process innovation

Technological Evolution of Electronic Chemicals for PCB Manufacturing

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Technological Evolution of Electronic Chemicals for PCB Manufacturing

Technical Coupling of PCB Manufacturing Processes and Electronic Chemicals 1. Process Differentiation between Reduction Method and Semi-Addition Method In the reduction method process, blackening/browning treatment enhances interlayer adhesion by forming a nanoscale oxide layer (thickness about 0.5-1μm). After using a modified browning solution, a certain 8-layer PCB achieved an interlayer peel strength of 1.8N/mm; the … Read more

Technical Evolution and Application Analysis of Copper Damascene Process in the Semiconductor Field

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Technical Evolution and Application Analysis of Copper Damascene Process in the Semiconductor Field

1. Technical Background and Evolutionary Drivers In semiconductor manufacturing, interconnect technology is a key factor determining chip performance. Early aluminum interconnects could not meet the requirements for processes below 0.18 microns due to high resistivity (2.82 μΩ·cm) and electromigration issues. Copper, with its lower resistivity (1.68 μΩ·cm) and significantly stronger resistance to electromigration (over 10 … Read more