[SemiDrive Technology June News]
In June, SemiDrive Technology celebrates its 7th anniversary. On this special day, the founder of SemiDrive, Qiu Yujing, wrote a heartfelt message titled “Grateful for the Journey, Committed to Our Mission”:
“The seven-year journey is the result of the dedication and perseverance of every SemiDrive employee, which has forged the vibrant energy of today’s SemiDrive. Let us leave a solid mark in the core ‘chip’ track of smart vehicles. The strength of the team is our most valuable asset!
In seven years, we have shipped over 8 million units, with more than 100 models featuring SemiDrive Inside, thanks to the trust and support of our customers and partners, which has propelled us forward. Like-minded and collaboratively innovative, we will continue to work together to fulfill the ‘chip’ mission bestowed by the times.
Today, China’s automotive industry has both new energy and intelligence as leading advantages, and the ‘Chinese solution’ in the automotive industry is leading the world. Represented by SemiDrive Technology, domestic automotive chips have not only achieved breakthroughs from 0 to 1 in the fields of smart cockpits and intelligent vehicle control but also have the opportunity to redefine smart mobility together with Chinese car manufacturers, empowering the global automotive industry transformation.
Standing at a new starting point, let us uphold our original intention and strive towards the vision of becoming ‘the most trusted automotive semiconductor company’!”
Thank you for your continued attention and support for SemiDrive Technology! Seven years of sharpening the sword, the future is promising!
PART 01
Company News
SemiDrive Technology participated in the 2025 China Automotive Chongqing Forum to discuss the future of “New Intelligent Vehicles” with the industry.
On June 7, the 2025 China Automotive Chongqing Forum successfully concluded. At the closing plenary session themed “Co-creating the Future of ‘New Intelligent Vehicles’,” SemiDrive Technology’s CTO Sun Mingle was invited to give a speech and participate in a roundtable discussion with experts and industry leaders from companies such as NIO, Lantu, Deep Blue, Avita, Li Auto, Leap Motor, and Xpeng to discuss new developments in the smart automotive industry. Sun Mingle shared how SemiDrive is responding to industry challenges and empowering future smart mobility through three major transformations: “from function to experience,” “from partial to holistic,” and “from independence to win-win.”
SemiDrive Technology showcased at the Hong Kong Auto Show, demonstrating the charm of Chinese smart vehicle chips.
On June 12, the 2025 International Automotive and Supply Chain Expo (Hong Kong) officially opened at the AsiaWorld-Expo. As an important window for the internationalization of Chinese automobiles, this year’s Hong Kong Auto Show gathered global industry forces, and SemiDrive Technology, as a leading company in Chinese smart vehicle chips, made its debut, showcasing the technological innovations and mass production practices of Chinese smart cockpit and intelligent vehicle control chip products to the world, engaging in in-depth exchanges with domestic and international industry chain partners to discuss new opportunities for future development.
SemiDrive Technology awarded the “Innovation Bull Award,” continuously empowering the smart mobility “chip” experience.
On June 14, the 2025 Innovation Bull Award ceremony hosted by China Securities Journal was held in Putuo District, Shanghai, where the winners of the 2025 Innovation Bull Award were announced. SemiDrive Technology was awarded the “Bull Innovation Enterprise Award (New Generation Information Technology).”
The Chery Tiggo 7 High Energy Edition officially launched, powered by the SemiDrive X9SP enabling a super interactive AI cockpit.
On June 17, Chery Automobile announced the official launch of the Tiggo 7 High Energy Edition, which features significant upgrades in configuration as an annual facelift model. The 1.5T model is equipped with the SemiDrive X9SP cockpit chip, supporting a highly reliable instrument and a 13.2-inch super interactive AI digital screen, enabling a “more understanding you” intelligent cockpit.
SemiDrive Technology and ROHM jointly developed the vehicle-mounted SoC X9SP reference design, equipped with ROHM’s PMIC for SoC, facilitating the popularization of smart cockpits!
Targeting mid-to-high-end smart cockpits, SemiDrive Technology and ROHM jointly developed a new reference design “REF68003” based on the vehicle-mounted SoC “X9SP.” ROHM provides PMICs for SoC, including “BD96811F44-C,” “BD96806Q04-C,” “BD96806Q05-C,” and “BD96806Q06-C,” which comply with ISO 26262 and ASIL-B, helping to achieve various high-performance vehicle-mounted applications. In the future, ROHM will continue to develop products suitable for automotive infotainment systems, contributing to enhancing the convenience and safety of vehicles.
Online Classroom | Comprehensive Analysis and Development Applications of the SemiDrive E3650 Regional Controller MCU
This online classroom will take you deep into the product mass production and typical application cases of the SemiDrive E3650, demonstrating how to efficiently build high-quality automotive software for the future using the IAR development platform.
Scan to watch the live replay:
South China Morning Post: SemiDrive to sell cockpit chips to European car firm
The Chinese automotive chip firm SemiDrive will start supplying its cockpit system-on-a-chip (SoC) to an undisclosed European carmaker late next year, marking its first collaboration on the continent in a push for global sales, a senior executive has said.
