Automotive PMIC Research: Domestic Substitution Process Under Chip Shortage

Zuosi Automotive Research has released the 2023 Automotive Power Management Chip Industry Research Report.

Automotive power management chips (PMIC) are widely used in scenarios such as automotive intelligent cockpits, autonomous driving, body electronics, instrument and entertainment systems, lighting systems, and battery management systems (BMS). By product, PMIC can be mainly divided into AC/DC, DC/DC, LDO, driver chips, battery management ICs, etc.

PMIC Device Classification

Source: Zuosi Automotive Research, 2023 Automotive Power Management Chip Industry Research Report

There Is a Huge Supply Gap for Automotive AFE Chips, Strong Demand for Domestic Substitution

In the supply of automotive power management ICs, the gap is particularly large for AFE chips in the automotive battery management system (BMS). AFE (Analog Front End) chips are the core components of the BMS system, responsible for collecting voltage and temperature from the battery cells, estimating parameters such as SOC and SOH using specific algorithms, and sending the results to the control chip.

AFE Chip Working Principle

Source: Jiewahte

1) Demand Side for Automotive AFE Chips: Development from 400V Platform to 800V Platform, Doubling Demand for AFE Chips

Due to the impact of the endurance and charging efficiency of new energy vehicles, mainstream automotive companies are beginning to layout high-voltage platforms, with the transition from the current mainstream 400V platform to the 800V platform becoming a major trend. Therefore, to achieve higher voltage, it is almost necessary to connect proportionally more battery cells in series, which will significantly increase the demand for AFE chips. It is expected that the platform voltage will rise from 400V to 800V, doubling the demand for automotive-grade AFE chips.

Global Automotive AFE Chip Market Size Forecast

Source: Zuosi Automotive Research, 2023 Automotive Power Management Chip Industry Research Report

2) Supply Side for Automotive AFE Chips: Domestic Market Relies on Imports, Significant Market Gap, Urgent Need for Domestic Alternatives

Due to high technical barriers and stringent automotive certification requirements, domestic production of automotive-grade AFE chips is limited. Over 90% of AFE chips used in automotive power batteries still rely on imports, dominated by foreign analog chip giants such as TI, ADI, and Infineon. Domestic AFE chips in the automotive power battery field are still in the initial layout stage.

TI, as a mainstream supplier in the automotive-grade BMIC chip market, has seen its BQ series chip products fall into a shortage and price increase situation, with order delivery times extended to 2023, causing a significant market gap.

Due to the supply-demand gap for domestic automotive-grade AFE chips, domestic terminal manufacturers and lithium battery manufacturers have a strong demand for chip domestic substitution and are entering the power BMIC from different angles.

Domestic Layout of Automotive-grade AFE Chips

Source: Zuosi Automotive Research, 2023 Automotive Power Management Chip Industry Research Report

Chipways: Has made several core technological breakthroughs in the series of chips for the BMS system, including automotive-grade BMS AFE analog front-end sampling chips (ASIL C/D), automotive-grade BMS digital isolation communication interface chips, and automotive-grade 32-bit microcontroller MCU chips, and can provide complete software development tools in product development.

Chipways’ automotive-grade battery pack monitoring chip XL8806/XL8812 series products meet both AEC-Q100 automotive reliability standards and ISO 26262 ASIL-C automotive functional safety standards; they use LQFP 48 packaging and can operate in a temperature range of -40℃ to 125℃, supporting 4 to 12 battery cells in series with high-precision ΣΔ ADC, ±1.5mV measurement accuracy, supporting multiple chips in series, and supporting master-slave reversible bidirectional communication.

Automotive-grade battery pack monitoring chips XL8814/XL8816/XL8818 series products can meet AEC-Q100 automotive reliability standards and ISO 26262 ASIL-D automotive functional safety standards. The products further add more than 30 safety mechanisms, reaching ASIL D functional safety level, improving the number of monitoring series per chip while ensuring measurement accuracy, with a maximum support of 14/16/18 series battery connections, measurement time controlled within 120us, built-in balancing current maximum of 400mA, while functionally adding monitoring for Busbar, supporting sleep monitoring and reverse wake-up functions.

