Unisoc T616 Core Board is based on the DynamIQ new generation big.LITTLE architecture design, an octa-core LTE platform that brings a new leap in imaging performance. Its unique architectural design, combined with efficient image processing capabilities, allows users to enjoy high-quality imaging experiences while maintaining efficient system operation. This platform integrates two Arm Cortex-A75 CPUs running up to 2.0GHz and six Arm Cortex-A55 processors running at 1.8GHz, and is equipped with the high-performance next-generation Mali G57 GPU, ensuring outstanding performance.
Imaging Technology
The T616 processor supports high-end quad-camera configurations and is equipped with Unisoc’s self-developed fifth-generation imaging engine, Vivimagic solution. Through a series of advanced technologies such as AI portrait segmentation, seamless zoom, intelligent photo editing, and scene detection, it achieves significant effects in color accuracy, image quality enhancement, and power consumption reduction. Additionally, it supports 64-megapixel shooting based on full HD FHD, as well as distortion correction algorithms based on ultra-wide-angle lenses, ensuring the authenticity and high fidelity of image correction.
The platform also incorporates technologies such as infinite blue light suppression adjustment, adaptive screen brightness control, and intelligent resolution switching, ensuring long battery life while protecting user eyesight.
Data Transmission
In terms of connectivity, the Unisoc T616 platform has made significant improvements. The platform introduces UFS 2.1 high-speed flash memory interface, greatly enhancing data access speed and efficiency. Furthermore, the T616 integrates other advanced technologies to provide users with a smoother and more stable connectivity experience.
Detailed Specifications of the Unisoc T616 Core Board:
| Product | T616UMS9230T |
| Package Type | LCC146+LGA128 |
| Dimensions (mm) | 40.5×40.5×2.85mm |
| Weight (g) | Approximately 11g |
| Frequency Bands | LTE FDD(B1/2/3/5/7/8/20/28) TDD(B34/38/39/40/41) WCDMA(B1/2/5/8) TD-SCDMA(B34/39) GSM(B2/3/5/8) |
| Satellite Positioning (GNSS) | GPS/Glonass/Beidou/Galileo A-GNSS |
| WIFI | Dual band 2.4/5GHz 1×1 20/40/80 MHz IEEE 802.11 a/b/g/n/ac |
| Application Processor | 64KB L1 I-cache and 64 KB L1 D-cache, 256 KB L2 cache for ARM Cortex-A75 processor 32KB L1 I-cache and 32 KB L1 D-cache, 128 KB L2 cache for ARM Cortex-A55 processor Shared 1024KB L3 I-cache |
| Graphics Processor | Arm Mali G57 1Cocre @750MHz Manhattan ES3.0 18fps |
| Memory | eMMC5.1 + LPDDR4x |
| Voltage Characteristics | Supply Voltage: 3.55~4.4 V |
| Operating Temperature | -20℃~+65℃ |
| Sleep Current | 3.3mA |
| Operating Current | < 3.5A |
| Data Transmission | |
| LTE Features | Supports 3GPP R12 CAT4 FDD and TDD, supports 1.4-20 MHZ bandwidth, supports downlink (2×2) MIMO, modulation modes: DL: QPSK, 16QAM, 64QAM, UL: QPSK, 16QAM Maximum data transmission rate 150Mbps (DL), 50Mbps (UL) |
| WCDMA Features | Supports 3GPP R12 CAT4 FDD and TDD, supports 1.4-20 MHZ bandwidth, supports downlink (2×2) MIMO, modulation modes: DL: QPSK, 16QAM, 64QAM, UL: QPSK, 16QAM Maximum data transmission rate 150Mbps (DL), 50Mbps (UL) |
| TD-SCDMA Features | Supports 3GPP R9 TD-HSDPA: Max 2.8Mbps (DL) TD-HSDPA: Max 2.2Mbps (UL) |
| CDMA Features | Supports CDMA2000 EVDO Rev.B, maximum data transmission rate: 3.1MBPS (DL), 1.8MBPS (UL) |
| GSM/GPRS/EDGE Features | GPRS: Supports GPRS Multi-slot Class12, encoding formats: CS 1~4 EDGE: Supports EDGE Multi-slot Class12 Modulation modes: GMSK and 8-PSK Maximum data transmission rate: 296 Kbps (DL); 236.8 Kbps (UL) |
| WLAN Features | Supports dual-band 2.4GHz/5GHz, supports IEEE 802.11a/b/g/n/ac, supports AP mode |
| Bluetooth Features | BT 5.0 |
| Multimedia | |
| Display | FHD+(2560×1080)@60fps and HD+(1680×720)@90fps |
| Video Codec | Encoding + Decoding: H.265/H.264 1080p @ 60 fps |
| Interfaces | |
| USIM | 2 sets of USIM/SIM interfaces; 1.8V and 3V; supports dual SIM dual standby |
