Overview of Semiconductor Manufacturing

1. Wafer Fabrication Plants

1.1. Advanced Processes

  • Domestic: SMIC
  • International: TSMC (Taiwan), Samsung (South Korea), Rapidus (Japan), Intel (USA)

The gap is significant (approximately 2 generations, with SMIC achieving 7nm mass production through multiple polishing):

  • TSMC – 3nm/5nm/7nm account for over 70% of revenue, with 2nm risk production starting this year.

1.2. Mature Processes

  • Domestic: Hua Hong Semiconductor, Jinghe Integrated
  • International: UMC (Taiwan), GlobalFoundries (USA)

The gap is relatively smaller compared to advanced processes.

2. Photolithography Machines

  • Domestic: Shanghai Micro Electronics, Yulian Sheng
  • International: ASML (Netherlands), Nikon (Japan)

The gap is enormous.

3. Etching Equipment

  • Domestic: Northern Huachuang, Zhongwei Company
  • International: Applied Materials (AMAT, USA), Lam Research (USA)

Northern Huachuang’s PVD process mainly focuses on mature processes; Applied Materials’ CVD process is the global leader, capable of achieving 2-3nm, progressing towards 1nm with EUV.

4. Thin Film Deposition Equipment

  • Domestic: Tuojing Technology
  • International: Lam Research (USA), Tokyo Electron (TEL, Japan)

Tuojing Technology focuses on 14~55nm processes.

5. Coating and Developing Equipment

  • Domestic: Xinyuan Micro
  • International: Tokyo Electron (TEL, Japan)

Xinyuan Micro mainly focuses on mature processes; Tokyo Electron holds over 80% market share, with 100% share in the EUV market.

6. Cleaning Equipment

  • Domestic: Yitang Co., Shengmei Shanghai
  • International: Dainippon Screen (Japan), Tokyo Electron (TEL, Japan), Lam Research (USA)

The gap is relatively small.

7. CMP Polishing Equipment

  • Domestic: Huahai Qingke
  • International: Applied Materials (AMAT, USA), Ebara Corporation (Japan)

Huahai Qingke focuses on mature processes above 14nm.

8. Measurement and Testing Equipment

  • Domestic: Zhongke Feicai, Jingce Electronics
  • International: KLA (USA), Applied Materials (AMAT, USA), Hitachi (Japan)

Domestic technology is evolving from 14nm to 7nm, while international technology has reached 2-3nm levels.

9. Packaging and Testing

  • Domestic: Changdian Technology, Tongfu Microelectronics
  • International: ASE (Taiwan), Amkor (USA)

The gap is relatively small.

10. Large Silicon Wafers

  • Domestic: Shanghai Silicon Industry, Yiswei
  • International: Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan)

Shin-Etsu Chemical and GlobalWafers hold over 90% market share.

11. CMP Slurry

  • Domestic: Anji Technology, Dinglong Co.
  • International: Cabot (USA), Merck (USA), Dow (USA), Fujifilm (Japan), Hitachi (Japan)

The gap is relatively small.

12. Photoresists

  • Domestic: Nanda Optoelectronics, Tongcheng New Materials
  • International: JSR (Japan), Tokyo Ohka Kogyo (TOK, Japan), Shin-Etsu Chemical (Japan)

Domestic technology has just broken through 28nm, with a significant gap.

13. Electronic Specialty Gases

  • Domestic: Huate Gas, Kemet, Yake Technology
  • International: Air Products (USA), Linde Group (Germany), Air Liquide (France), Sun Chemical (Japan)

14. EDA

  • Domestic: Huada Jiutian, Gai Lun Electronics, Guangli Micro
  • International: Synopsys (USA), Cadence (USA), Siemens (Germany)

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