NXP Semiconductors: DNB1168 is an integrated voltage monitoring, temperature monitoring, and AC impedance monitoring BMS AFE chip that can support up to 250 chips in series, daisy chain communication, meets automotive-grade certification, and has passed ISO 26262:2018 ASIL-D certification. For example, for the thermal runaway issue that is difficult to control in power batteries, the DNB1168 solution uses the AC impedance monitoring function to achieve rapid detection of thermal runaway. Compared to traditional NTC (thermocouple) methods, the AC impedance monitoring function can provide a response capability that can be called seconds-level, greatly improving the safety threshold of power batteries and extending battery life.

The DNB1168 series automotive-grade AFE chips from NXP Semiconductors have three major application advantages: material savings, space savings, and faster, safer three-dimensional monitoring, applicable to various types of electric vehicles’ BMS systems, including BEV, EREV, PHEV, HEV, etc. Currently, DNB1168 can provide engineering samples and will be mass-produced in 2023.

NXP DNB1168 Chip Battery Monitoring Unit

Source: Electronic Engineering World

BYD Semiconductor: Launched the first generation of 16 cells in 2020, with an accuracy of ±2.5mV, meeting ISO 26262 functional safety standards and AEC-Q100 standard Grade 1 level automotive-grade AFE chip BF8X15A series products.

Automotive-grade DC/DC Chips Will Enter the Domestic Substitution Cycle

DC/DC chips are widely used in automotive electronics, suitable for applications such as automotive intelligent cockpits, charging piles, motor controllers, on-board chargers, and automotive lighting. Currently, domestic PMIC manufacturers have successively achieved mass production of automotive-grade products in categories such as LDO and DC/DC.

Domestic Layout of Automotive-grade DC/DC Chips

Source: Zuosi Automotive Research, 2023 Automotive Power Management Chip Industry Research Report

In the automotive on-board charging application field, Nanxin Semiconductor has launched the SC8101Q series automotive-grade 32V/5A synchronous buck converter and the automotive-grade buck-boost chip SC8701Q series, which can be applied to 60W wired fast charging and the ECU of the ADAS 360° surround view system to supply power to the Camera. In addition, it can also be applied to on-board wireless charging applications. Currently, it has been adopted by multiple Tier 1 manufacturers and appears in various models from brands such as BYD, SAIC General Motors, FAW Hongqi, Hyundai, and is about to be equipped in multiple overseas models.

Nanxin Semiconductor Automotive-grade SC8701Q Chip

Source: Charging Head Network

Domestic Wafer Fab BCD Process Breakthrough, “Chip Shortage Crisis” Accelerates the Domestic Substitution Process of Automotive PMIC

Power management chips do not pursue Moore’s Law in the manufacturing process, and have lower process requirements. Compared to other types of integrated circuits, PMIC is a relatively mature and stable sub-field. Currently, the mainstream production nodes for power management chips are mainly based on commonly used 8-inch production line processes ranging from 0.32μm to 90nm, mostly manufactured using the BCD (Bipolar-CMOS-DMOS) specialty process of wafer foundries, with a wide variety of product part numbers and highly fragmented market share.

In 2022, the automotive industry experienced a structural shortage of chips, among which the production capacity most severely affected was the power management IC capacity of mature processes above 8-inch 0.18um nodes. The production capacity of automotive power management chips is mainly controlled by IDM large manufacturers, including Texas Instruments, Infineon, ADI, STMicroelectronics, NXP, etc. Other chip design (Fabless model) companies need to obtain production capacity from wafer foundries.

Domestic wafer foundries such as SMIC, GigaDevice, Huahong Grace, and Jinghe Integrated Circuit can provide power management IC wafer foundry services, and are also accelerating the expansion of mature and specialty process production lines. In 2022, SMIC’s 55nm BCD process (high-voltage display driver platform) has completed platform development and introduced customers for mass production, playing an extremely important role in industrial control, smart vehicles, display drivers, and power management. Currently, the mainstream BCD processes globally are 180/130/90nm, with the industry’s top BCD technology level being 60nm.

Development Status of Domestic Wafer Foundry BCD Process Platforms

Source: Zuosi Automotive Research, 2023 Automotive Power Management Chip Industry Research Report

To respond to the rapidly growing demand in the automotive field and the insufficient capacity of automotive chips, wafer foundries such as TSMC and UMC have increased automotive chip capacity, and international IDM manufacturers have allocated automotive chip capacity while starting large-scale expansions.

