Weekly Chip News
NO.1
Hongyi Chip’s Domestic Smart 4-Channel Low-Side Switch HE9104 Successfully Taped Out
On August 25, it was reported that Hongyi Chip’s self-developed automotive-grade smart 4-channel low-side switch chip HE9104 has completed its first round of verification, with normal performance in laboratory tests and successful tape-out! The HE9104 is developed in collaboration with a leading domestic Tier 1 manufacturer, exclusively using STMicroelectronics’ advanced BCD8sAuto process for tape-out. As a smart 4-channel low-side switch chip, the HE9104 supports direct control via INx pins and SPI control, particularly suitable for gasoline engine multi-point fuel injection, and is compatible with 12V/24V systems. Among similar products, the HE9104 not only has an advantage in the number of channels but also excels in functional integration and system safety—featuring multiple self-protection diagnostics and feedback reporting functions such as overcurrent, overtemperature, short circuit, and open circuit, meeting the stringent requirements of automotive electronic applications.
NO.2
South Korea’s Rebellions Launches First UCIe-Advanced NPU Chip REBEL-Quad
On August 25, it was reported that South Korean AI chip company Rebellions has launched its first NPU chip, REBEL-Quad, utilizing UCIe-Advanced interconnect technology. UCIe-Advanced employs advanced packaging for denser and more energy-efficient connections compared to the standard version of UCIe. Each REBEL-Quad chip contains four units, each consisting of one NPU computing chip, one HBM3E memory stack, and one silicon capacitor, interconnected via UCIe-Advanced, with the overall chip also providing UCIe ports externally.
NO.3
Toshiba Launches Compact Automotive Opto-Relay with 1500V Output Voltage Rating for Automotive Battery Systems
On August 25, Toshiba announced the launch of a new automotive opto-relay, the TLX9161T, featuring a compact SO12L-T package with an output voltage rating of up to 1500V (minimum), sufficient to support high-voltage automotive batteries. The TLX9161T is a miniaturized version of Toshiba’s TLX9160T opto-relay. The miniaturization of the MOSFET chip in the TLX9160T allows it to be integrated into the SO12L-T package, which has a mounting area approximately 25% smaller than the SO16L-T package of the TLX9160T. The reduced size also aids in the miniaturization and cost reduction of Battery Management Systems (BMS). Its pin spacing and layout are the same as the SO16L-T, allowing for the use of the same PCB pattern design.
NO.4
Diodes Launches 80V/100V Asynchronous Buck Converters for High Efficiency in Automotive 48V PoL Applications
On August 25, Diodes announced the launch of four new automotive-grade asynchronous buck converters suitable for 48V low-voltage point-of-load (PoL) applications. The AP68255Q, AP68355Q, AP6A255Q, and AP6A355Q all integrate 500mΩ power MOSFETs, providing efficient buck DC-DC conversion with up to 3.5A continuous output current.
NO.5
Geke Launches 1/4.7-Inch Image Sensor GC5605
On August 25, Geke officially announced the launch of a new 5-megapixel image sensor, the GC5605. This product is specifically designed for AI PC applications, excelling in core application scenarios such as video conferencing and high-definition photography, while also enabling intelligent wake-up and gesture control for smarter human-computer interaction, injecting new vitality into the development of AI PCs.
NO.6
SK Hynix Announces Mass Production of 321-Layer QLC NAND Flash Memory
On August 25, SK Hynix announced that it has developed a 321-layer 2Tb QLC NAND flash product. This product not only achieves high capacity but also significantly improves performance compared to previous QLC products. Data transfer speeds have doubled, write performance has improved by up to 56%, and read performance has increased by 18%. Additionally, data write energy efficiency has improved by over 23%, making it more competitive in fields such as AI data centers that require low power consumption.
NO.7
Renesas Electronics Launches New Ultra-Low-Power RA4C1 MCU with Advanced Security and Dedicated Peripherals, Ideal for Metering Applications and More
On August 25, Renesas Electronics announced the launch of the RA4C1 microcontroller (MCU) product line based on the 80MHz Arm® Cortex®-M33 processor. The new MCU features ultra-low power consumption, advanced security features, a rich set of communication interfaces, and segment LCD support. Thanks to its unique combination of features and performance metrics, it is an ideal choice for battery-powered applications requiring strict security, covering fields such as electric meters, gas meters, water meters, industrial flow meters, smart locks, thermostats, building control systems, and industrial user interfaces.
