1. Hardware Devices (1) RK3399Pro Development Board: This is a development board launched by Rockchip, equipped with NPU (Neural-network Processing Units), supporting 8-bit and 16-bit operations, with a computing performance of up to 3.0 TOPs. Compared to similar NPU chips, its performance is leading by as much as 150%, and it is compatible with various … Read more
According to official news from Rockchip: On March 6, the international forum “AI in 5G – Leading the New Era Forum” was held in Shenzhen, co-hosted by the International Telecommunication Union and the China Academy of Information and Communications Technology, with the Artificial Intelligence Industry Development Alliance (AIIA) and ZTE Corporation as the organizers. At … Read more
The Y series core board has added a new member following the release of RK3566 and Allwinner A133. LianZuan has launched the Y-3399 core board based on the Rockchip RK3399 processor. The core board features a stamped hole interface, offering high-performance computing and data processing capabilities, specifically designed for multimedia data processing, high-speed data transmission, … Read more
According to “Hubei Daily,” on April 3, at the Dongfeng Motor Global Innovation Center, Zhang Fanwu, Chief Engineer of Intelligent Technology at Dongfeng Motor R&D Institute, stated that the DF30, the first domestically produced automotive-grade high-performance MCU chip, has completed its first tape-out (trial production) verification, and automotive-grade validation is about to begin, with plans … Read more
After twenty years of dedicated research, the efforts have paid off, and Longxin Zhongke’s 2K3000/3B6000M chip has successfully taped out! This marks a significant milestone as our country has systematically mastered the key core technologies in general-purpose processor chip design, graphics processors, AI processors, and foundational software design. This means that our country’s Longxin has … Read more
On April 3rd, Loongson Technology officially announced the successful tape-out of the Loongson 2K3000 (3B6000M) processor. The company stated that the Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control … Read more
Recently, the Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control applications and mobile terminal fields, respectively.The chip integrates 8 LA364E processor cores, achieving a measured SPEC CPU 2006 Base … Read more
According to reports from Loongson Technology Co., Ltd.: Recently, the tape-out of the Loongson 2K3000 (3B6000M) processor was successful, and preliminary functionality and performance assessments have been completed, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting industrial control applications and mobile … Read more
The official announcement from Loongson Technology states that recently, the Loongson 2K3000 and Loongson 3B6000M have successfully completed tape-out, and preliminary functionality and performance assessments have been completed, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting the industrial control application field … Read more
In today’s increasingly fierce global technological competition, every breakthrough in domestic chips resonates with the industry. The successful tape-out of the Loongson 2K3000 (3B6000M) processor is not only a victory on the technical front but also represents a “comprehensive breakthrough” from the underlying architecture to the ecosystem. This breakthrough reflects the resilience, intelligence, and strategic … Read more