Detailed Explanation of Rigid-Flex Layered Design
Source: SiP and Advanced Packaging Technology Author: Suny Li The three main characteristics of Rigid-Flex circuits are Multi-bending, Multi-stackup, and Multi-zone. In this article, we will take a detailed look at the multi-layered design of Rigid-Flex. 01 Multi-Stackup Multi-Stackup Multi-stackup refers to different numbers of layers and thicknesses in different areas of the substrate, meaning … Read more