NO.8
Malaysia Launches First Self-Developed AI Chip MARS1000, Joining Global Tech Competition
On August 26, it was reported that Malaysia has released its first self-developed artificial intelligence (AI) processor, joining the global competition to create the most sought-after AI electronic components. Local chip design company SkyeChip launched the MARS1000 chip at an industry association event attended by senior Malaysian government officials. The Malaysian Semiconductor Industry Association stated that this chip is the country’s first edge AI processor, meaning it can internally support devices ranging from automobiles to robots.
NO.9
State Council: Strengthen Intelligent Computing Coordination, Support AI Chip Innovation and Software Ecosystem Development
On August 26, the State Council released opinions on further implementing the “AI+” initiative. The opinions propose to strengthen the coordination of intelligent computing, support innovation in AI chips, and foster the development of software ecosystems, accelerate breakthroughs in ultra-large-scale intelligent computing cluster technologies, and optimize the national intelligent computing resource layout, enhancing the national integrated computing network.
NO.10
Yuntian Lifa Develops Next-Generation Robot Chip DeepXBot
On August 26, Yuntian Lifa announced that it is developing a next-generation humanoid robot chip series, DeepXBot. This chip will accelerate reasoning tasks in perception, cognition, decision-making, and control for robots. Previously, its self-developed DeepEdge10 chip has achieved commercial applications in multiple fields and supports onboard computing projects for deep space exploration laboratories.
NO.11
NVIDIA Releases Next-Generation Robot Chip Jetson Thor
On August 26, NVIDIA officially released the next-generation robotic computing platform, Jetson AGX Thor. Built on NVIDIA’s Blackwell chip, Jetson AGX Thor offers a 7.5x increase in AI computing power and a 3.5x improvement in energy efficiency compared to the previous generation product, Jetson AGX Orin. This chip supports all mainstream AI frameworks and generative AI models, compatible with NVIDIA’s software stack from cloud to edge, capable of running multiple AI workflows for real-time inference.
NO.12
Naxin Microelectronics Officially Launches Ultrasonic Radar Probe Chip NSUC1800
On August 26, Naxin Microelectronics officially launched the NSUC1800—an ultrasonic radar probe chip (Slave) based on a fully domestic supply chain and compatible with the standard DSI3 protocol, providing more accurate and reliable perception capabilities for intelligent driving scenarios such as assisted parking (UPA), automatic parking (APA), and valet parking (AVP). This chip has passed functional safety and automotive certification, aiding the acceleration of domestic ultrasonic radar systems into mass production.
NO.13
Rebellions Launches 4nm AI Chip REBEL-Quad, Claimed to Match NVIDIA B200 Performance
On August 27, it was reported that South Korean AI chip startup Rebellions has launched a new generation of AI semiconductor, REBEL-Quad, based on Chiplet technology. Rebellions plans to actively respond to the global demand for large-scale AI data centers through REBEL-Quad. This new AI chip, manufactured using Samsung’s 4nm process, matches the performance of NVIDIA’s Blackwell B200 while also offering excellent energy efficiency. It is equipped with the latest HBM3E memory, with a capacity of up to 144GB and a bandwidth of up to 4.8TB, capable of processing models with hundreds of billions to trillions of parameters on a single chip.
NO.14
Jichuang Beifang Collaborates with Tsinghua University and Xinyi Technology to Launch First Self-Developed RRAM AMOLED Display Driver Chip
On August 27, Jichuang Beifang, in collaboration with the Tsinghua University Integrated Circuit Institute team and Xinyi Technology, launched the first AMOLED display driver chip (DDIC) series “Jiyi Zhixian” R100, which is also the first application of RRAM technology in AMOLED display driver chips by Jichuang Beifang. Combining RRAM storage technology, the “Jiyi Zhixian” R100 has undergone comprehensive upgrades compared to traditional solutions. The chip supports driving OLED panels with a maximum resolution of 1320×2900, integrating LTPO3.0 dynamic frequency technology, enabling seamless frame rate switching from 1-144Hz, ensuring a smooth visual experience while precisely controlling power consumption.
NO.15
Beijing Lier: Investment in Xiwang’s First and Second Generation Self-Developed GPU Products Has Successfully Entered Mass Production
On August 27, Beijing Lier stated that its investment in Xiwang, a domestic full-stack self-developed chip company, has successfully entered mass production for its first and second generation self-developed GPU products, which can be applied in data center construction, boasting advantages in performance, energy efficiency, and other key technical indicators. The next generation of high-performance chips is expected to tape out next year.
