TSMC

AMD’s New 2nm EPYC Processor Completes Tape-Out; TSMC Plans to Mass Produce Advanced Panel-Level Packaging by 2027; Five US Companies Sue Trump Administration

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AMD's New 2nm EPYC Processor Completes Tape-Out; TSMC Plans to Mass Produce Advanced Panel-Level Packaging by 2027; Five US Companies Sue Trump Administration

1. AMD’s new EPYC processor completes tape-out using TSMC’s 2nm process 2. TSMC plans to mass produce advanced panel-level packaging by 2027 3. Apple to analyze user data from devices to enhance AI technology 4. Reports indicate Taiwanese bidders are competing for AMD’s ZT server assets 5. Five US companies jointly sue the Trump administration … Read more

Why Did Apple’s A17 Pro Skip the Standard A17? The Reason is Revealed!

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Why Did Apple's A17 Pro Skip the Standard A17? The Reason is Revealed!

The recently released iPhone 15 Pro series is equipped with the new A17 Pro bionic chip. During the launch, many users wondered why the naming skipped directly from A16 to A17 Pro. The reason has now been revealed.According to industry insider @手机晶片达人, the A17 Pro uses the N3B process technology. Next year, it will switch … Read more

Huawei Kirin 1020 Exposed: TSMC 5nm Process to Deliver in August

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Huawei Kirin 1020 Exposed: TSMC 5nm Process to Deliver in August

Recently, industry insiders reported that TSMC will start mass production of 5nm chips in April, with initial capacity fully booked by customers. The major customers include Apple’s A14 (to be used in this fall’s new iPhone) and HiSilicon’s new generation Kirin processors (for Huawei’s flagship devices). Now there are some new updates regarding Kirin. According … Read more

Semiconductor Revolution: First Mass Production of 7nm Process! Huawei Kirin Stabilized

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Semiconductor Revolution: First Mass Production of 7nm Process! Huawei Kirin Stabilized

Taiwan Semiconductor Manufacturing Company (TSMC) has officially announced that it has begun mass production of the 7nm N7+ process. This marks TSMC’s first, and the industry’s first, mass production using EUV (Extreme Ultraviolet) lithography technology, which is of great significance and puts it ahead of Intel and Samsung by a significant margin. TSMC stated that … Read more

Historic Opportunities for Domestic Semiconductors: Huawei’s Supply Chain

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Historic Opportunities for Domestic Semiconductors: Huawei's Supply Chain

Source: CITIC Securities Research Department, Electronic Industry Research Group. Original title: “[CITIC Electronics] Commentary on the Upgrade of US Restrictions on Huawei,” with edits. Abstract: CITIC Electronics believes that Huawei has achieved significant self-research in chip design, but the manufacturing stage remains a major bottleneck. Domestic semiconductors will be forced to grow rapidly, especially in … Read more

Daily Embedded News: Successful Tape-Out of Loongson 2K3000 Processor; Intel and TSMC Joint Venture Progress; Samsung Electronics Q1 Profit Decline Pressures Chip Business

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Daily Embedded News: Successful Tape-Out of Loongson 2K3000 Processor; Intel and TSMC Joint Venture Progress; Samsung Electronics Q1 Profit Decline Pressures Chip Business

Industry Highlights ICVIEWS+ Successful Tape-Out of Loongson 2K3000 (3B6000M) ProcessorRecently, Loongson Technology announced the successful tape-out of the Loongson 2K3000 (3B6000M) processor. The Loongson 2K3000 (3B6000M) has completed preliminary functionality and performance assessments, with all indicators meeting expectations. The Loongson 2K3000 and Loongson 3B6000M are different packaging versions based on the same silicon wafer, targeting … Read more

The World’s First 3nm Chip is Here! Not TSMC, Sparking a Stir in the Tech Community – How Difficult is High-End Semiconductor Chip Production?

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The World's First 3nm Chip is Here! Not TSMC, Sparking a Stir in the Tech Community - How Difficult is High-End Semiconductor Chip Production?

The world’s first 3nm chip has been born, surprisingly not led by TSMC, sparking heated discussions in the tech community. Will TSMC’s dominant position in technology face its final chapter? According to relevant media reports, Samsung’s fully wrapped gate 3nm chip has officially debuted. As the first company to break the industry’s technological ceiling, Samsung … Read more

The Chip Production Capacity Conflict: A Ticking Time Bomb

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The Chip Production Capacity Conflict: A Ticking Time Bomb

👆If you wish to meet often, feel free to star 🌟 and bookmark it! Source: Content from the Economic Daily, thank you. The market went wild yesterday (6th) with rumors that the Trump administration has initiated a “humanitarian corridor” for tariffs, releasing key provisions of the exemption clause “9903.01.34”. Products with over 20% U.S. value … Read more

The U.S. Pressures Chip Giants: 70% of Their Lifeline in the Hands of Tsinghua University? TSMC and Samsung Bow Down, Raimondo Looks Green!

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The U.S. Pressures Chip Giants: 70% of Their Lifeline in the Hands of Tsinghua University? TSMC and Samsung Bow Down, Raimondo Looks Green!

Today, we must discuss this matter thoroughly! It’s not a new issue, but the nauseating feeling can be sensed through the screen! TSMC and Samsung have once again started to pledge loyalty to their “American daddy”!How do they show loyalty? By throwing money! A lot of money! TSMC is even more ruthless, increasing its investment … Read more

TSMC’s Move to the U.S.: A Major Shift in the Chip Industry and Seeking Favor with America

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TSMC's Move to the U.S.: A Major Shift in the Chip Industry and Seeking Favor with America

1. TSMC’s “Americanization”: From Technology Transfer to Mass Migration Recently, TSMC announced an additional investment of $100 billion in the United States, combined with a previous plan of $65 billion, bringing the total to $165 billion, setting a record for the largest foreign investment in U.S. history. This substantial amount will be used to build … Read more