Core Technology Guide for PCB Prepreg Materials: Parameter Characteristics, Material Classification, and Selection Methods

Core Technology Guide for PCB Prepreg Materials: Parameter Characteristics, Material Classification, and Selection Methods

PCB prepreg, short for “pre-impregnated,” is a dielectric material composed of glass fiber and resin, providing the necessary insulation properties and serving as a bonding material. It is an essential material in PCB manufacturing, typically sandwiched between two core materials or between a core material and copper foil. This article will delve into the characteristics, … Read more

PCB Process: Lamination

PCB Process: Lamination

Continuing from the previous article, the material combination of the stacked boards is sent into the laminator through the reflow line, thus entering the lamination process. Basic Knowledge The lamination process involves stacking copper foil, prepreg (PP), and the inner layer substrate with pre-made patterns in a specific order, and bonding them into a single … Read more