Currently, the supply-demand situation of automotive-grade power management chips in some fields has improved, and some automotive chips have begun to lower prices, including LED driver ICs, motor driver ICs, PMICs, and some control ICs. However, the demand for automotive-grade products remains stable due to the transition from fuel vehicles to electric vehicles, preventing significant price fluctuations.

This “chip shortage crisis” has given domestic PMIC manufacturers more time to layout the automotive electronics field, achieve breakthroughs in domestic automotive-grade PMICs, and accelerate the substitution of domestic automotive-grade PMIC chips. At the same time, automakers also need to reassess their industrial layout strategies under special circumstances, especially the cross-regional production and transportation of components. The localization of the component supply chain may be more beneficial for the overall supply chain organization, and can also form a coordinated effect with local vehicle dealers. Once uncontrollable factors hinder normal vehicle sales, components will also be affected simultaneously. With a significant mismatch between supply and demand in the automotive PMIC market, opportunities have arisen for domestic PMIC manufacturers to enter the automotive industry supply chain.

Table of Contents for the 2023 Automotive Power Management Chip Industry Research Report

Report Pages: 280 pages

01

Overview of Automotive Power Management Chips

1.1 Overview of Analog Chips

1.1.1 Analog chips: divided into power management chips and signal chain chips

1.1.2 Global market competition pattern for analog chips

1.1.3 Global market size for analog chips

1.1.4 Competition pattern of the Chinese analog chip market: gradual emergence of domestic substitution

1.1.5 Market size of the Chinese analog chip market

1.1.6 Main factors accelerating the development of domestic analog chips

1.1.7 Revenue composition and comparison of domestic analog chip manufacturers

1.1.8 Applications of analog chips in automotive electronics

1.2 Automotive Power Management Chips

1.2.1 What is power management?

1.2.2 Classification of power management chips

1.2.3 Global competition pattern for power management chips

1.2.4 Evolution of domestic power management chip substitution paths

1.2.5 Some domestic power management chip manufacturers

1.2.6 Application scenarios of power management chips in automotive electronics

1.2.7 Automotive-grade power management chips have higher performance requirements

1.2.8 Mass production process of automotive-grade power management chips

1.2.9 Domestic power management IC companies accelerating entry into the vehicle supply chain

1.2.10 Intensive listing period for domestic power management IC companies

1.2.11 Business layout of domestic power management IC companies in the automotive sector

1.3 Relevant Policies and Certification Standards for Domestic Automotive-grade Chips

1.3.1 Current policy status and guidance for standardization of automotive chips in China

1.3.2 Interpretation of automotive-grade chip requirements

1.3.3 Certification standards for automotive-grade power management chips in China

1.3.4 Functional safety standards for automotive-grade power management chips – ISO26262

1.3.5 Certification testing standards for automotive-grade power management chips – AEC-Q100

1.3.6 Production testing of automotive-grade power management chips

1.4 Application Scenarios of Power Management Chips in Automobiles

1.4.1 Application scenarios of power management chips in automotive electronics

1.4.2 Application scenario one for on-board power management chips: Intelligent Cockpit

1.4.3 Application solutions for power management chip manufacturers in the intelligent cockpit

1.4.4 Intelligent cockpit PMIC application solution: Yutai Semiconductor assists Tesla’s on-board wireless microphone

1.4.5 Application scenario two for on-board power management chips: Motor Controller

1.4.6 Motor controller PMIC application solutions (1)

1.4.7 Motor controller PMIC application solutions (2)

1.4.8 Application scenario three for on-board power management chips: On-board Charger

1.4.9 Application scenario four for on-board power management chips: Domain Controller

1.4.10 Application solutions for power management chip manufacturers in the domain controller