NO.16
NVIDIA Launches GB10 Super Chip: 3nm Process, 1000 TOPS AI Computing Power
On August 27, NVIDIA launched the GB10 super chip, manufactured using TSMC’s 3nm process, employing 2.5D packaging technology, integrating a 20-core ARM v9.2 CPU and Blackwell architecture GPU, with AI computing power reaching up to 1000 TOPS. The GB10 is first applied in the DGX Spark mini AI supercomputer and workstation, aiming to deploy data center-level AI computing power to desktop platforms.
NO.17
Renesas Electronics Launches Ultra-Low-Power RL78/L23 MCU for Next-Generation Smart Appliances and Metering Products
On August 27, Renesas Electronics announced the launch of a new 16-bit RL78/L23 microcontroller (MCU) product line, further expanding its low-power RL78 product family. The RL78/L23 MCU operates at a frequency of 32MHz, integrating excellent low-power performance with dual-area flash memory, segment LCD controller, and capacitive touch capabilities, applicable in smart home appliances, consumer electronics, IoT, and metering systems. With its compact design and excellent cost-performance ratio, the RL78/L23 MCU can fully meet the dual requirements of performance and power consumption for human-machine interface (HMI) applications based on displays in modern devices.
NO.18
Horizon Journey 6E Begins Mass Production, Featured in Multiple Brand Models
On August 28, it was reported that the Horizon Journey 6E has officially begun mass production and delivery. The first batch of models includes popular vehicles from multiple brands such as Aion, MG4, Roewe M7 DMH, and Chery. As the only series of computing solutions in China that meets the full-scale assisted driving mass production requirements, the Journey 6 series covers computing power from 10TOPS to 560TOPS. The Journey 6E achieves 80TOPS computing power based on the third-generation BPU Nash architecture, with a high-performance automotive-grade CPU providing 100K DMIPS computing power, and also integrates a full-function MCU, achieving lower power consumption and better system cost with ultra-high integration, with a 10-fold improvement in Transformer computing efficiency compared to the previous generation product.
NO.19
Extreme Sea Semiconductor Releases APM32F425/427 Series High-Performance MCU with Innovations in Computing, ADC, Flash Controller, and Communication Interfaces
On August 28, Extreme Sea officially released the APM32F425/427 series of high-performance extended MCUs, integrating innovations in computing performance, ADC performance, Flash controller performance, and communication interfaces, further enhancing EMC performance, redefining the performance of the Cortex-M4F core in complex industrial scenarios. This series can be widely applied in servo drives, programmable logic controllers (PLC), photovoltaic energy storage, energy power, drones, robotics, and other industrial fields.
NO.20
Kangying Semiconductor Unveils New AI Application Storage Products
On August 28, Kangying Semiconductor launched new products, including the upgraded version of the intelligent wearable core chip—ePOP embedded storage chip, and the upgraded version of the small micro-intelligent core chip—Small PKG.eMMC embedded storage chip. The KOWIN ePOP embedded storage chip features an innovative design that integrates eMMC and LPDDR in one package, vertically mounted on the SoC, occupying no PCB board space, with a minimum thickness of only 0.75mm. The Small PKG.eMMC embedded storage chip is the latest product with a smaller size than the normal eMMC, measuring 7.2×7.2×0.8mm, reducing PCB board space by 65.3%.
NO.21
STMicroelectronics Launches VIPer11B: Low Power, Space-Saving, Super Adaptable for Consumer Electronics Under 8W
On August 28, STMicroelectronics launched the offline high-voltage converter VIPer11B, suitable for applications in lighting, smart homes, and more, integrating multiple functions to reduce BOM costs, with an SSOP10 package that saves space, low power consumption, and supports multiple topologies, with two models: VIPer113B/114B.
NO.22
Semtech Launches LR2021 Chip: Redefining IoT Connectivity Boundaries with LoRa Plus™ Technology
On August 29, Semtech announced the launch of the new generation LoRa Plus™ series first chip, LR2021. As the first chip in the LoRa Plus series, LR2021 integrates Semtech’s fourth-generation LoRa intellectual property, achieving multi-dimensional breakthroughs at the technical level, laying a strong foundation for IoT connectivity. Its core technical features are first reflected in full-field 7-scenario network coverage, supporting not only terrestrial networks but also non-terrestrial networks (NTN), compatible with sub-gigahertz, 2.4GHz ISM bands, and authorized S-band terrestrial and satellite communications, ensuring stable connections in both densely populated urban environments and remote wilderness areas, addressing the pain points of traditional IoT in extreme scenarios where connectivity is poor and transmission distance is limited.
