IntroductionTraditional Rigid PCBs are made from fiberglass or epoxy resin, offering stability and mechanical strength, widely used in devices such as motherboards and graphics cards. In contrast, Flexible PCBs (FPC) utilize flexible polyimide (PI) or polyester (PET) films, allowing for bending and folding, with advantages such as lightweight, high-density wiring, and spatial adaptability.
Industry trends indicate that FPC is developing towards high density, multilayer, rigid-flex combinations, and ultra-thin designs.
This article will introduce Apple’s FPC manufacturers based on the official supplier list and analyze their factory layouts and migration trends.
1. Career Technology (Mfg.) Co., Ltd.
Background: A well-established FPC manufacturer in Taiwan, focusing on high-density flexible circuit boards for smartphones and wearable devices.Headquarters Location: ChinaNew Taipei City, TaiwanApple Factory Locations: Jiangsu, TaiwanRecent Factory Migration Direction:No clear public information on Southeast Asia layout
2. Compeq Manufacturing Co., Ltd.
Background: One of Taiwan’s leading PCB manufacturers, covering HDI, rigid, and flexible/rigid-flex circuit boards, and a long-term partner of Apple.Headquarters Location: ChinaTaoyuan City, Taiwan.Apple Factory Locations: Chongqing, Guangdong, Jiangsu, TaiwanRecent Factory Migration Direction:Announced in late 2024 to establish new HDI and advanced FPC factories in Thailand to respond to Apple’s and North American clients’ de-China strategies.
3. Flexium Interconnect Inc.
Background: One of the first FPC manufacturers to enter Apple’s supply chain in Taiwan, with strong technical capabilities, products used in core modules for iPhone, iPad, etc.Headquarters Location: ChinaKaohsiung City, TaiwanApple Factory Locations: Jiangsu, TaiwanRecent Factory Migration Direction:No news on expansion in Southeast Asia yet
4. Fujikura Limited
Background: A century-old Japanese company, its Fujikura Printed Circuits division focuses on the development of flexible circuit boards with high reliability.Headquarters Location:Tokyo, JapanApple Factory Locations: Shanghai, China; Niigata, Tochigi, Japan; Bangkok, Lamphun, Pathum Thani, Prachin Buri, Thailand
Recent Factory Migration Direction: Although specific migration plans have not been disclosed, the overall Japanese FPC industry is expanding production lines in Vietnam and Thailand to reduce costs and be closer to the Southeast Asian electronics manufacturing cluster.
5. NOK Corporation
Background: One of the top three FPC manufacturers globally, supplying Apple, Sony, Samsung, and other smart terminal brands.Headquarters Location:Minato, Tokyo, JapanApple Factory Locations: Guangdong, Jiangsu, China; Ibaraki, Japan; Phra Nakhon Si Ayutthaya, Thailand; Hung Yen, Vietnam
Recent Factory Migration Direction: In 2022, NOK invested approximately 3.5 billion yen in the construction of a factory in southern Vietnam, near Ho Chi Minh City, expanding capacity by about 1.4 times.
6. Suzhou Dongshan Precision
Background: A mainland China FPC and high-end PCB manufacturer, actively laying out in the Apple, automotive, and communication supply chains.Headquarters Location:Jiangsu Province, ChinaApple Factory Locations: JiangsuRecent Factory Migration Direction: In April 2024, the main structure of the factory located in Thailand’s Lokana was successfully topped out, marking Dongshan Precision’s first overseas production base in Southeast Asia.
7. Zhen Ding Technology Holding Co., Ltd.
Background: The largest FPC supplier globally, one of Apple’s core partners for flexible circuit boards.Headquarters Location:Taoyuan City, TaiwanApple Factory Locations: Guangdong, Hebei, Jiangsu, China; Tamil Nadu, IndiaRecent Factory Migration Direction: Zhen Ding plans to establish a new factory in Thailand, signing an MOU with Thailand’s Saha Group in 2023, with production expected to start in 2025.
Conclusion: Apple’s “Vertical Integration” and Redefining the Value of FPC
In the deep evolution of Apple’s supply chain, the vertical integration of chips is reshaping the value structure of upstream electronic materials.
Taking the MacBook as an example, since adopting the self-developed M series chips, Apple has integrated the CPU, GPU, neural engine, and memory controller into a single SoC package (SiP), reducing the motherboard area by more than 30%.
FPC (Flexible Circuit Board) continues to expand in forms such as foldable screens, AR glasses, and wearable devices due to its characteristics of being bendable, lightweight, and high-density.
It allows electronic design to transition from a “flat” to a “three-dimensional” era. It can achieve complex connections in confined spaces and is a key connecting component for iPhone, Apple Watch, AirPods, AR/VR devices. In the future, as foldable screens and wearable devices become more prevalent, the technical value of FPC will continue to rise.
List of Apple Rigid PCB Suppliers and Their Distribution