Jiasengde Technology Participates in the Development of Group Standards for Flexible Circuit Board Substrate Flexible Copper Clad Laminate, Leading Industry Standardization
2025Striving Forward, Looking to the FutureSET SAILGroup Standards Recently, Jiasengde Technologyhas deeply participated in the formulation of a key group standard T/TMAC 174—2025 “Flexible Circuit Board Substrate Flexible Copper Clad Laminate (FCCL)” by the China Technology Market Association, leveraging its profound technical accumulation and rich practical experience in the field of flexible circuit board substrate … Read more