The ‘Suspended’ IMC: A Reliability Warning Not to Be Ignored in PCBA Solder Joints
In the reliability assessment of printed circuit board assembly (PCBA), the microstructure of solder joints, particularly the intermetallic compound (IMC) layer, is crucial for determining long-term performance. The IMC layer, as a product of the metallurgical bonding between solder and pad, directly affects the mechanical strength and electrical connection stability of the solder joint. Under … Read more