| USB | Supports USB 2.0 high-speed mode, supports USB OTG |
| SDIO | Supports SD 3.0 protocol; supports hot swapping |
| LCM | 1 channel 4-lane MIPI DSI, data transfer rate: up to 1.6 Gbps/lane, supports FHD + (2520 × 1080) @ 60 fps and HD + (1680 × 720) @ 90 fps |
| I2C | Supports 7 I2C interfaces |
| ADC | 1 channel 12-bit general-purpose ADC interface |
| I2S | Supports 2 sets of I2S interfaces |
| SPI | 4 sets of SPI, only supports master mode |
| UART | Supports 4 sets of UART; UART1 is dedicated for debugging |
| Analog Audio | 3 input channels: mic*3, 3 output channels: receiver + speaker + headphone |
| Antenna | Cellular antenna interface*2 (diversity + main); GNSS antenna interface*1; Wi-Fi/Bluetooth antenna interface*1 |
| Camera | 2 channels 4-lane MIPI CSI, 1 channel 1-lane MIPI CSI (4lane+4lane+lane) All: 2.5Gbps/lane |
| Software Features | |
| Operating System | Android 12/14 |
| Charging Function | 5V/2A |
| Software Upgrade | USB 2.0 interface; DFOTA |
| Certification | |
| RoHS | All components fully comply with EU RoHS standards |
Recommended Reading
-
MediaTek Dimensity 9000 flagship 5G chip specifications and performance introduction
-
MediaTek Dimensity 8000 5G mobile platform detailed specifications
-
New Move Technology XY6877ZA (MTK6877 platform) – New 6nm popular Wi-Fi 6 – 5G AI core board
-
New Move Technology MTK6833 (Dimensity 700 platform) 5G all-network communication – Introduction to Android smart core board
-
New Move Technology XY6853ZA (MTK6853 platform) Android core board – 5G all-network communication AI smart module
-
New Move Technology launches AI smart module XY8788(I500P)
-
New Move Technology XY6765CA (MTK6765 platform) octa-core Android core board – Introduction to Android development board solution
-
New Move Technology XY6762CA (MTK6762 platform) Android 4G Android core board/development board – 4G smart module applications
-
New Move Technology 4G all-network communication MTK6761 Android motherboard | Custom development of Android smart modules
-
New Move Technology XY6739CW (MTK6739 platform) function introduction_MT4G Android core board
-
New Move Technology XY6785CD (MTK6785 platform) function specifications introduction_MT4G Android core board
-
New Move Technology XY450 (Qualcomm SDM450 platform) Android smart module_4G all-network communication_supports dual-screen display and dual-touch control
-
XY310/XY610/XY618 (Unisoc T310/T610/T618 platform) Android core board_4G all-network communication_BOM fully localized
-
Android motherboard smart hardware custom development and production
-
Android development board_Android smart module development evaluation kit
-
Android 4G industrial control motherboard_industrial touch all-in-one advertising machine motherboard development board_smart hardware customization
-
Shenzhen New Move Technology Co., Ltd. product manual update (including MTK, Unisoc, Qualcomm mobile SOC platform models)
-
Summary of MediaTek, Qualcomm, Unisoc mobile SOC platform models (including detailed specifications)
New Move Technology is a leading IoT solution provider in the industry
About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering customers a full range of services from R&D to manufacturing.
The company is headquartered in Bao’an, Shenzhen, with a research and development center in Changsha, focusing on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Unisoc, and Qualcomm (Qualcomm), receiving strong technical support from chip manufacturers. Our company keeps pace with major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We offer comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, thus providing strong support for customers to quickly launch products. The successfully developed Android motherboards based on MediaTek, Unisoc, and Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
Contact Us
Headquarters: 4th Floor, Block A, Jinyuan Business Building, No. 300 Xixiang Avenue, Bao’an District, Shenzhen
Customer Hotline: Mr. Liu, phone and WeChat same number 18688981861
