Technical Evolution and Application Analysis of Copper Damascene Process in the Semiconductor Field
1. Technical Background and Evolutionary Drivers In semiconductor manufacturing, interconnect technology is a key factor determining chip performance. Early aluminum interconnects could not meet the requirements for processes below 0.18 microns due to high resistivity (2.82 μΩ·cm) and electromigration issues. Copper, with its lower resistivity (1.68 μΩ·cm) and significantly stronger resistance to electromigration (over 10 … Read more