3D Heterogeneous Integration

Microrobots Featured by Nature Electronics Editor!

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Microrobots Featured by Nature Electronics Editor!

Dr. Katharina Zeissler, editor of the prestigious international journal Nature Electronics, highlights: Published in Nature Electronics (2025, Vol. 8, Page 879) Sub-millimeter robots with autonomous capabilities show great potential in environmental monitoring and biomedical applications. However, these robots need to possess multiple functions, including perception, motion control, and wireless communication with other robots. Due to … Read more

Advanced Packaging Technology Upgrade for HarmonyOS Device Drivers: Technical Breakthroughs and Market Opportunities from Changjiang Electronics Technology and Tongfu Microelectronics

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Advanced Packaging Technology Upgrade for HarmonyOS Device Drivers: Technical Breakthroughs and Market Opportunities from Changjiang Electronics Technology and Tongfu Microelectronics 1. Detailed Technical Breakthroughs: Chiplet Packaging Leading Domestic Substitution 1. Changjiang Electronics Technology: XDFOI Chiplet Technology Achieves 3D Stacking and High Yield – Technical Parameters and Process Advantages: The XDFOI Chiplet series process from Changjiang … Read more

The Unsung Heroes of Electronics and Semiconductor Manufacturing: Unveiling Four Key Precision Devices

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The Unsung Heroes of Electronics and Semiconductor Manufacturing: Unveiling Four Key Precision Devices

Behind the modern electronics and semiconductor industry lies a multitude of high-precision, high-speed manufacturing equipment that supports the birth of chips and circuit boards. These devices not only determine the performance and reliability of electronic products but also serve as the key driving force behind the advancement of Moore’s Law and heterogeneous integration technology. This … Read more

Breakthrough in Key Technologies: Brain-like Complementary Vision Chip

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Breakthrough in Key Technologies: Brain-like Complementary Vision Chip

Follow “Youzhiliao” for valuable insights! 1. Introduction to Brain-like Complementary Vision Chip Core Definition: The brain-like complementary vision chip is a new type of sensor designed inspired by biological visual systems. It breaks through the limitations of traditional CMOS image sensors’ “frames” and adopts an “event-driven” working mechanism. Its core innovation lies in the fusion … Read more

In-Depth Analysis of System-in-Package (SiP) Technology

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In-Depth Analysis of System-in-Package (SiP) Technology

System-in-Package (SiP) is an advanced integrated circuit packaging technology. Its core idea is to integrate multiple semiconductor chips (Die) with different functions and passive components (such as resistors, capacitors, inductors, filters, antennas, etc.) within the same package, thereby forming a complete or nearly complete system or subsystem. In simple terms, SiP achieves system integration at … Read more

Hangshun Achieves 1mm² MCU with 3D Heterogeneous Integration!

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Hangshun Achieves 1mm² MCU with 3D Heterogeneous Integration!

At the Shenzhen International Electronics Show and Embedded Exhibition that opened this week, the local MCU company “Hangshun” showcased the mass-produced1mm² M0 core HK32F005 chip, which is even smaller thanTexas Instruments (TI)’s so-called“world’s smallest MCU” released in June this year, which has a size of 1.38mm². This ultra-small MCU has shocked many industry players! How … Read more