The rise of advanced packaging technology is driving an explosion in demand for packaging equipment, with the global market expected to reach nearly 40 billion yuan by 2025. The acceleration of the localization process has attracted attention. Currently, the market is dominated by international giants such as ASMPT and Besi, while domestic manufacturers are breaking through: North Huachuang’s packaging etching equipment has passed validation by industry leaders; Plaxion’s intelligent CoWoS-level TCB equipment achieves a precision of ±1μm, exceeding international standards by 25%; Huazhuo Jingke has overcome bottlenecks in HBM packaging equipment; and companies like Naike Equipment, Xinyuan Micro, and Tuojing Technology are also demonstrating advantages in their respective fields. Policies and the demand for domestic alternatives provide opportunities for enterprises, but challenges remain in terms of technological stability and iteration speed. It remains to be seen which potential companies, such as North Huachuang and Plaxion, will become leaders based on their comprehensive performance in technology and market dynamics.