Jiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry Standardization

2025Striving Forward, Looking to the FutureSET SAILJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationGroup Standards

Recently, Jiasengde Technologyhas deeply participated in the formulation of a key group standard T/TMAC 174—2025 “Flexible Circuit Board Substrate Flexible Copper Clad Laminate (FCCL)” by the China Technology Market Association, leveraging its profound technical accumulation and rich practical experience in the field of flexible circuit board substrate flexible copper clad laminates. The company’s chairman, Mr. Li Shengguo, also contributed his professional wisdom and strength as a co-author of this standard.

Jiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationCorporate DevelopmentJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry Standardization

This standard specifies the technical requirements, inspection methods, inspection rules, marking, packaging, transportation, and storage of flexible circuit board substrate flexible copper clad laminates (FCCL), applicable to the research and development, production, and inspection of flexible copper clad laminates used in flexible circuit boards. It identifies and analyzes key indicators affecting the product quality of flexible circuit board substrate flexible copper clad laminates, adhering to the principles of “normative, scientific, advanced, and feasible”. By formulating and implementing technical specifications, it provides a standard basis for the flexible circuit board substrate flexible copper clad laminate industry, promoting the unity of economic and social benefits.

As a leading domestic manufacturer of microelectronic-grade special functional epoxy resins and curing agents (phenolic resins), Jiasengde Technology has always focused on the research and production of high-quality, low-carbon, and environmentally friendly products, adhering to the principle of “serving the industry and continuous improvement”, and actively participating in the formulation of industry group standards.

In the future, Jiasengde Technology will continue to use digital transformation as an engine to comprehensively promote the upgrade of enterprises towards innovation-driven and green low-carbon directions, continuously deepening the “standards-technology-industry” linkage, and enhancing collaboration with universities and research institutes in the “industry-university-research-application” synergy. Relying on the technical advantages of the group standards it participates in formulating, it will cultivate new productive forces and new economic growth points, assisting the rapid development of the special epoxy resin industry.

Jiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationENDJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationJiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry StandardizationScan to Follow UsGet the Latest News Every Day

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