Why Do SPI and Other Signal Outputs Require a 22 or 33 Ohm Resistor?

When a microcontroller or FPGA sends SPI control signals to a phase-locked loop (PLL) chip, it often requires a series connection of a 22 ohm or 33 ohm resistor. What is the reasoning behind this? Impedance discontinuities can cause electromagnetic wave reflections, which in turn can lead to signal distortion. Therefore, impedance matching is often … Read more

Overview of SD NAND vs SPI NAND

SD NAND and SPI NAND are like the “sports car” and “bicycle” of the storage world—each has its own applicable scenarios. 1. Interface Method SD NAND: Like the SD card in a mobile phone, it uses a high-speed parallel interface (for example, transferring data with 4 data lines simultaneously), which is fast and comes with … Read more

The Relationship Between SPI Mold Polishing Grades and 3D Mold Polishing Grades

The following diagram shows the SPI standard mold polishing grade table, from which the polishing grades A~D in the mold industry originate. The A-grade claimed by 3D mold manufacturers also comes from here. There are four columns: ~ The first column is the grade code ~ The second column is the abrasive, tool, and polishing … Read more

Comparison of SPI, DSPI, and QSPI Technologies

Click the aboveblue text to follow us In embedded systems, the Serial Peripheral Interface (SPI) and its extensions (such as DSPI and QSPI) are widely used for high-speed communication with external devices (such as sensors, memory, LCD controllers, etc.). The main differences are as follows: 1 SPI SPI (Serial Peripheral Interface) is a full-duplex synchronous … Read more

The Future Trends of Sensors!

Introduction INTRODUCTION Bringing the intelligent world back to its roots, sensors are waiting here. The foundation of intelligence is perception, and sensors are the gateway to perception. Sensors are evolving towards intelligence, cognition, analysis, and diagnostics. As an increasingly evident intelligent microsystem, sensors are becoming more independent and capable of self-correction. So, what capabilities will … Read more

PolyU Scientists Invent Near-Sensor and In-Sensor Computing Technologies for More Agile and Robust Edge Computing | Interview

When it comes to edge computing, you might find it somewhat obscure, but you are certainly familiar with octopuses. An octopus is an invertebrate animal filled with neurons, but only 40% of its neurons are in its brain, while the remaining 60% are in its eight arms (tentacles). This means that the octopus has “multiple … Read more

A Brief History of the Development of Embedded Devices and Microcomputers

Did you know? The smartphones, smartwatches, washing machines, and even cars we use every day all contain an “invisible brain”—the embedded system. The microcomputers that allow developers to easily create various smart gadgets are quietly changing the world. This all began over 60 years ago. In the 1960s, the prototype of embedded systems appeared in … Read more

Y5T177 DSP: Understanding Digital Signal Processing

DSP Digital Signal Processing, or 数字信号处理. In 1971, Intel released a microcontroller, also known as a microprocessor, which can be programmed to issue commands to data. These commands operate on the numerical calculations and movements within registers, such as adding or subtracting two numbers, or incrementing a number a thousand times, which is equivalent to … Read more

Cutting-Edge Technology: A 9 cm, 25 g Miniature Wireless Amphibious Robot!

  The actuator is a device with controllable deformation capabilities and is considered the “heart” of miniature robots. A research team from Tsinghua University has recently developed a film-like miniature actuator that allows miniature robots to achieve continuous shape changes and “lock” specific action forms, enhancing their adaptability to various environments. The researchers stated that using … Read more

Assistance with 1.4nm Chip Flexible Substrate Technology

1.4nm ChipFlexible Substrate 1. SiO₂ nanoparticle doping rate (5-20wt%) 2. Nanocellulose diameter (10-15nm) 3. Metal oxide layer thickness (0.5-2nm) 4. Organic-inorganic hybrid interface density (10³/cm²) Micro composition (10 items) 5. Ultra-thin silicon layer lattice defect density (<10⁵/cm²) 6. Flexible polymer chain orientation (>80%) 7. Nanowire conductive network porosity (5-30%) 8. Stress buffer layer Young’s modulus … Read more