Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and Gases

1. Thermal Conductivity of Common Materials

Material Category

Grade

Thermal Conductivity (W/m·K)

Titanium Alloys

TA1

6-10

TC4

6-10

TA15

6-10

Iron-based Alloys

18Ni300

10-15

420

16-20

304L/304

16-20

316L

16-20

17-4PH

10-15

High-Temperature Alloys

GH3536

6-15

GH4169

6-15

GH3625

6-15

Aluminum Alloys

A1Si10Mg

110-130

6061

150-200

Pure Metals

Pure Ni

90-100

Pure Cu

400

2. Thermal Conductivity of Metal Powders at Room Temperature and Pressure (Comparison of Different Protective Gases and Powder Bed Thermal Conductivity)

Powder Type

Argon

Nitrogen

Helium

Inconel 718

0.085

0.092

0.210

17-4 Stainless Steel

0.102

0.115

0.240

Inconel 625

0.078

0.088

0.195

Ti-6Al-4V

0.095

0.105

0.225

316L Stainless Steel

0.110

0.125

0.250

Data Source: 2018 AM Magazine “Thermal conductivity of metal powders for powder bed additive manufacturing”, highly cited.

3. Thermal Conductivity of Pure Gases at Room Temperature and Pressure

Gas

Thermal Conductivity (W/m·K)

Molecular Weight (g/mol)

Physical Properties

Helium (He)

0.1502

4.00

Monatomic gas, shortest mean free path

Nitrogen (N₂)

0.0255

28.01

Diatomic gas, high thermal adaptation coefficient

Argon (Ar)

0.0176

39.95

Monatomic gas, high density and low thermal conductivity

Air

0.0260

28.97

Mixture gas (mainly N₂/O₂)

4. Extended Thoughts on Thermal Conductivity in Engineering Practice

4.1 Understanding Heat Dissipation During the Printing Process

The thermal conductivity of the powder bed at room temperature and pressure is approximately 0.1 watts per meter Kelvin. This is equivalent to insulating materials, so the heat dissipation of printed parts in the powder bed is minimal and can only dissipate through the solid support that metallurgically bonds with the substrate.

If printing is done suspended above the powder bed without support underneath, the heat cannot escape, leading to overheating, redness, and warping of the printed structure.

Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and Gases

4.2 Understanding Heat Dissipation Direction and Columnar Crystals

The LPBF model, which dissipates heat downwards through support structures, has a strong directional characteristic. It cannot be said to be completely equivalent to directional solidification, but the transfer of thermal energy is indeed similar to directional solidification. This is why LPBF printed products generally have a columnar crystal structure, which resembles the polycrystalline blades of directional solidification.

The following image is a graphic abstract of research work on anisotropic tension-compression asymmetry in SLM 316L stainless steel published in 2023 by Dr. Wang Zhanfeng, Associate Professor at the School of Mechanical and Electrical Engineering, Suqian College, in the International Journal of Mechanical Sciences (highly cited).

The upper left image shows a 3D structure of columnar crystals printed in SLM 316L;

The lower left image is a theoretical model of the columnar crystal structure of 316L, which is very intuitive for ordinary readers to understand the columnar crystal structure of SLM printed 316L.

Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and Gases

The following image shows the crystal structure models and physical images of three typical high-temperature alloy blades, from left to right: cast equiaxed crystal blade, directionally solidified columnar crystal blade, single crystal blade.

Isn’t the model of the directionally solidified columnar crystal blade very similar to the columnar crystal model of SLM printed 316L?

Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and GasesUnderstanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and Gases

4.3 About the Water Cooling of the Substrate in SLM Equipment

Some friends may ask, if heat is dissipated downwards through the substrate, will the lifting axis of the equipment get too hot? After all, the lifting axis is supporting the substrate. If it gets too hot, will the equipment be able to handle it? This is not a problem because there is a water cooling structure in the base of the substrate. The water cooling unit outside the SLM equipment, in addition to cooling the laser and galvanometer, mainly provides cooling water circulation to the base of the substrate, removing the internal heat of the parts during the printing process and cooling the parts.

Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and GasesUnderstanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and GasesEND

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Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and Gases

Understanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and GasesUnderstanding Thermal Conductivity in Metal 3D Printing: Common Materials, Powder Bed, and GasesPrevious RecommendationsRECOMMENDShandong University and New National Institute jointly published in the top journal “IJP”: Research on the Room Temperature to High Temperature Anisotropic Mechanism of Additive Manufacturing High-Temperature AlloysBeihang University top journal “JMA”: Synergistic Optimization of Efficiency-Microstructure-Performance in Arc Additive Manufacturing of AZ31 Magnesium Alloy

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