How to Decide on the Next DSP Processor Solution to Meet Evolving SoC Designs

How to Decide on the Next DSP Processor Solution to Meet Evolving SoC Designs

Assuming you are a system architect making decisions regarding the digital signal processor (DSP) in an SoC, one major consideration is how to expedite the design process of the SoC, leading to faster tape-out and production. Another consideration is how to create, debug, and modify software-defined features post-tape-out to mitigate risks. Today’s in-depth article discusses … Read more

Dissecting PuraX: Huawei’s Breakthrough with the Kirin 9020 Chip and Integrated Packaging

Dissecting PuraX: Huawei's Breakthrough with the Kirin 9020 Chip and Integrated Packaging

Recently, Huawei launched a new type of smartphone, the PuraX. This smartphone features a brand new wide-screen design, adopting a 16:10 “wide screen” format that offers a significantly different experience. Coupled with the new HarmonyOS 5 and unique wide-screen functionalities, it quickly became a hot seller, prompting many to exclaim, “It’s really great!” In fact, … Read more

Current Status and Future of Chip 032 Peripheral Chips

Current Status and Future of Chip 032 Peripheral Chips

The first is the RF chip, which is the chip that emits the frequency of radio devices, its frequency corresponds to different waveforms, for example listening to the radio, which uses over 100 MHz, and wireless internet Wifi has 2.4G and 5.8G, where 5.8G is commonly known as 5G Wifi, and the operators’ 3G, 4G, … Read more

Performance Testing of SiFive HiFive Premier P550 RISC-V Linux

Performance Testing of SiFive HiFive Premier P550 RISC-V Linux

SiFive HiFive Premier P550 SiFive recently launched the highly anticipated HiFive Premier P550 development board, which is their latest RISC-V offering, featuring four RISC-V cores, an Imagination AXM-8-256 integrated GPU, a Gigabit Ethernet port, a PCIe x16 slot, and 16GB or 32GB of RAM. The HiFive Premier P550 is a modern RISC-V development board suitable … Read more

Anfu Lai Embedded Weekly Report Issue 352: March 2025 – April 3, 2025

Anfu Lai Embedded Weekly Report Issue 352: March 2025 - April 3, 2025

Description:Thank you all for your attention, and we will continue to summarize the exciting content from last month. 1Handheld Open Source Terminal, Supports Scientific Calculator, Function Plotting, I2C/SPI External Sensors, etc. Currently supports scientific calculator, function plotting, I2C/SPI external sensors, etc. Specifications Effect: 2Parametric Array-Based Directional Speaker This is a parametric array-based directional speaker composed … Read more

Technical Insights | TI’s Ultra-Compact M0+ MCU Packaging Offers More Possibilities for Your Designs

Technical Insights | TI's Ultra-Compact M0+ MCU Packaging Offers More Possibilities for Your Designs

Click the blue text to follow us Add a star to the “…” in the top right corner of the homepage to stay updated! As circuit and system design sizes shrink, it becomes increasingly challenging for engineers to select suitable components for their designs. In many different applications (such as earbuds, thermometers, wearable devices, styluses, … Read more

Introduction to ARM Microcontrollers and Overview of Renesas RA Series MCUs

Introduction to ARM Microcontrollers and Overview of Renesas RA Series MCUs

Chapter 2 Introduction to Renesas RA Series Chips 2.1 What is an ARM Microcontroller Microcontroller MCU Commonly known as a microcontroller, this concept is familiar to those who have studied microcomputer principles. An ARM microcontroller, as the name suggests, is a microcontroller based on ARM architecture, or more specifically, a microcontroller that incorporates an ARM … Read more

Fujian Entrepreneur Develops Chips, Conquering the Global Hardware Industry Over 24 Years

Fujian Entrepreneur Develops Chips, Conquering the Global Hardware Industry Over 24 Years

Hello everyone, I am Engineer Wang. Today, let’s learn about a company, named: Rockchip Electronics Co., Ltd. (“Rockchip”, stock code: 603893). The reason for introducing this company is that their chips are widely used, and in the embedded field, there are very few hardware engineers who are unaware of them. 011 Introduction Our daily routine … Read more

Another Breakthrough: Successful Tape-Out of 2nm Chip

Another Breakthrough: Successful Tape-Out of 2nm Chip

Another Breakthrough: Successful Tape-Out of 2nm Chip In this rapidly evolving technological era, every step of innovation has the potential to change the landscape of the entire industry. Recently, a groundbreaking achievement by World Semiconductor has undoubtedly injected a shot of adrenaline into the global semiconductor industry — they have successfully tape-out the world’s first … Read more

Surface Flatness Requirements for Gold Bonding Areas on Microwave Circuit Boards

Surface Flatness Requirements for Gold Bonding Areas on Microwave Circuit Boards

PCB Thermal Design: A Comprehensive Analysis from Theory to Practice Thermal issues are often the “Achilles’ heel” of many electronic products, especially in modern PCB designs with high integration and high power consumption. I remember a project I took on last year for an industrial control board, where the main chip had a power consumption … Read more