NVIDIA has given a positive evaluation of the factory audit and mass production in Thailand. The first version of the COWOP samples has been delivered for testing. Unimicron has used M8 material for the panels sent to Taiwan’s Nanya Technology for verification. The flatness of Unimicron’s samples is good, but the yield is low due to uneven current distribution caused by the mSAP routing density. The SOP process needs to switch to a narrow dry film process and vacuum lamination treatment. Xinxing has encountered issues with voids during lamination using ACCM material, which has been reported to NVIDIA, and development of the material has been paused. The BGA pitch has been adjusted from 0.15mm to 0.18mm, and the copper foil requirement has changed to HVLP4 copper foil. The production process has shifted from mSAP to a standard HDI process, but it must meet line widths of 40 microns, line spacing of 35 microns, and copper thickness of 18 microns (beyond normal HDI process capabilities). It has been confirmed that Doosan M8 material will be used for production following the traditional HDI process. Key vendor updates: 1. Unimicron: A strict verification process has been established for small batch trials of complex products, gaining recognition from American clients; in contact with Google to promote RPCB rectification (to be completed in October, including factory corridor connections and the introduction of AGV systems). After rectification, the division may turn profitable; there is no serious equipment shortage, with dozens of Mitsubishi laser machines ordered for the Thailand factory, although the delivery time for ATE testing machines is long. 2. Shenghong: Rapid development in the HDI field, accelerating the construction of production lines during the Spring Festival to seize opportunities, ordering a large number of laser machines to capture a significant share of the domestic market, seemingly working on 44-layer HDI (Rubin’s new CPX uses a 44-layer midplane to replace cables).
Updates on customer product differences: 1. Multi-layer boards and HDI applications: Amazon AWS TR3 uses a 26-layer through-hole board (with 22 layers of HDI in the computing section); Google uses a 34-layer board with a 16+2+16 structure; Microsoft uses a 50-layer board with a 16+34 structure; Meta uses a 30-layer board with a 22+8 structure (the next generation may introduce 1+N+1+M); AMD uses a 24+36 structure (all include 3-4 layers of HDI, with small volumes). 2. Order impacts: The Huai’an class carrier board factory is limited in capacity due to a peak in orders for new Apple products; Unimicron’s capacity increase after rectification will support clients such as AWS, Google, Microsoft, and NVIDIA.
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