1.4.11 Power management IC solutions for autonomous driving domain (1)

1.4.12 Power management IC solutions for autonomous driving domain (2)

1.4.13 Power management IC solutions for autonomous driving domain (3)

1.4.14 Power management IC solutions for autonomous driving domain (4)

1.4.15 Application scenario five for on-board power management chips: Tail Lights and Ambient Lights

1.4.16 Application solutions for power management chip manufacturers in automotive lighting

1.4.17 Automotive lighting power management IC solutions: Microchip automotive LED lighting solutions

1.4.18 Application scenario six for on-board power management chips: On-board Charger

1.4.19 Development history of on-board wired charging

1.4.20 Development history of on-board wireless charging

02

Automotive Power Management Chip Manufacturing Process

2.1 Automotive Power Management Chip Industry Operating Models

2.1.1 Development history of semiconductor industry production models

2.1.2 Power management chip production operating models

2.1.3 Domestic power management chips becoming IDM

2.1.4 Streamlining of IDM factories to Fab-lite models

2.1.5 Transition of IDM manufacturers to Fab-lite strategies (1)

2.1.6 Transition of IDM manufacturers to Fab-lite strategies (2)

2.1.7 Some Fabless companies layout Fab-lite

2.1.8 Virtual IDM models: possessing proprietary process technology and process platforms

2.1.9 Comparison of IDM, Fabless, and virtual IDM models

2.1.10 Development path of domestic power management chip manufacturers’ operating models

2.2 Manufacturing Steps of Automotive Power Management Chips

2.2.1 Manufacturing steps for automotive power management chips: chip design, wafer foundry, packaging testing

2.2.2 IC design of automotive power management chips

2.2.2.1 Development of domestic automotive-grade power management chip IC design industry

2.2.2.2 Development of domestic power management chip IC design industry: Most domestic companies are in small batch supply and R&D state

2.2.2.3 Comparison of foreign automotive power management chip manufacturers (1)

2.2.2.4 Comparison of foreign automotive power management chip manufacturers (2)

2.2.2.5 Comparison of domestic automotive power management chip manufacturers (1)

2.2.2.6 Comparison of domestic automotive power management chip manufacturers (2)

2.2.2.7 Automotive power management chip supply system: Upstream chip manufacturers’ bargaining power is increasing

2.2.2.8 Reconstruction of the domestic automotive PMIC chip industry chain: From “vehicle manufacturers leading” to “enterprises mastering key technology leading”

2.2.3 Automotive Power Management Chip Wafer Foundry

2.2.3.1 Eight major manufacturing processes for automotive power management chips

2.2.3.2 Evolution of the process platform for analog chips

2.2.3.3 Mainstream production processes for automotive power management chips: BCD process

2.2.3.4 Development direction of BCD process technology: high voltage, high power, high density

2.2.3.5 BCD process isolation technology

2.2.3.6 Current development status of global BCD process platforms (1): Wafer foundry BCD process evolution diagram

2.2.3.7 Current development status of global BCD process platforms (2): TSMC, UMC, etc. belong to the first tier of BCD processes in the wafer foundry field

2.2.3.8 Current development status of global BCD process platforms (3): Domestic wafer foundries achieve breakthroughs in 55nm BCD process

2.2.3.9 Development status of domestic wafer foundry BCD process platforms

2.2.3.10 Process nodes for automotive power management chips: mainstream based on 8-inch production lines 0.18-0.11μm mature processes

2.2.3.11 Automotive power management chip wafer foundry: 12-inch production lines are the future trend

2.2.3.12 Layout status of 12-inch production lines for power management chip manufacturers and foundries

2.2.3.13 Gross profit margin and net profit margin of major wafer foundries

2.2.4 Packaging Testing of Automotive Power Management Chips

2.2.4.1 Chip packaging testing process flow

2.2.4.2 Packaging types for power management chips: mainly BGA, QFP, SO, DIP

2.2.4.3 Layout of domestic power management IC companies in the packaging and testing field: Fabless + testing/packaging

03

Analysis of Automotive Power Management Chip Products (By Type)

