The chip manufacturing industry is undergoing unprecedented technological transformation and industrial restructuring. The latest trends for 2025 can be explored from the following six dimensions: 1. The competition in advanced process technology is intensifying, with 2nm mass production and 1.6nm layout running in parallel. Global semiconductor giants have entered the decisive stage of competition in 2nm process technology. TSMC plans to achieve mass production of 2nm technology (N2) in the second half of 2025, utilizing nanosheet transistor architecture, achieving a transistor density of 313 MTr/mm², with performance improvements of 10%-15% over 3nm and a power consumption reduction of 25%-30%. Its 2nm capacity has already been booked by companies like Apple and AMD, with the first iPhone 18 featuring a 2nm chip expected to launch in 2026. Intel, on the other hand, is surpassing with its 18A process (1.8nm), integrating back-side power delivery (PowerVia) and ribbon gate (RibbonFET) technology for the first time globally, outperforming TSMC’s N2 in performance, although with a slightly lower transistor density (238 MTr/mm²). Samsung has not officially announced the mass production timeline for 2nm, but its Exynos 2600 chip is planned for trial production in May, utilizing 2nm technology and set to be featured in the 2026 Galaxy S26 series. Additionally, Japan’s Rapidus is accelerating its efforts in the 2nm field, having received 2.5 trillion yen in government funding, with plans for mass production by 2027. 2. Chiplet technology is reconstructing the chip design paradigm, with advanced packaging becoming the key to performance breakthroughs. As Moore’s Law slows down, Chiplet technology has become a core path to enhance chip performance. Intel’s Ponte Vecchio integrates 100 billion transistors through 47 modules using EMIB and Foveros packaging, while AMD’s EPYC-MI300 provides 5TB/s bandwidth with 13 Chiplet modules. In 2025, Chipone will launch a Chiplet-based AR glasses chip, using SiP packaging to combine high-performance SoC with memory, helping edge AI devices overcome computing power bottlenecks. Samsung’s i-Cube 2.5D packaging technology reduces signal transmission distance by 90% through a silicon interposer, increasing bandwidth fivefold, with Google using it to boost the efficiency of training large models by 40%. Huawei, through its 14nm chip 3D stacking technology, achieves a TSV silicon via density of 10,000 per chip, with performance approaching that of 7nm. 3. The commercialization of third-generation semiconductor materials accelerates, with silicon carbide becoming the core of the new energy revolution. The applications of silicon carbide (SiC) and gallium nitride (GaN) in power devices continue to deepen. Tianyue Advanced will release a full range of 12-inch silicon carbide substrates in 2025, including high-purity semi-insulating, conductive n-type, and p-type, driving a 50% reduction in the cost of SiC devices. A silicon carbide chip can reduce carbon emissions by one ton over its entire lifecycle, improving the range of electric vehicles by 10% and increasing the efficiency of photovoltaic inverters by 50%. Domestic SiC production capacity is rapidly growing, with substrate, epitaxy, and chip capacities reaching 1.13 million pieces/year, 1.18 million pieces/year, and 1.44 million pieces/year respectively in 2023, with breakthroughs in 8-inch technology accelerating industrialization. In terms of gallium nitride, Haiwei Huaxin has established a 6-inch GaN production line to support 5G base stations and fast charging applications. 4. Green manufacturing and the energy revolution are reshaping the industrial ecosystem. The high energy consumption issues in chip manufacturing have prompted a green transformation. TSMC’s electricity consumption is expected to account for 12.5% of Taiwan’s total electricity sales by 2025, and it aims to reduce carbon emission intensity by 30% through solar power generation and carbon capture technology. Intel has deployed 100% renewable energy at its factory in Ireland, aiming for carbon neutrality across the entire industry chain by 2030. Third-generation semiconductor materials themselves have become tools for emission reduction, with silicon carbide devices in electric vehicles and photovoltaic applications potentially reducing global carbon emissions by 10%. Additionally, the EU’s Chip Act has invested 8.1 billion euros to support the research and development of environmentally friendly technologies, promoting a target of 20% domestic semiconductor production capacity by 2030. 5. Geopolitical factors drive supply chain restructuring, accelerating local manufacturing and technological independence. The US CHIPS Act is facing a policy shift in 2025, with the Trump administration proposing to abolish the act, leading to delays in subsidies for companies like Intel and hindering the construction of TSMC’s Arizona factory. Conversely, the EU is increasing its support, approving 227 million euros in subsidies to support AMS Osram in building a semiconductor backend factory in Austria, promoting local supply chain independence. China has made breakthroughs in key equipment, with domestically developed EUV lithography machines utilizing laser-induced discharge plasma (LDP) technology, planning trial production in the third quarter of 2025, with a yield target of 60%. 6. Quantum computing and the AI computing power revolution open up new battlefields. Quantum chips are on the brink of practical application. China’s “Zuchongzhi 3” superconducting quantum chip has achieved 105 qubit integration, with single/double qubit gate fidelity reaching 99.90% and 99.62%, processing random circuit sampling problems at speeds over a trillion times faster than classical computers. Google’s Willow quantum chip, utilizing surface code error correction technology, has a logical qubit error rate below the threshold, capable of completing a classical computing task that would take 10²⁵ years in just 5 minutes. The demand for AI computing power is driving innovations in chip architecture, with Chipone’s NPU IP embedded in 142 AI chips across 82 global customers, with cumulative shipments exceeding 100 million units, supporting large model deployment on the edge. Conclusion: The chip manufacturing landscape in 2025 exhibits six characteristics: “process miniaturization, architecture reconstruction, material iteration, green transformation, geopolitical competition, and quantum empowerment.” From 2nm processes to Chiplet packaging, from silicon carbide to quantum computing, technological breakthroughs and industrial transformations intertwine, driving the semiconductor industry into a new cycle of innovation. Companies must find a balance between technological research and development, supply chain security, and sustainable development to gain an advantage in this computing power revolution.