NVIDIA’s Next-Generation Rubin Chip Has Entered Tape-Out

NVIDIA's Next-Generation Rubin Chip Has Entered Tape-Out

Following NVIDIA’s announcement at the end of August regarding the mass production of the Rubin architecture chip planned for next year, NVIDIA discussed the progress of Rubin at the Goldman Sachs Technology Conference on September 8.

NVIDIA CFO Colette Kress stated that the Rubin chip is already preparing for market entry, and the Rubin architecture will consist of six chips, all of which have entered tape-out.

Colette Kress mentioned that NVIDIA’s data center revenue for the second quarter of fiscal year 2026 includes various components, including the Blackwell architecture’s GB200, B200, and the Blackwell Ultra architecture’s GB300. The GB200 and GB300 are still being shipped in the third quarter. Looking ahead, before Rubin enters the market, NVIDIA has already seen several gigawatts of demand associated with it.

Colette Kress noted that discussions a year ago focused on the transition between the Blackwell architecture and others; now that Blackwell has entered the market, including Blackwell Ultra, NVIDIA’s pace has been relatively smooth this year. Another frequently discussed topic is whether there is still a significant need for computation during pre-training, post-training, and inference stages. It can be observed that there remains a huge demand for computation over the past year, a significant portion of which is driven by inference models.

Previously, Colette Kress mentioned during a conference call following NVIDIA’s earnings report at the end of August that capital expenditures related to data center infrastructure are expected to reach $3 trillion to $4 trillion over the next five years.

NVIDIA's Next-Generation Rubin Chip Has Entered Tape-Out

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