NO.23
Google’s New TPU Ironwood Integrates 9216 Chips, Peak Performance of 4614 TFLOPS per Chip
On August 29, Google revealed more details about its next-generation TPU platform, Ironwood, and its rack-level scalability. The seventh-generation TPU architecture, codenamed Ironwood, boasts performance 24 times that of today’s most powerful supercomputers. An Ironwood Superpod will integrate 9216 chips, further expanding its scale. Ironwood is equipped with 192GB of high-bandwidth memory (HBM), with a bandwidth of up to 7.4TB/s.
NO.24
Intel’s 288-Core New Xeon Processor Revealed: Intel 18A Process, 3D Stacking and Bonding, EMIB Packaging
On August 29, Intel’s new generation Xeon processor Clearwater Forest was released, the first server chip built on Intel’s 18A process. This processor features 288 efficient cores, providing up to 576 cores in a dual-socket configuration, along with over 1152MB of L3 cache, delivering strong performance and significantly improved efficiency.
NO.25
Toshiba Launches 650V Third-Generation SiC MOSFETs with TOLL Packaging
On August 29, Toshiba launched three 650V silicon carbide (SiC) MOSFETs, featuring its latest third-generation SiC MOSFET chips and adopting surface mount TOLL packaging. These new devices are suitable for industrial equipment, such as power regulators for switch-mode power supplies and photovoltaic generators. These new products are Toshiba’s third-generation SiC MOSFETs, utilizing a universal surface mount TOLL package, which can reduce the device size by over 80% compared to through-hole packages like TO-247 and TO-247-4L(X), while increasing the power density of the devices.
NO.26
SmartSens Launches 50-Megapixel 1.0μm Smartphone CMOS Sensor SC562HS
On August 29, SmartSens announced the launch of the SC562HS smartphone CMOS sensor based on the SmartClarity-XL technology platform, with a maximum dynamic range of 88dB. This sensor adopts a 55nm Stacked BSI process, capable of capturing more details in dark areas through single-exposure dual-frame fusion in PixGain HDR mode. This mode also technically supports on-chip dual-frame fusion, reducing the computational demands of HDR video on smartphone SoCs, thus lowering power consumption and heat generation.
NO.27
Littelfuse Expands Magnetic Sensor Product Line with High-Precision TMR Angle Sensors
On August 29, Littelfuse announced the launch of two new TMR-based magnetic angle sensors, LF53466 and LF53464, which provide high-precision 0-360° angle measurements with minimal thermal drift in harsh environments. Both sensors utilize tunnel magnetoresistance (TMR) technology, configured in a dual push-pull Wheatstone bridge, each with four high-sensitivity sensing elements for precise angle detection along the X and Y axes. These sensors offer excellent thermal stability, wide power supply voltage compatibility, and higher measurement accuracy, making them a strong alternative to Hall effect devices.
NO.28
MCX W23 Wireless MCU Released! Empowering Low-Power, Lightweight, and Smarter Edge Wireless Sensing Applications
On August 29, NXP released the dedicated wireless microcontroller platform MCX W23, designed for battery-powered sensing devices, widely applicable in micro medical devices, smart sensing systems, body-worn and portable sensors, and various actuator applications. The MCX W23 MCU features the popular Arm Cortex-M33 core, operating at 32MHz, supporting 1MB flash memory and 128kB RAM, in a compact 2.5×2.6mm package.
NO.29
Audiwei Launches Smart Server Liquid Cooling Dedicated Series Flow Sensors
On August 30, Audiwei launched a series of flow sensors dedicated to smart server liquid cooling, employing a dual-technology architecture of ultrasonic and vortex street, constructing a full-link flow monitoring system from chip-level cooling to cabinet-level thermal management. With high-precision digital measurement and millisecond-level response speed, it achieves a dynamic balance between energy consumption and efficiency in cooling systems.
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Anke Technology is a national-level specialized and innovative “little giant” enterprise engaged in the research, production, and sales of semiconductor chip testing and programming equipment. The company is committed to empowering the entire industry chain, including Fabless, IDM, OSAT, wafer fabs, and end-device companies, through innovative semiconductor testing technologies and solutions. Anke’s pioneering fully automated aging testing ABI (Auto Burn-In) system significantly enhances the aging testing efficiency of customer chips and reduces Per DUT testing costs. The company also provides equipment products and solutions for various stages from PSV, CP, FT, BI, SLT, to programming, perfectly integrating product technology advantages, system-level expertise, and a globally distributed R&D and sales service network to create value for customers in market competition.
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