Design and Manufacturing of Printed Circuit Boards – Page 437
Some screenshots of electronic books 【Complete Set of Hardware Learning Materials Collection】
Embedded Hardware
- System on Modules (SoM)
- Single Board Computers (SBC)
- Development Boards
- Industrial PCs & Embedded Computers
- IoT & Edge Computing Gateways
- AI & Machine Learning Modules
- Rugged & Industrial-Grade Components
- Peripherals & Expansion Modules (Displays, Sensors, Power Modules)
Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards
Guide to Flexible Circuit Boards and Their Manufacturing Methods Overview This guide aims to help you review and understand the structure of flexible circuit boards and their manufacturing methods as described. The patent discloses a design for flexible circuit boards intended to reduce high-frequency signal transmission losses by introducing air-filled sealed cavities to minimize dielectric … Read more
Design of Double-Sided Gold Fingers in Flexible Circuit Boards
Pengding Holdings involves a new type of flexible printed circuit board and its manufacturing method, which features a double-sided gold finger design aimed at improving space utilization and overcoming the limitations of existing single-sided gold finger flexible circuit boards in achieving circuit layout. Key Ideas/Facts: Double-Sided Gold Finger Design: The most significant feature of Pengding … Read more
Innovative Circuit Board with Solder Pads and Its Manufacturing Method
Core Issues and Technical Background: Pengding Holdings addresses the trend of existing electronic products moving towards being thinner, lighter, and smarter, where flexible circuit boards (FPC) are widely used as important components. To achieve high frequency, high speed, thinness, and dense routing, as well as to meet the requirements of Ball Grid Array (BGA) packaging, … Read more
Guide to Multilayer Circuit Board Manufacturing
Guide to Multilayer Circuit Board Manufacturing Technology Learning Objectives This guide aims to help you review and understand the methods of multilayer circuit board manufacturing and the resulting circuit boards. It focuses on the following aspects: Core Technology: Understand the core innovations of this patent, which is a method that simplifies the multilayer circuit board … Read more
Method for Manufacturing Multilayer Circuit Boards and Multilayer Circuit Boards
2. Technical Field The invention relates to a method for manufacturing multilayer circuit boards and the multilayer circuit boards obtained by this method. In particular, as consumer electronic products increasingly develop towards being thinner, smaller, and smarter, the requirements for circuit boards (FPC) as important components are becoming higher. In existing technologies, the manufacturing of … Read more
Guide to Learning Circuit Boards with Embedded Pads
Guide to Learning Circuit Boards with Embedded Pads and Their Manufacturing Methods Ten Short Answer Questions What field does this invention patent relate to regarding circuit boards? According to claim 1, what are the main components of the circuit board with embedded pads? According to claim 1, how are the embedded pads formed? According to … Read more
Guide to Manufacturing Rigid-Flex Circuit Boards
Guide to the Research and Manufacturing Methods of Rigid-Flex Circuit Boards This research guide aims to help you understand and review the described rigid-flex circuit boards and their manufacturing methods. Quiz Please briefly answer the following questions in 2-3 sentences. What is the technical field described in the patent document? What advantages do rigid-flex circuit … Read more
3D Printing of Circuit Boards
The process of 3D printing circuit boards typically involves the following two main methods, detailed as follows: Method 1: Directly Printing Circuits with Conductive Materials Designing the CircuitUse specialized circuit design software, such as EAGLE or Fusion 360, to design and model the circuit. Once the design is complete, import the circuit board file into … Read more
An Overview of the Bank Structure in Xilinx 7 Series FPGAs
The I/O interfaces of the Xilinx 7 series FPGAs are organized into several banks. Each bank shares the same power supply for its I/O pins and shares some resources. Why Divide into Banks Dividing the I/O pins into different banks allows different pins to operate at different voltages. This enables the connection of circuits operating … Read more