The chips would be used in several of the carmaker’s models including sedans and SUVs produced and sold in the Europe, Middle East and Africa region, general manager Eugene Wang said. The vehicles were expected to feature its X9 SoC, which integrates high-performance CPUs, GPUs, AI accelerators, and video processors designed for advanced cockpit applications, he added.
Industry News
PART 2
Zuosi Automotive Research: Research on Cockpit Domain Controllers: Three AI-oriented Cockpit Domain Control Architectures
Driven by the functional demands of edge-side AI large models, 3D HMI, in-vehicle gaming, immersive interaction, and the integration of smart cockpits and intelligent driving, the cockpit requires higher performance such as high computing power, large bandwidth, and high-speed communication to support complex algorithm needs. In terms of high computing power, the core cockpit chip products such as CPU, GPU, and NPU are continuously upgrading and evolving. Currently, the CPU computing power of mainstream high-end cockpit SoCs in mass production has surpassed 200+ KDMIPS, while cockpit chip solutions with CPU computing power of 600+ KDMIPS are also in the pipeline; the AI computing power of cockpit mass production models is currently around 60 TOPS, with future products expected to reach 320 TOPS, 400 TOPS, or even 720 TOPS in AI computing power for cockpit domain control.
Power, Chassis, and Intelligent Driving Integration Technology Exchange Meeting held at Geely
On the morning of June 27, the Alliance Intelligent Chassis Working Group and the Intelligent Chassis Sub-Committee held a technical exchange meeting on power, chassis, and intelligent driving in Ningbo. At the meeting, Professor Xiong Lu, Dean of the Automotive College of Tongji University, Geely Automotive Research Institute’s Gong Huijun, Product Director Zhang Ming from Jingwei Hengrun, Assistant Researcher Ma Ruihai from Tsinghua University, and Zhang Xitong, General Manager of MCU Product Line at SemiDrive Technology, along with Xu Leilei from Geely Automotive Research Institute, shared and exchanged on topics such as the technological transformation and future development trends of intelligent steer-by-wire chassis technology, AI digital chassis technology with integrated perception, development of power chassis domain controllers, safety-oriented cross-domain integration control technology for chassis, target architecture for motion control domains in intelligent scenarios, intelligent control MCUs for XYZ fully integrated intelligent steer-by-wire chassis, and the construction of multi-domain dynamic adaptive collaborative control systems.
Yanzhi Automotive: High-end Intelligent Control MCU, the Key Force to Open a New Era of Automotive Intelligence
The traditional single-function basic control MCU can no longer meet the performance upgrade needs of the entire vehicle system. The industry urgently needs a new species of MCU that can handle complex algorithms, support multi-task concurrency, while also possessing high integration and comprehensive safety protection capabilities, hence the emergence of the “high-end intelligent control MCU.”
Globally, semiconductor giants such as Infineon and Renesas are accelerating their layout in the “high-end intelligent control MCU” track. In China, the booming automotive market and the strong demand for supply chain security and autonomy have prompted domestic chip companies to catch up quickly, accelerating technological breakthroughs and product iterations. In the field of domestic automotive-grade chips, SemiDrive Technology, with its core product of intelligent vehicle control—the E3 series MCU, is innovating technology and ecosystem collaboration for the new generation of electronic and electrical architecture, setting a benchmark for the rise of domestic high-end intelligent control MCUs.
Gaogong Intelligent Automotive: “AI Large Models” Restructuring Cockpit SoC, Who is Racing for the “Platform Upgrade” Dividend?
According to Gaogong Intelligent Automotive, Tier 1 manufacturers such as Visteon, Desay SV, and Botai Internet of Vehicles are accelerating the development of new generation intelligent cockpit solutions based on Qualcomm’s Snapdragon cockpit platform supreme version (QAM8397P), while Beidou Zhilian is developing intelligent cockpit solutions based on the MT8678 platform. Additionally, many automotive companies are collaborating with MediaTek, AMD, Intel, and SemiDrive Technology.
Behind this, most of the smart cockpit chips that have been mass-produced in the market cannot support the implementation of AI large models due to their AI computing power. Even small parameter models impose requirements on the computing power, bandwidth, and power consumption of vehicle-side chips.
About SemiDrive
SemiDrive Technology is a leader in all-scenario smart vehicle chips, focusing on providing high-performance, high-reliability automotive-grade chips covering the fields of smart cockpits and intelligent vehicle control, encompassing the most core chip categories of future automotive electronic and electrical architecture.
All series of SemiDrive chips have been mass-produced, with shipments exceeding 8 million units. SemiDrive currently has over 200 designated projects, serving more than 260 customers, covering over 90% of domestic major manufacturers and some international mainstream automakers, including SAIC, Chery, Changan, Dongfeng, FAW, Nissan, Honda, Volkswagen, Li Auto, etc.
Five Major Certifications Empowering SemiDrive
· TÜV Rheinland ISO 26262 ASIL D Functional Safety Management System Certification
· AEC-Q100 Grade 1/Grade 2 Reliability Certification
· TÜV Rheinland ISO 26262 ASIL B/D Functional Safety Product Certification
· TÜV Rheinland ISO/SAE 21434 Automotive Cybersecurity Management System Certification
· Certification from the State Administration for Market Regulation and the National Cryptography Administration for National Secret Information Security