3.1 Classification and Corresponding Functions of Power Management Chips

3.2 Market Size of Power Management Chips (By Type)

3.3 AC/DC Chips

3.3.1 AC/DC chips: structure and working principle

3.3.2 AC/DC chips: classified by isolation

3.3.3 Competition pattern of automotive-grade AC/DC chips

3.3.4 Applications of AC/DC in automotive electronics: charging piles

3.3.5 AC/DC chips: AC slow charging

3.3.6 AC/DC chips: DC fast charging

3.3.7 New energy vehicle charging piles

3.3.8 Downstream customer groups for new energy vehicle AC/DC converters

3.4 DC/DC Chips

3.4.1 DC/DC converters

3.4.2 Main application types of DC/DC converters in electric vehicles

3.4.3 Classification of DC/DC direct current conversion chips

3.4.4 Main matching modes for new energy vehicle DC/DC converters

3.4.5 Downstream customer groups for on-board DC/DC chips (1)

3.4.6 Downstream customer groups for on-board DC/DC chips (2)

3.4.7 Key performance indicators of DC/DC chips

3.4.8 How to select DC/DC chips

3.4.9 DC/DC chips: mainstream switching regulators Buck, Boost, Buck-Boost

3.4.10 Layout of domestic automotive power management DC/DC chip manufacturers (1)

3.4.11 Layout of domestic automotive power management DC/DC chip manufacturers (2)

3.4.12 DC/DC chips: LDO linear voltage regulators

3.4.13 Selection of automotive-grade LDO linear voltage regulators

3.4.14 Layout of domestic automotive LDO linear voltage chip manufacturers

3.5 Battery Management Chips (BMIC)

3.5.1 Battery management system (BMS)

3.5.2 Working principle of automotive BMS

3.5.3 Comparison of new energy vehicle BMS solutions

3.5.4 BMS architecture: BMS architecture evolving towards domain controllers

3.5.5 Structure of battery management chips (BMIC)

3.5.6 Battery management chips (BMIC)

3.5.7 Wired BMS chip solutions (1): Tesla BMS design

3.5.8 Wired BMS chip solutions (2): Tesla BMS design

3.5.9 Wired BMS chip solutions (3): Tesla BMS design

3.5.10 Wired BMS chip solutions (4): Summary

3.5.11 Wireless BMS chip solutions (1): General Motors wBMS

3.5.12 Wireless BMS chip solutions (2): General Motors wBMS

3.5.13 Wireless BMS chip solutions (3): LG Innotek plans to start mass production of wireless BMS in 2024

3.5.14 BMS power management IC solutions (1): PI’s 12V emergency power supply solution

3.5.15 BMS power management IC solutions (2)

3.5.16 BMS power management IC solutions (3)

3.5.17 SBC chip applications in BMS: Main functions of SBC chips

3.5.18 Advantages of SBC chip applications in BMS

3.5.19 Defect cases of SBC chip applications in BMS

3.5.20 AFE chips in BMIC: working principle

3.5.21 AFE chips in BMIC: Mainstream automotive companies’ layout of 800V high-voltage platform drives AFE chip demand growth

3.5.22 AFE chips in BMIC: Global market size and single vehicle ASP calculation

3.5.23 AFE chips in BMIC: Major foreign suppliers and product selection (1)

3.5.24 AFE chips in BMIC: Major foreign suppliers and product selection (2)

3.5.25 AFE chips in BMIC: Representative foreign automotive AFE chip products (1)

3.5.26 AFE chips in BMIC: Representative foreign automotive AFE chip products (2)

3.5.27 Development of domestic automotive BMIC: in the initial layout stage

3.5.28 Development of domestic automotive BMIC: Deployment and mass production cases of domestic automotive-grade BMIC manufacturers (1)

3.5.29 Development of domestic automotive BMIC: Deployment and mass production cases of domestic automotive-grade BMIC manufacturers (2)

3.5.30 AFE chip solutions: NXP Semiconductors (DNS) launches automotive-grade electric vehicle single-cell monitoring chip

3.5.31 AFE chip solutions (1)

3.5.32 AFE chip solutions (2)

3.5.33 Development of domestic automotive BMIC: Development bottlenecks faced by domestic automotive-grade BMIC

3.5.34 Domestic BMIC downstream customers: Top 10 companies in BMS installation in China

3.6 Driver Chips

3.6.1 Driver chips: classified by application field

3.6.2 Working principle of motor driver chips

3.6.3 Driver chips for motor driving: Types and applications of DC motors in automobiles

3.6.4 Main application scenarios for DC motors (1): Intelligent Chassis

3.6.5 Main application scenarios for DC motors (2): Body Control

3.6.6 Evolution of motor driving methods: Relay driving → Chip driving

3.6.7 Automotive-grade motor driver chips: Strong customer stickiness

3.6.8 Major downstream customers of automotive-grade motor driver chips (1)

3.6.9 Major downstream customers of automotive-grade motor driver chips (2)

3.6.10 Automotive-grade motor driver chips: Major foreign suppliers and product selection

3.6.11 Automotive-grade motor driver chips: Domestic development and major suppliers

3.6.12 Motor driver chip solution (1)

3.6.13 Motor driver chip solution (2)

04

Analysis of Key Issues in Automotive Power Management Chips

4.1 Supply Interruption and Chip Shortage Issues

4.1.1 Factors affecting the shortage and price increase of automotive power management chips: capacity squeeze, increased demand

