1. Thermal Conductivity of Common Materials
|
Material Category |
Grade |
Thermal Conductivity (W/m·K) |
|---|---|---|
|
Titanium Alloys |
TA1 |
6-10 |
|
TC4 |
6-10 |
|
|
TA15 |
6-10 |
|
|
Iron-based Alloys |
18Ni300 |
10-15 |
|
420 |
16-20 |
|
|
304L/304 |
16-20 |
|
|
316L |
16-20 |
|
|
17-4PH |
10-15 |
|
|
High-Temperature Alloys |
GH3536 |
6-15 |
|
GH4169 |
6-15 |
|
|
GH3625 |
6-15 |
|
|
Aluminum Alloys |
A1Si10Mg |
110-130 |
|
6061 |
150-200 |
|
|
Pure Metals |
Pure Ni |
90-100 |
|
Pure Cu |
400 |
2. Thermal Conductivity of Metal Powders at Room Temperature and Pressure (Comparison of Different Protective Gases and Powder Bed Thermal Conductivity)
|
Powder Type |
Argon |
Nitrogen |
Helium |
|---|---|---|---|
|
Inconel 718 |
0.085 |
0.092 |
0.210 |
|
17-4 Stainless Steel |
0.102 |
0.115 |
0.240 |
|
Inconel 625 |
0.078 |
0.088 |
0.195 |
|
Ti-6Al-4V |
0.095 |
0.105 |
0.225 |
|
316L Stainless Steel |
0.110 |
0.125 |
0.250 |
Data Source: 2018 AM Magazine “Thermal conductivity of metal powders for powder bed additive manufacturing”, highly cited.
3. Thermal Conductivity of Pure Gases at Room Temperature and Pressure
|
Gas |
Thermal Conductivity (W/m·K) |
Molecular Weight (g/mol) |
Physical Properties |
|---|---|---|---|
|
Helium (He) |
0.1502 |
4.00 |
Monatomic gas, shortest mean free path |
|
Nitrogen (N₂) |
0.0255 |
28.01 |
Diatomic gas, high thermal adaptation coefficient |
|
Argon (Ar) |
0.0176 |
39.95 |
Monatomic gas, high density and low thermal conductivity |
|
Air |
0.0260 |
28.97 |
Mixture gas (mainly N₂/O₂) |
4. Extended Thoughts on Thermal Conductivity in Engineering Practice
4.1 Understanding Heat Dissipation During the Printing Process
The thermal conductivity of the powder bed at room temperature and pressure is approximately 0.1 watts per meter Kelvin. This is equivalent to insulating materials, so the heat dissipation of printed parts in the powder bed is minimal and can only dissipate through the solid support that metallurgically bonds with the substrate.
If printing is done suspended above the powder bed without support underneath, the heat cannot escape, leading to overheating, redness, and warping of the printed structure.

4.2 Understanding Heat Dissipation Direction and Columnar Crystals
The LPBF model, which dissipates heat downwards through support structures, has a strong directional characteristic. It cannot be said to be completely equivalent to directional solidification, but the transfer of thermal energy is indeed similar to directional solidification. This is why LPBF printed products generally have a columnar crystal structure, which resembles the polycrystalline blades of directional solidification.
The following image is a graphic abstract of research work on anisotropic tension-compression asymmetry in SLM 316L stainless steel published in 2023 by Dr. Wang Zhanfeng, Associate Professor at the School of Mechanical and Electrical Engineering, Suqian College, in the International Journal of Mechanical Sciences (highly cited).
The upper left image shows a 3D structure of columnar crystals printed in SLM 316L;
The lower left image is a theoretical model of the columnar crystal structure of 316L, which is very intuitive for ordinary readers to understand the columnar crystal structure of SLM printed 316L.

The following image shows the crystal structure models and physical images of three typical high-temperature alloy blades, from left to right: cast equiaxed crystal blade, directionally solidified columnar crystal blade, single crystal blade.
Isn’t the model of the directionally solidified columnar crystal blade very similar to the columnar crystal model of SLM printed 316L?


4.3 About the Water Cooling of the Substrate in SLM Equipment
Some friends may ask, if heat is dissipated downwards through the substrate, will the lifting axis of the equipment get too hot? After all, the lifting axis is supporting the substrate. If it gets too hot, will the equipment be able to handle it? This is not a problem because there is a water cooling structure in the base of the substrate. The water cooling unit outside the SLM equipment, in addition to cooling the laser and galvanometer, mainly provides cooling water circulation to the base of the substrate, removing the internal heat of the parts during the printing process and cooling the parts.

END
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