For instance, in the USB product line, the 7-port multifunction HUB chip CH339 combines various interface technologies to meet the expansion needs of USB ports, Ethernet interfaces, JTAG/serial/SPI/I2C interfaces, while integrating Type-C PD functionality to support various Type-C application scenarios. The continuous communication baud rate of the USB to serial series chips reaches up to 15Mbps, with a wide interface voltage range of 1.8V/2.5V/3.3V/5V compatible with various main controllers. A single chip can achieve high-speed USB to 8 serial ports, among other solutions.
The Ethernet product line is equipped with a unique MAC address and supports 1.8V/2.5V/3.3V interface voltages, satisfying various customer needs through multi-layered product forms. Among them, the PHY chip CH182 is based on self-developed transceiver technology, offering various packaging and customizable pin layouts, with a QFN20 package size of only 3*3mm. The CH390 integrates Ethernet MAC and PHY, suitable for expanding Ethernet interfaces and multi-port applications for MCUs and other main controllers.
Chips like CH395/CH394/CH9121 come with built-in Ethernet protocol stacks, saving customers from the cumbersome protocol stack development process and shortening solution development time. These chips provide convenient and flexible solutions for efficient access to Ethernet in embedded devices.
Thanks to self-developed RF radio frequency, baseband algorithms, and protocol stack technologies, Qinheng’s low-power Bluetooth MCUs and adapter chips significantly reduce the complexity of professional Bluetooth and 2.4G solutions while achieving excellent performance and power consumption. For example, the high-end wireless HID application built on the CH592/CH585 single chip can achieve a reporting rate of up to 8kHz, providing ultra-low latency high-performance solutions for professional computer peripherals.
In order to allow more customers to benefit from Qinheng’s connection technology, the company has introduced the advantages of its self-developed connection technology into the MCU field, empowering a wider range of connection and networking applications through interconnected MCUs that integrate various professional communication interfaces.
The core components of system-level chips like MCUs include the microprocessor core and interface peripherals. Qinheng’s self-developed Qingke RISC-V core not only eliminates the licensing and commission fees of external cores, reducing MCU costs, but also enhances interrupt response speed for high-speed data transmission applications through interrupt-free techniques; increases code density for network applications through custom protocol stack application instructions; and reduces I/O resource usage for small package, low-pin MCUs through single-wire debugging and 1.5-wire debugging techniques, improving debugging and download efficiency. Compared with commonly used foreign proprietary instruction set cores, Qingke RISC-V performs comparably and excels in certain metrics.
On the other hand, thanks to the advantages of self-developed connection technology, the integration of the Qingke RISC-V core with high-speed USB, USB PD, Ethernet, and low-power Bluetooth peripherals is even more seamless, allowing Qinheng’s MCUs to excel in integration, connectivity, performance, and power consumption. For example, the CH32V317, with built-in high-speed USB PHY and Ethernet PHY, saves customers the cost of external PHY chips, reducing PCB area while saving a significant number of I/O pins; the CH32V208 integrates USB, Bluetooth, and Ethernet functions to provide a single-chip solution for professional gateway applications. The Qingke RISC-V series MCUs support the free professional integrated development environment MRS IDE, and the deeply optimized chips paired with rich development tools help customers further reduce costs and accelerate product market entry.
Based on the core technology self-developed full-stack R&D model, Qinheng will develop more innovative chip products in the future, helping customers respond to challenges and maintain advantages in fierce market competition through advanced solutions.