4.1.2 Impact of chip shortages on the automotive industry: production cuts, price increases, extended delivery cycles

4.1.3 Capacity utilization during the “chip shortage”

4.1.4 Capacity utilization of major wafer foundries

4.1.5 Expansion under the “chip shortage”: New capacity to be gradually released in 2024

4.1.6 Wafer factory expansion and new production line status (1)

4.1.7 Wafer factory expansion and new production line status (2)

4.1.8 Wafer factory expansion and new production line status (3)

4.1.9 Capacity forecast: Global wafer capacity and growth rate forecast from 2021 to 2025

4.1.10 Limitations on wafer factory capacity expansion: silicon wafers, equipment

4.1.11 Under the supply interruption of power management chips: domestic manufacturers accelerate substitution

4.1.12 Future supply situation of automotive power management chips

4.2 Development Direction of Automotive-grade Power Management IC Technology

4.2.1 Technology one: High and low voltage circuit integration technology

4.2.2 Technology two: Ultra-low current burst mode technology

4.2.3 Technology three: High-brightness LED technology

4.2.4 Technology four: Low EMI (Electromagnetic Interference)

4.2.5 Methods to reduce EMI: Use of filters or reducing switching slew rate

4.2.6 Low EMI solutions: TI low EMI innovative solutions

05

Research on Foreign Automotive-grade Power Management Chip Suppliers

5.1 Texas Instruments

5.1.1 Introduction to Texas Instruments (TI)

5.1.2 TI’s layout of power management chips

5.1.3 TI’s layout of automotive-grade BMIC

5.1.4 TI’s capacity expansion: Accelerating deployment in automotive electronics

5.1.5 New breakthroughs in TI’s power management products in the low static power consumption field (1)

5.1.6 New breakthroughs in TI’s power management products in the low static power consumption field (2)

5.2 Infineon

5.2.1 Introduction to Infineon

5.2.2 Infineon’s global factory distribution

5.2.3 Infineon’s downstream customer distribution

5.2.4 Infineon’s BMS solutions: Highly integrated system solutions

5.2.5 Some new automotive-grade power management chip products from Infineon

5.3 ADI

5.3.1 Introduction to ADI

5.3.2 ADI’s layout in automotive power management chips

5.3.3 ADI’s automotive power management chip application scenario solutions

5.4 MPS

5.4.1 Introduction to MPS

5.4.2 MPS’s specialty process BCD Plus and packaging technology Mesh Connect

5.4.3 MPS’s development history

5.4.4 MPS’s automotive power management chip product tree

5.4.5 MPS’s layout of automotive-grade power management chips

5.4.6 Integration of MPS power management chips

5.5 STMicroelectronics

5.5.1 Introduction to STMicroelectronics

5.5.2 STMicroelectronics’ business layout

5.5.3 Core R&D technologies of STMicroelectronics

5.5.4 STMicroelectronics’ BCD process flowchart

5.5.5 STMicroelectronics’ automotive-grade power management IC products

5.5.6 STMicroelectronics’ product roadmap for automotive-grade linear voltage regulators

5.6 ON Semiconductor

5.6.1 Introduction to ON Semiconductor

5.6.2 Expansion path of ON Semiconductor: Layout of SiC devices in the electric drive field

5.6.3 ON Semiconductor’s layout in automotive electronics

5.6.4 Power packaging technology for ON Semiconductor’s main driving modules

5.6.5 Information on some new automotive-grade power management chip products from ON Semiconductor

5.7 Renesas

5.7.1 Introduction to Renesas

5.7.2 Renesas’ product layout in the automotive electronics field

5.7.3 Renesas’ automotive BMS product layout

5.7.4 Renesas launches an in-vehicle camera solution that meets ASIL B standards

06

Research on Domestic Automotive-grade Power Management Chip Suppliers

6.1 Jiewahte

6.1.1 Introduction to Jiewahte

6.1.2 Development history of Jiewahte’s products

6.1.3 Jiewahte’s virtual IDM operating model

6.1.4 Jiewahte’s three major process platforms

6.1.5 Iteration history of Jiewahte’s 7-55V low and medium voltage BCD process platform

6.1.6 Iteration history of Jiewahte’s 10-200V high voltage BCD process platform

6.1.7 Iteration history of Jiewahte’s 10-700V ultra-high voltage BCD process platform

6.1.8 Revenue share of Jiewahte’s various process platforms from 2019 to 2021

6.1.9 Overall product layout of Jiewahte’s power management chips

6.1.10 Jiewahte’s automotive power management chip application layout

6.1.11 Jiewahte’s automotive-grade chip development process

6.1.12 Jiewahte’s products through automotive-grade certification

6.1.13 Jiewahte’s automotive-grade DCDC chip product: JWQ5103

6.1.14 Average selling price of Jiewahte’s major products

6.1.15 Main application technologies of Jiewahte in automotive electronics

6.2 Xidi Microelectronics

6.2.1 Introduction to Xidi Microelectronics

6.2.2 Supply chain model of Xidi Microelectronics: Fabless model

6.2.3 Stable supply chain structure of Xidi Microelectronics

6.2.4 Gross margin of Xidi Microelectronics’ products

6.2.5 Major product line layout of Xidi Microelectronics’ power management chips

6.2.6 Xidi Microelectronics’ layout in automotive electronics

6.2.7 Power management application block diagram for automotive information entertainment systems by Xidi Microelectronics

