Chip Assembly Process

Source: Semiconductor Engineer

Original Author: Chip Failure Analysis

This article introduces the chip assembly process.

The chip assembly process is a crucial part of electronic product manufacturing. Chip assembly involves installing chips onto circuit boards, including steps like placement, soldering, and testing. Below, we will detail the specific process of chip assembly.

1. Placement: First, the raw chips are taken out by an automatic placement machine, and then they are automatically placed on the circuit board according to the design patterns and pad locations on the circuit board. This step requires high-precision machinery to ensure that each chip is accurately placed in the designated position.

2. Soldering: After placement, the chips need to be soldered to the circuit board. There are two common soldering methods: one is Surface Mount Technology (SMT), and the other is Through-Hole Technology (THT). SMT connects the chip pins to the pads using melted solder paste, suitable for small chips and high-density circuit boards; THT involves inserting the chip pins through holes into the pads and soldering, suitable for larger chips.

3. Testing: Once the chip assembly is complete, functional and reliability tests need to be conducted to ensure the normal operation and quality stability of the chip. Functional testing usually includes electrical testing, signal testing, and performance testing, verifying whether each function of the chip operates correctly. Reliability testing simulates the chip’s operation under different environmental conditions to check its reliability and lifespan during actual use.

In summary, the chip assembly process includes placement, soldering, and testing steps. These steps require high-precision equipment and strict operational procedures to ensure that the chips can be accurately installed onto the circuit boards and that their functions and reliability are validated through testing. Only through a rigorous chip assembly process can high-quality electronic products be produced.

END

This content is reprinted and only represents the author’s views.

It does not represent the position of the Semiconductor Institute of the Chinese Academy of Sciences.

Editor: Schrödinger’s Cat

Editor-in-Chief: Mu Xin

Submission Email: [email protected]

Previous Recommendations

1. The Semiconductor Institute has made progress in the research of bionic cover-type neuron models and learning methods.

2. The Semiconductor Institute has made significant progress in the research of inverted structure perovskite solar cells.

3. Why is copper used as the interconnect metal in chips?

4. What exactly is the 7nm in chips?

5. Silicon-based integrated optical quantum chip technology.

6. How anomalous is the quantum anomalous Hall effect? It may lead to the next revolution in information technology!