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As electronic products become more compact, the assembly of components on PCBA circuit boards is moving towards higher density, which poses significant challenges for SMT (Surface Mount Technology) and THT (Through-Hole Technology) production testing. The testing methods can be subdivided into: manual visual inspection, digital microscopes, SPI (Solder Paste Inspection) machines, AOI (Automated Optical Inspection) machines, SMT first article inspection machines, online flying probe tests (also known as ICT – In-Circuit Testing), functional testing (FCT), and automated X-ray inspection (X-ray or AXI). Below is a brief introduction to the main SMT testing technologies mentioned above.
I. 3D-SPI Solder Paste Inspection Machine
3D-SPI is a measurement system that accurately provides data on solder paste area, volume, height, and shape deviation. More importantly, it can be combined with process control software (SPC) to analyze data trends.
The 3D-SPI solder paste inspection machine uses optical principles to calculate the height of solder paste printed on the PCB board through triangulation methods. Its role is to detect and analyze the quality of solder paste printing, allowing users to monitor production issues in real-time, thus reducing defects caused by poor solder paste printing and providing strong quality control support to operators, enhancing process performance.
II. Manual Visual Inspection
Manual visual inspection involves using the human eye, with or without magnifying glasses, to visually examine the appearance of printed circuit boards and solder joints for quality issues such as missing components, incorrect components, reversed polarity, misalignment, and more.
III. Digital Microscope
A digital microscope converts the real image seen through the microscope into a digital format, displaying the magnified image on a computer screen. It allows for image saving, magnification, and printing. With measurement software, it can measure various data. It is suitable for inspection in the electronics manufacturing industry, detection of printed circuit boards, and inspection of soldering defects in printed circuit components.
IV. SMT First Article Inspection Machine
The first article inspection machine simplifies the first article check by automatically recording measurement data through intelligent integration of CAD coordinates, BOM lists, and first article PCB scan images. The system automatically matches LCR reading data to the corresponding locations and performs automatic judgment of test results, eliminating false positives and missed tests, and automatically generating test reports stored in the database.
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V. AOI Automated Optical Inspection Machine
AOI (Automated Optical Inspection) is a new type of technology that uses optical and digital imaging techniques, employing computer and software technology to analyze images for automatic inspection.
AOI equipment can generally be divided into online (in the production line) and offline types.
AOI inspection integrates computer technology, high-speed image processing and recognition technology, automatic control technology, precision machinery technology, and optical technology into a single inspection technology.
AOI automatically scans PCBs with cameras, collects images, and compares the tested solder joints with qualified parameters in the database. Through image processing, it checks for defects on the PCB: missing components, incorrect components, damaged components, solder balls, misalignment, standing components, reversed polarity, bridging, cold solder joints, lack of solder, excess solder, lifted components, IC pin lifting, and bent IC pins. Defects are displayed or marked on a monitor or automatic sign for maintenance personnel to correct.Automated inspection of PCBA circuit board EMS manufacturing is one of the important means for enterprises to achieve intelligent production and a trend in the wave of Industry 4.0.
In the past, 2D AOI was widely used before and after the reflow oven in SMT assembly processes to detect defects such as component misplacement, skew, and soldering issues. Its biggest limitation was the inability to detect defects like lifted components, solder bridging, and cold solder joints, resulting in low detection rates.
In today’s rapidly developing electronics manufacturing industry, 2D optical inspection can no longer meet the higher quality and efficiency requirements for inspection in SMT processes. 3D visual inspection has become a popular method for process inspection, gaining more attention from enterprises.
VI. X-Ray Inspection (X-ray or AXI)
Automatic X-ray inspection AXI (Automatic X-ray Inspection) uses X-rays, which can penetrate materials and exhibit attenuation characteristics within the material to detect defects, primarily internal defects in solder joints, such as BGA, CSP, and FC chip solder joint inspection.
X-ray inspection utilizes the strong penetrating power of X-rays to visualize the internal structure of the inspected solder joints, thus achieving detection and analysis of the welding quality of various commonly seen solder joints in electronic components.
X-ray inspection can fully reflect the welding quality of solder joints, including open circuits, short circuits, holes, internal bubbles, and insufficient solder. It also allows for quantitative analysis. The greatest feature of X-ray inspection is its ability to detect defects in solder joints beneath BGA packages, such as bridging, open circuits, solder ball loss, displacement, insufficient solder, voids, and blurred edges of solder balls and solder joints.
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VII. ICT Online Testing Machine
ICT online testing machine, ICT, In-Circuit Test, is a standard testing method that checks for production defects and faulty components by testing the electrical performance and electrical connections of online components. It uses a specialized bed of needles to contact the solder joints of components on the already soldered circuit board, conducting discrete isolation tests with hundreds of millivolts of voltage and currents under 10 milliamps, thus accurately measuring the leakage, misplacement, parameter value deviation, solder joint bridging, and short/open circuit faults of general and special components such as resistors, inductors, capacitors, diodes, thyristors, field-effect transistors, integrated circuits, etc.
ICT flying probe ICT and bed of needles ICT: Bed of needles ICT can simulate device functions and test the logic functions of digital devices, achieving high fault coverage, but requires the creation of specialized needle bed fixtures for each board, leading to long fixture production and program development cycles.
The PCBA flying probe tester is an improvement over the traditional bed of needles online testing machine. It uses probes instead of a bed of needles, equipped with 4-8 high-speed movable testing probes (flying probes) on an x-y mechanism, with a minimum testing gap of 0.2mm. The flying probe ICT mainly conducts static tests; its advantage is that it does not require fixture production, leading to shorter program development times, but its testing speed is relatively slower, which is its biggest disadvantage.
PCBA flying probe testers are widely used in computer servers, 5G communications, automotive electronics, medical devices, mobile phone board repairs, semiconductor probe cards, and Load Boards for electrical testing of open/short circuits, resistors, capacitors, diodes, transistors, FETs, and voltage regulators. It also supports IC, BGA, and power-on testing.
VIII. FCT Functional Testing
Functional testing (FCT: Functional Circuit Test) refers to a testing method that provides a simulated operational environment for the tested circuit boards, allowing them to operate in their designed state, thereby obtaining output to verify the functional status of the circuit boards. In simple terms, it involves connecting a specialized circuit board from an assembled electronic device to the appropriate circuit of that device and applying voltage. If the device operates normally, it indicates that the circuit board is qualified.
The above eight methods detail the use of a combination testing method in the highly complex testing of circuit boards, and the specific method to be used should be based on the specific conditions of the SMT production line and the assembly density of surface-mounted components.
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