6.2.8 On-board DC/DC conversion chip of Xidi Microelectronics: HL7509 FNQ

6.2.9 Proposed R&D projects for automotive power management by Xidi Microelectronics

6.3 Yachuang Electronics

6.3.1 Introduction to Yachuang Electronics

6.3.2 Supply chain model of Yachuang Electronics’ power management ICs

6.3.3 Layout of Yachuang Electronics’ automotive-grade power management IC products

6.4 Shengbang Microelectronics

6.4.1 Introduction to Shengbang Microelectronics

6.4.2 Product layout of Shengbang Microelectronics’ analog chips

6.4.3 Operating model of Shengbang Microelectronics

6.4.4 Production process of Shengbang’s major products

6.4.5 Shengbang Microelectronics power management chip products (1)

6.4.6 Shengbang Microelectronics power management chip products (2)

6.4.7 Automotive-grade voltage reference chip from Shengbang Microelectronics

6.5 Sirepu Technology

6.5.1 Introduction to Sirepu Technology

6.5.2 Supply chain model of Sirepu Technology: Fabless model

6.5.3 Layout of Sirepu Technology’s power management chips

6.5.4 Layout of Sirepu Technology’s automotive-grade products: First convert old products, then develop new products

6.5.5 Application of Sirepu automotive-grade products in the smallest basic systems

6.5.6 Application scenarios of Sirepu automotive PMIC solutions (1)

6.5.7 Application scenarios of Sirepu automotive power management chip solutions (2)

6.5.8 Automotive-grade power management chips from Sirepu Technology

6.6 Xinzhu Technology

6.6.1 Introduction to Xinzhu Technology

6.6.2 Four major product lines in Xinzhu Technology’s power management chip field

6.6.3 Layout of Xinzhu Technology’s automotive-grade power management chips

6.6.4 Application solutions for Xinzhu Technology’s power management IC products in automotive smart rearview mirrors

6.7 Silergy Corp

6.7.1 Introduction to Silergy Corp

6.7.2 Application scenarios of Silergy Corp automotive power management ICs (1)

6.7.3 Application scenarios of Silergy Corp automotive power management ICs (2)

6.7.4 Some automotive-grade power management chip products from Silergy Corp

6.7.5 Silergy Corp: Ultra-small PMIC automotive camera solutions

6.8 Aiwei Electronics

6.8.1 Introduction to Aiwei Electronics

6.8.2 Layout of Aiwei’s automotive electronics products

6.8.3 Production model of Aiwei’s power management ICs

6.8.4 Aiwei Electronics’ self-built three-temperature CP (Chip Prober Wafer Testing) production line

6.9 Yutai Semiconductor

6.9.1 Company introduction

6.9.2 Technology development and product evolution of Yutai Semiconductor

6.9.3 Operating model of Yutai Semiconductor: Fabless

6.9.4 Major product unit costs of Yutai Semiconductor

6.9.5 Layout of Yutai Semiconductor’s automotive-grade power management chip products

6.9.6 R&D projects for automotive electronic power management products

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Multi-Domain Computing and Regional Controllers	Autonomous Driving Simulation (Foreign)	OEM Information Security
Passenger Vehicle Chassis Domain Control	Autonomous Driving Simulation (Domestic)	Wireless Communication Modules
Domain Controller Ranking Analysis	Laser Radar – Domestic Edition	Automotive 5G Integration
E/E Architecture	Laser Radar – Foreign Edition	800V High Voltage Platform
