Comparing DSPs to “mathematical prodigies”: while ordinary CPUs (like MCUs) excel at multitasking (the “liberal arts students”), DSPs specialize in quickly solving complex equations (the “science students”), achieving “mental calculation abilities” through hardware acceleration (such as MAC units), making them suitable for the “high-intensity mathematics competitions” of real-time signal processing.
1. Core Functions and Architectural Features
DSP (Digital Signal Processing) chips are microprocessors designed specifically for high-speed mathematical computations, with the primary goal of real-time processing of digital signals (such as audio, video, communication signals, etc.). Their architectural design focuses on efficiency optimization:
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Harvard Architecture: Separate storage spaces for programs and data (dual buses) allow simultaneous reading of instructions and operating data, significantly enhancing throughput.
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Pipelining Technology: Instruction execution is broken down into multiple stages of parallel processing, such as fetching, decoding, and executing, similar to an assembly line, allowing multiple instructions to be completed in a single cycle.
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Hardware Multiplier-Accumulator (MAC): Dedicated circuits achieve “multiply-accumulate” operations in a single cycle, suitable for core algorithms like filtering and FFT.
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Multi-Address Generators and Parallelism: Support for parallel access to multiple data streams reduces memory access bottlenecks and enhances algorithm efficiency.
2. Classification and Technological Evolution
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Data Formats:
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Fixed-Point DSP: Low cost and power-efficient, suitable for embedded systems (e.g., ADI Blackfin series).
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Floating-Point DSP: High precision and large dynamic range, suitable for radar and medical imaging (e.g., ADI SHARC series).
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Application Orientation:
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General-Purpose: Highly programmable, adaptable to various scenarios (e.g., TI C6000 series).
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Specialized: Optimized for specific algorithms (e.g., FFT acceleration modules for communication basebands).
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Integration Trends: Modern DSPs are often integrated with MCUs, FPGAs, and other heterogeneous components to form SoCs (e.g., Xilinx Zynq), balancing control and computational power.
3. Application Scenarios and Design Considerations
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Typical Applications:
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Communication Systems: Beamforming and channel coding for 5G basebands (requiring high-throughput MAC units).
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Automotive Electronics: Control of new energy motors (e.g., the Inchip Electronics AVP32F335 chip for real-time torque calculation).
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Consumer Electronics: Noise reduction in smartphones, image processing (relying on low-power fixed-point DSPs).
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Key Selection Parameters:
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Computational Speed: Measured in MMAC/s (million multiply-accumulates per second), must match algorithm complexity.
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Memory and Peripherals: On-chip RAM capacity and the number of DMA channels affect real-time performance (e.g., multi-channel ADCs require high-speed data transfer).
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Power Consumption and Heat Dissipation: Automotive DSPs must pass AEC-Q100 certification to ensure stability in high-temperature environments.

4. Design Challenges and Solutions
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Thermal Management: 3D packaging (e.g., Through-Silicon Vias, TSV) enhances heat dissipation efficiency, preventing performance throttling.
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Signal Integrity: Redistribution Layer (RDL) optimization reduces parasitic effects, ensuring high-speed signal transmission.
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Testing and Validation: Daisy Chain testing method for real-time monitoring of packaging reliability and locating failure points.

5. Future Trends
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Heterogeneous Computing: Integration of DSPs with AI accelerators (e.g., NPUs) to support edge machine learning.
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Advanced Processes: Processes below 12nm improve energy efficiency to meet ultra-low power demands of IoT.
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Domestic Substitution: Domestic manufacturers breaking through technical barriers, gradually replacing imports.

Modern heterogeneous chips are akin to an “all-round team”, with DSPs handling core computations, MCUs managing peripherals, collaboratively completing system tasks.
*Disclaimer: This article is original content by the author. The views expressed are personal opinions of the author, and the reprint by Luko Verification is solely to convey a different perspective, not representing Luko Verification’s endorsement or support of the views. If there are any objections, please contact Luko Verification.