82 W/mK! High Thermal Conductivity Phase Change Materials Empower Chip Cooling

9.82 W/mK! High Thermal Conductivity Phase Change Materials Empower Chip Cooling

Source | Journal of Energy Storage Link | https://doi.org/10.1016/j.est.2025.117895 01 Background Introduction The thermal conductivity (λ) of composite phase change materials determines their response rate to external heat, which is crucial for chip thermal management. Traditional methods, such as incorporating thermal fillers into phase change materials, have had limited success in improving λ, significantly restricting … Read more

Multi-Energy Conversion and Electromagnetic Shielding Enabled by Carbonized Polyimide/Kevlar/Graphene Oxide@ZIF-67 Bidirectional Complex Aerogel-Encapsulated Phase-Change Materials

Multi-Energy Conversion and Electromagnetic Shielding Enabled by Carbonized Polyimide/Kevlar/Graphene Oxide@ZIF-67 Bidirectional Complex Aerogel-Encapsulated Phase-Change Materials

Traditional phase change materials (PCMs) face challenges such as low thermal conductivity, easy leakage in the molten state, and single functionality, making it difficult to meet the demands for efficient utilization of clean energy and multi-scenario applications. Existing organic/inorganic aerogel-based composites can partially address these issues, but they generally suffer from poor mechanical properties and … Read more

Passive Cooling Technology for High-Performance Electronics

Passive Cooling Technology for High-Performance Electronics

【Research Background】 With the continuous growth of societal demand for high-performance electronics and communication technologies, coupled with the ongoing reduction in the size of electronic components, the power density of these components has been steadily increasing. This has raised higher requirements for the thermal management strategies of electronic components. Passive thermal management technologies have attracted … Read more