L4 Autonomous Driving	Core Components of Laser Radar	Fuel Cells
L2/L2+ Autonomous Driving	Millimeter Wave Radar	Integrated Battery
Passenger Vehicle Camera Quarterly Report	Automotive Ultrasonic Radar	Integrated Die Casting
ADAS Data Annual Report	Radar Disassembly	Automotive Operating Systems
Joint Venture Brand Vehicle Networking	Ranking of Laser and Millimeter Wave Radar	Chassis Control
On-Board Information Service Systems and Entertainment Ecosystems	Autonomous Driving Heavy Trucks	Electric Control Suspension
Commercial Vehicle ADAS	Unmanned Shuttle	Steering Systems
Commercial Vehicle Smart Cockpit	Unmanned Delivery Vehicles	Brake-by-Wire Research
Commercial Vehicle Vehicle Networking	Unmanned Retail Vehicles	Charging and Swapping Infrastructure
Commercial Vehicle Smart Chassis	Agricultural Machinery Autonomous Driving	Automotive Motor Controllers
Automotive Intelligent Cockpit	Port Autonomous Driving	Hybrid Power Report
Intelligent Cockpit Tier 1	Modular Report	Automotive PCB Research
Cockpit Multi-Screen and Linked Screens	V2X and Vehicle Road Coordination	IGBT and SiC Research
Intelligent Cockpit Design	Roadside Intelligent Perception	Automotive Power Electronics
Instrument and Central Control Display	Roadside Edge Computing	Electric Drive and Power Domain
Smart Rearview Mirror	Automotive eCall System	Automotive Wiring Harness
Driving Recorder	Automotive EDR Research	Automotive Digital Key
Automotive UWB Research	Automotive Personalization	Automotive Sound Systems
HUD Industry Research	Vehicle Voice	Automotive Lighting
Human-Machine Interaction	Vehicle Antennas	Automotive Magnesium Alloy Die Casting
Vehicle DMS	TSP Manufacturers and Products	New Four Modernizations of Automotive Electronics
OTA Research	Autonomous Driving Regulations	New Forces in Vehicle Manufacturing – NIO
Automotive Cloud Service Research	Autonomous Driving Standards and Certification	NIO ET5/ET7 Intelligent Function Disassembly
Automotive Functional Safety	Intelligent Connected Testing Base	New Forces in Vehicle Manufacturing – XPeng
AUTOSAR Research	PBV and Automotive Robots	XPeng G9 Function Disassembly
Software Defined Vehicles	Flying Cars	New Forces in Vehicle Manufacturing – Li Auto
Software Suppliers	Integrated Driving and Parking Research	Li Auto L8/L9 Function Disassembly
Passenger Vehicle T-Box	Smart Parking Research	Autonomous Driving Chips
Commercial Vehicle T-Box	Automotive Shared Leasing	Chassis VCU Research
T-Box Ranking Analysis	Vehicle Enterprise Digital Transformation	Automotive MCU Research
Model Supplier Research	Vehicle Enterprises Digital Transformation	DJI Dual Vision and Tida Laser Radar Disassembly
NIO and Toyota Great Wall Vehicle Machine and Cockpit Domain Control Disassembly	Autonomous Driving Fusion Algorithms	Sensor Chips
Intelligent Surfaces	Automotive CIS Research

「Zuosi Research Monthly Report」

ADAS/Intelligent Vehicle Monthly Report | Automotive Cockpit Electronics Monthly Report | Automotive Vision and Radar Monthly Report | Battery, Motor, and Electric Control Monthly Report | On-board Information System Monthly Report | Passenger Vehicle ACC Data Monthly Report | Front View Data Monthly Report | HUD Monthly Report | AEB Monthly Report | APA Data Monthly Report | LKS Data Monthly Report | Front Radar Data Monthly Report