PCB Process: Lamination

PCB Process: Lamination

Continuing from the previous article, the material combination of the stacked boards is sent into the laminator through the reflow line, thus entering the lamination process. Basic Knowledge The lamination process involves stacking copper foil, prepreg (PP), and the inner layer substrate with pre-made patterns in a specific order, and bonding them into a single … Read more

A Comprehensive Guide to Underfill Materials for Circuit Boards: Key Insights from Selection to Application

A Comprehensive Guide to Underfill Materials for Circuit Boards: Key Insights from Selection to Application

In the field of electronic device manufacturing, underfill materials play a crucial role in enhancing the reliability of electronic components. Today, we will delve into the knowledge regarding the selection and application of underfill materials as outlined in the IPC J-STD-030A standard. The Importance and Types of Underfill Materials As electronic products continue to evolve … Read more