The position of Chinese companies in the global semiconductor supply chain is continuously rising. As a leading chip design company, Qualcomm has maintained close cooperation with several Chinese technology enterprises over the years, jointly promoting the development of key areas such as packaging testing, module manufacturing, and RF technology. Among them, JCET, ASE Group, and Sinomax Communication, as Qualcomm’s important partners, have demonstrated strong technical capabilities and market competitiveness in their respective fields.
JCET: Leading Packaging and Testing Company Enters 10nm Advanced Process
As the largest packaging and testing company in China and the third largest globally, JCET’s business scope covers the entire range of integrated circuit packaging and testing fields. Its customer base includes many high-end chip companies both domestically and internationally, including Qualcomm and MediaTek. In recent years, JCET has continuously increased its investment in advanced process research and development. Its subsidiary, JCET-Semiconductor, has initiated the certification process for ultra-high-density bump processing of Qualcomm’s 10nm chip wafers, becoming the first company in China to enter the 10nm mid-range wafer manufacturing field. This progress marks a significant breakthrough for China in semiconductor mid-process technology, laying the foundation for the subsequent research and development of more advanced processes such as 5nm and 3nm.
ASE Group: Global Leader in SIP Packaging Technology, Partnering with Qualcomm to Expand International Markets
ASE Group is a leading enterprise in the global System-in-Package (SIP) technology, with its wireless communication modules maintaining a leading market share globally, consistently holding around 50% market share across its entire product range. In January 2018, ASE Group signed a joint venture agreement with Qualcomm’s wholly-owned subsidiary to establish a factory in Brazil, focusing on the research and development and manufacturing of SIP module products. This collaboration not only deepens the synergy in advanced packaging innovation between the two parties but also helps Qualcomm enhance its supply chain layout globally, especially in emerging markets. Leveraging the industrial chain support from its parent company, ASE Group also possesses strong capabilities in cutting-edge areas such as wafer-level packaging and micro-electromechanical packaging.
Sinomax Communication: Continuous Breakthroughs in RF Technology, Steady Revenue Growth
As an important partner of Qualcomm in the field of antennas and RF transmission, Sinomax Communication has long focused on the research and development and manufacturing of mobile terminal antennas and base station RF components. The latest financial report shows that in the second quarter of 2025, the company’s operating revenue reached 1.96 billion yuan, a year-on-year increase of 3.82%; gross profit was 350 million yuan, with a stable gross margin of 17.85%. Notably, its net profit excluding non-recurring items saw a significant year-on-year increase of 84.28%, reaching 63.44 million yuan, reflecting the company’s significant achievements in cost control and product structure optimization. With the advancement of 5G-A network commercialization and the expansion of millimeter-wave technology applications, Sinomax Communication’s participation in Qualcomm’s technology roadmap is expected to further increase.
Conclusion
In the context of the accelerated process of semiconductor localization, JCET, ASE Group, and Sinomax Communication, leveraging their technical accumulation in packaging, modules, and RF fields, are continuously deepening their cooperation with international leading companies like Qualcomm. This not only promotes the improvement of China’s semiconductor supply chain but also provides important support for the efficient collaboration of the global chip industry. In the future, as emerging fields such as artificial intelligence and the Internet of Things continue to raise performance requirements for chips, related companies are expected to welcome broader development space in technological iteration and market expansion.